JPH03280439A - Packaging of electronic component - Google Patents
Packaging of electronic componentInfo
- Publication number
- JPH03280439A JPH03280439A JP2079895A JP7989590A JPH03280439A JP H03280439 A JPH03280439 A JP H03280439A JP 2079895 A JP2079895 A JP 2079895A JP 7989590 A JP7989590 A JP 7989590A JP H03280439 A JPH03280439 A JP H03280439A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- electronic component
- foil
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 21
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000011888 foil Substances 0.000 abstract description 7
- 239000004593 Epoxy Substances 0.000 abstract description 5
- 238000009503 electrostatic coating Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 6
- 239000003985 ceramic capacitor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は電子部品の外装方法に関し、特に高耐湿性を要
求される電子部品の外装方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for packaging electronic components, and particularly to a method for packaging electronic components that require high moisture resistance.
［従来の技術］
従来、この種の外装方法としては、液状樹脂をデツプ成
形や鋳込み成形する方法、半固形樹脂をモールド成形す
る方法、粉末状樹脂を付着硬化させて成形する方法があ
った。すなわち、従来は、樹脂のみて外装しており、耐
湿改善対策としては、性質の異なる樹脂を多層形成した
り、外装厚を厚くしたり、樹脂材料に無機物フィラーを
混入したりしていた。また、樹脂以外の材料では、例え
ば金属ケース等で完全封止していた。[Prior Art] Conventionally, as this type of packaging method, there have been methods of deep molding or cast molding of liquid resin, methods of molding semi-solid resin, and methods of molding by adhering and curing powdered resin. That is, in the past, the exterior was made only of resin, and measures to improve moisture resistance included forming multiple layers of resins with different properties, increasing the thickness of the exterior, and mixing inorganic fillers into the resin material. In addition, materials other than resin have been completely sealed with, for example, a metal case.
［発明が解決しようとする諜２ｆｌ］
」二連した従来の電子部品の外装方法では、樹脂材料を
使用する以上、水分の浸透は防ぐことができず、樹脂外
装で耐湿性を保持するという観点からはいかなる方法も
大きな効果は得られなかった。[Intelligence to be Solved by the Invention 2fl] In the two conventional packaging methods for electronic components, as long as a resin material is used, it is impossible to prevent moisture from penetrating. No significant effect was obtained with any method.
一方、金属ケース等で完全封止する場合、形状および製
造コストが非常に大きなものとなってしまうという欠点
がある。On the other hand, when completely sealed with a metal case or the like, there is a drawback that the shape and manufacturing cost become extremely large.
［課題を解決するための手段］
本発明の電子部品の外装方法は、電子部品表面に熱硬化
性樹脂を付着させ、加熱溶融して仮硬化させる工程と、
この仮硬化させた樹脂の上に金属層を形成する工程と、
この金属層をほぼ覆うように熱硬化性樹脂を付着させ、
加熱して完全硬化させる工程を有している。[Means for Solving the Problems] The method for packaging electronic components of the present invention includes the steps of attaching a thermosetting resin to the surface of the electronic component and temporarily curing it by heating and melting it.
A step of forming a metal layer on this temporarily hardened resin,
A thermosetting resin is attached to almost cover this metal layer,
It has a process of heating and completely curing.
［作 用］
外装材料である樹脂内部に金属層を形成しているため、
この金属により水分の浸透が遮断でき、高耐湿性でかつ
小形で安価な電子部品の外装方法が得られる。[Function] Since a metal layer is formed inside the resin, which is the exterior material,
This metal can block the penetration of moisture, providing a method for packaging electronic components that is highly moisture resistant, compact, and inexpensive.
第４図は、６５℃で相対湿度が９０〜９５％の雰囲気で
、積層圧電アクチュエータ素子に直流電圧１５０Ｖを印
加した時の不良の発生具合を示したものである。図中Ａ
は、従来の樹脂外装品、ＢはＡの外装圧に対して５倍厚
くした樹脂外装品、Ｃは本発明の外装方法でＡと同じ厚
みに形成した発明品である。樹脂材料としては王者とも
同じエポキシ系樹脂を用いた。どうすかられかるように
本発明品は、１０００時間経過しても不良は発生しなか
った。FIG. 4 shows how defects occur when a DC voltage of 150 V is applied to the laminated piezoelectric actuator element in an atmosphere of 65° C. and relative humidity of 90 to 95%. A in the diagram
1 is a conventional resin-clad product, B is a resin-clad product made five times thicker than the exterior pressure of A, and C is an invented product formed to the same thickness as A using the exterior packaging method of the present invention. As the resin material, we used the same epoxy resin as the champion. As can be seen, the product of the present invention did not show any defects even after 1000 hours.
［実施例］
次に、本発明の実施例について図面を参照して説明する
。[Example] Next, an example of the present invention will be described with reference to the drawings.
第１図（＾） 、 （Ｂ） 、 （Ｃ）は本発明の電
子部品の外装方法の一実施例を示す積層圧電アクチュエ
ータ素子の外観図、第２図は積層セラミックコンデンサ
と積層圧電アクチュエータ素子の基本構造を示す縦断面
図である。Figures 1 (^), (B), and (C) are external views of a multilayer piezoelectric actuator element showing an example of the packaging method for electronic components of the present invention, and Figure 2 is an external view of a multilayer ceramic capacitor and a multilayer piezoelectric actuator element. FIG. 3 is a vertical cross-sectional view showing the basic structure.
ここで、来電歪効果素子は、積層セラミックコンデンサ
の製造技術を応用した工法で製造されるが、積層セラミ
ックコンデンサの構造と基本的に異なる点がある。即ち
、積層セラミックコンデンサは、第２図（Ａ）に示すよ
うに、内部型Ｖｉｆを交互にコンデンサの両側面に露出
させることによって、２つの外部電極２で各々−層おき
に内部電極１と電気的に接続させ、パラレル接続をとっ
ている。Here, the current strain effect element is manufactured by a method that applies the manufacturing technology of multilayer ceramic capacitors, but there are some points in which the structure is fundamentally different from that of multilayer ceramic capacitors. That is, as shown in FIG. 2(A), in the multilayer ceramic capacitor, the internal type Vif is exposed alternately on both sides of the capacitor, so that the two external electrodes 2 are electrically connected to the internal electrode 1 every other layer. A parallel connection is established.
方、本積層圧電アクチュエータ素子の場合、第２図（Ｂ
）のように、内部電極１を全面に露出させて形成し、素
子の両側面に交互に一層おきに絶縁物３を形成して、そ
の上から外部電極２を形成してパラレル接続としている
。この理由は積層圧電アクチュエータ素子の場合、電圧
印加によって内部型７４１間に、電極面に垂直方向に歪
と力が発生するため、第２図（Ａ）のような構造である
と、内部電極１が形成されていない圧電不活性領域１１
に力のアンバランスが生じ、縁り返し電圧印加によって
割れたり、クラックが生じたりする。また、発生歪や発
生応力も押えられて、エネルギー効率も悪くなったりす
る。このため、積層圧電アクチュエータ素子の場合は、
第２図（Ｂ）のような構造が一般的である。On the other hand, in the case of this laminated piezoelectric actuator element, Fig. 2 (B
), internal electrodes 1 are formed to be exposed on the entire surface, insulators 3 are alternately formed on both sides of the element every other layer, and external electrodes 2 are formed on top of the insulators 3 for parallel connection. The reason for this is that in the case of a laminated piezoelectric actuator element, strain and force are generated between the internal molds 741 in a direction perpendicular to the electrode surface due to voltage application. Piezoelectric inactive region 11 in which no
An unbalance of force occurs, and the application of reverse voltage causes breakage or cracks. Furthermore, the strain and stress generated are suppressed, resulting in poor energy efficiency. Therefore, in the case of a laminated piezoelectric actuator element,
A structure as shown in FIG. 2(B) is common.
このようにして得られた積層圧電アクチュエータ素子に
、第１図（＾）のように静電塗装装置によって軟化温度
が６０〜９０℃のエポキシ系の粉末状樹脂を、素子両側
面を除くほぼ全面にコーティングして、これを完全硬化
する前の状態に加熱（約１５０℃、５〜ｌＯ分間）させ
て仮硬化した樹脂膜４を形成する。次に、第１図（Ｂ）
のように樹脂膜４の上に、銅箔、アルミ箔、ニッケル箔
、すず箔、鉄箔、ステンレス箔等のフィルム状金属５を
巻き付ける。この時、フィルムの両端５ａ、５ｂはオー
バーラツプさせておく必要がある。最後に、第１図（Ｃ
）のように、フィルム状金属５をほぼ全面覆うように再
度、エポキシ系粉末状樹脂を静電塗装装置によってコー
ティングした後、加熱（１５０℃、６０〜１２０分間）
して樹脂膜４を含めて完全硬化させて樹脂膜６を形成し
て仕上げる。As shown in Figure 1 (^), an epoxy powder resin with a softening temperature of 60 to 90°C is applied to almost the entire surface of the laminated piezoelectric actuator element obtained in this way, except for both sides of the element, using an electrostatic coating device. The resin film 4 is temporarily cured by coating the resin film and heating it (approximately 150° C., for 5 to 10 minutes) to a state before being completely cured. Next, Figure 1 (B)
A film-like metal 5 such as copper foil, aluminum foil, nickel foil, tin foil, iron foil, or stainless steel foil is wrapped around the resin film 4 as shown in FIG. At this time, both ends 5a and 5b of the film must overlap. Finally, in Figure 1 (C
), coat the film metal 5 with epoxy powder resin again using an electrostatic coating device so as to cover almost the entire surface, and then heat (150° C., 60 to 120 minutes).
The resin film 4 is then completely cured to form a resin film 6 for finishing.
第３図は本発明の外装方法による積層圧電アクチュエー
タ素子の縦断面図である。図に示すようにフィルム状金
属５が樹脂膜４および６の内部に層状に形成された仕上
りとなる。FIG. 3 is a longitudinal sectional view of a laminated piezoelectric actuator element according to the packaging method of the present invention. As shown in the figure, the finish is such that the film metal 5 is formed in layers inside the resin films 4 and 6.
次に、本発明の第２の実施例について説明する。Next, a second embodiment of the present invention will be described.
同様に、積層圧電アクチュエータ素子を予め、１５０〜
１８０℃に加熱しておき、その素子上に軟化温度が６０
〜９０℃のエポキシ系の粉末状樹脂を流動浸漬塗装した
後、はぼ室温以下に戻す。次に、前述のフィルム状金属
を巻き付けた後、再び１５０〜１８０℃に加熱して再度
流動浸漬塗装して、１５０℃で６０〜１２０分間加熱し
、完全硬化させ、高耐湿性の積層圧電アクチュエータ素
子を得る。Similarly, the laminated piezoelectric actuator element was prepared in advance from 150 to
It is heated to 180℃, and the softening temperature is 60℃ on the element.
After fluidized dip coating with epoxy powder resin at ~90°C, the temperature is returned to below room temperature. Next, after wrapping the above-mentioned film-like metal, it is heated again to 150 to 180 degrees Celsius, fluidized dip coating is applied again, and heated at 150 degrees Celsius for 60 to 120 minutes to completely cure it, creating a highly moisture-resistant laminated piezoelectric actuator. Get the element.
［発明の効果］
以上説明したように本発明は、外装材料である樹脂内部
に金属層を形成することにより、樹脂内部に金属が層状
に重なり合った仕上りとなるため、耐湿性の高い電子部
品が得られる効果があり、また、形状も大きくならず、
製造コストもほぼ従来の樹脂外装並に安価で済む効果が
ある。[Effects of the Invention] As explained above, the present invention forms a metal layer inside the resin that is the exterior material, resulting in a finish in which the metal is layered inside the resin. It has the desired effect, and the shape is not large.
The manufacturing cost is also almost as low as that of conventional resin exteriors.
第１図（Ａ） 、 （Ｂ） 、 （Ｃ）は本発明の電子
部品の外装方法の一実施例を示す積層圧電アクチュエー
タ素子の外観図、第２図は積層セラミックコンデンサと
積層圧電アクチュエータ素子の基本構造を示す縦断面図
、第３図は本発明の外装を施した積層圧電アクチュエー
タ素子の縦断面図、ｉ４図は、従来の樹脂外装および本
発明による外装を施した積層圧電アクチュエータ素子の
耐湿試験の結果を示す図である。
１・・・内部電極、
１１・・・圧電不活性領域、
２・・・外部電極、
３・・・絶縁物。
４・・・樹脂膜、
５・・・フィルム状金属、
５ａ、５ｂ−−−フィルム状金属端、
６・・・樹脂膜。Figures 1 (A), (B), and (C) are external views of a multilayer piezoelectric actuator element showing an example of the packaging method for electronic components of the present invention, and Figure 2 is an external view of a multilayer ceramic capacitor and a multilayer piezoelectric actuator element. Fig. 3 is a vertical cross-sectional view showing the basic structure of the laminated piezoelectric actuator element with the exterior of the present invention; Figure i4 is the moisture resistance of the laminated piezoelectric actuator element with the conventional resin exterior and the exterior of the present invention. It is a figure showing the result of a test. DESCRIPTION OF SYMBOLS 1... Internal electrode, 11... Piezoelectric inactive area, 2... External electrode, 3... Insulator. 4...Resin film, 5...Film-like metal, 5a, 5b---Film-like metal end, 6...Resin film.
Claims (1)
して仮硬化させる工程と、この仮硬化させた樹脂の上に
金属層を形成する工程と、この金属層をほぼ覆うように
熱硬化性樹脂を付着させ、加熱して完全硬化させる工程
を有する、電子部品の外装方法。1. A process of attaching a thermosetting resin to the surface of an electronic component and temporarily curing it by heating and melting it, a process of forming a metal layer on this temporarily hardened resin, and a process of applying a thermosetting resin to almost cover this metal layer. A method for packaging electronic components that includes the steps of attaching a resin and completely curing it by heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2079895A JPH03280439A (en) | 1990-03-28 | 1990-03-28 | Packaging of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2079895A JPH03280439A (en) | 1990-03-28 | 1990-03-28 | Packaging of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03280439A true JPH03280439A (en) | 1991-12-11 |
Family
ID=13703013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2079895A Pending JPH03280439A (en) | 1990-03-28 | 1990-03-28 | Packaging of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03280439A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023090668A (en) * | 2021-12-17 | 2023-06-29 | 上緯新材料科技股▲フン▼有限公司 | Highly flame-retardant laminated composite material and method for preparing the same |
-
1990
- 1990-03-28 JP JP2079895A patent/JPH03280439A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023090668A (en) * | 2021-12-17 | 2023-06-29 | 上緯新材料科技股▲フン▼有限公司 | Highly flame-retardant laminated composite material and method for preparing the same |
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