JPH03275571A - Method for firing green sheets in piled state - Google Patents
Method for firing green sheets in piled stateInfo
- Publication number
- JPH03275571A JPH03275571A JP2076476A JP7647690A JPH03275571A JP H03275571 A JPH03275571 A JP H03275571A JP 2076476 A JP2076476 A JP 2076476A JP 7647690 A JP7647690 A JP 7647690A JP H03275571 A JPH03275571 A JP H03275571A
- Authority
- JP
- Japan
- Prior art keywords
- firing
- green sheets
- fired
- furnace
- green
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010304 firing Methods 0.000 title claims abstract description 93
- 238000000034 method Methods 0.000 title claims description 52
- 239000000919 ceramic Substances 0.000 abstract description 29
- 239000000758 substrate Substances 0.000 abstract description 27
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はグリーンシートの多段焼成り法に係り、特に複
数のグリーンシートを積み重ねた状態で焼成処理を行う
グリーンシートの多段焼成方法に圓する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a multi-stage firing method for green sheets, and particularly relates to a multi-stage firing method for green sheets in which a plurality of green sheets are fired in a stacked state. .
一般に、半導体素子を搭載する回路基板としてセラミッ
ク基板が広く用いられている。セラミック基板は耐熱性
、放熱性、電気特性、機械的強度等の面で良好な特性を
ｈしている。このセラミック基板はグリーンシートを焼
成することにより製造される。Generally, ceramic substrates are widely used as circuit boards on which semiconductor elements are mounted. Ceramic substrates have good properties in terms of heat resistance, heat dissipation, electrical properties, mechanical strength, etc. This ceramic substrate is manufactured by firing a green sheet.
また、昨今では、半導体素子の高集積化がｔＡ速に行わ
れており、これに伴いセラミック基板に対する要求も高
度化してきている。Furthermore, in recent years, semiconductor devices have been highly integrated at a speed of tA, and the requirements for ceramic substrates have also become more sophisticated.
そこで、高精度で高い信頼性を有するセラミック基板を
製造しつる境域方法が望まれている。Therefore, there is a need for a method for manufacturing ceramic substrates with high precision and high reliability.
ラミック基板の些産効率を高めるために、複数のグリー
ンシーｉ−を多段に積み重ねて焼成処理を行う多段焼成
法が一般に行われている。In order to increase the production efficiency of lamic substrates, a multistage firing method is generally used in which a plurality of Green Sea i-s are stacked in multiple stages and fired.
従来に４３けるグリーンシートの多段焼成方法を第２図
に示づ。同図において、１〜４はグリーンシートであり
、各グリーンシート１〜４はダミー板６〜８を身方に挟
んで焼成治具５１に積み重ねられている。このグリーン
シート１〜４が積み重ねられた焼成治具５は焼成炉９内
に入れられ、この炉内を通過する間にグリーンシート１
〜４４；を焼成されてセラミック基板が製造される。A conventional multi-stage firing method for green sheets is shown in FIG. In the figure, green sheets 1 to 4 are stacked on a baking jig 51 with dummy plates 6 to 8 sandwiched therebetween. The firing jig 5 in which the green sheets 1 to 4 are stacked is placed in a firing furnace 9, and while passing through the furnace, the green sheets 1 to 4 are piled up.
~44; is fired to produce a ceramic substrate.
（従来の技術）
従来より、セラミック基板の製３＆７Ｊｔｌｉとしてグ
リーンシート法、印刷法、厚膜エツチング法、めっき・
エツチング法等が知られており、この各製造方法はセラ
ミック基板の種類や特性に応じて適宜選定されている。(Conventional technology) Conventionally, 3&7Jtli methods for manufacturing ceramic substrates include green sheet method, printing method, thick film etching method, plating method, etc.
Etching methods and the like are known, and each manufacturing method is appropriately selected depending on the type and characteristics of the ceramic substrate.
しかるに、どの製造方法においてもグリーンシートを焼
成する■稈は必ず有している。また、ヒ〔発明が解決し
ようとする課題〕
グリーンシート１〜４は、焼成処理されることにより約
１７％も縮み、この収縮は温度が高い稈大きい。また、
焼成炉９内の温度の〃１は均一ではなく、上方はど温度
ｕＩＳ＜下方はど温度が低い特性を一般に有している。However, in any manufacturing method, there is always a culm for firing the green sheet. [Problem to be Solved by the Invention] The green sheets 1 to 4 shrink by about 17% by being subjected to the firing process, and this shrinkage is greater when the temperature is higher. Also,
The temperature inside the firing furnace 9 is not uniform, and generally has the characteristic that the upper temperature uIS is lower than the lower temperature.
このため、上記のように単に複数のグリーンシート１〜
４が相み重ねられた焼成治具５を焼成炉９内に流し込み
焼成ＩＩＪｊＩ！を行りた場合、焼成炉９内の上記温度
分布差に起因して各グリーンシート１〜４の収縮度に差
がりじてしまう。これにより焼成後に第３図に示すよう
に、焼成されたセラミック基板１８〜４ａに反りが牛じ
てしまうという課題があった（最大で５００μｍ程度）
。For this reason, as mentioned above, simply multiple green sheets 1 to
Pour the firing jig 5 in which 4 are stacked on top of each other into the firing furnace 9 and bake IIJjI! If this is done, the degree of shrinkage of each of the green sheets 1 to 4 will be different due to the temperature distribution difference in the firing furnace 9. As a result, there was a problem in that the fired ceramic substrates 18 to 4a were warped (up to about 500 μm) as shown in FIG. 3 after firing.
.
焼成処理されたセラミック基板１８〜４ａは、その後基
板表面にｓｍで表面層を形成するために表面１１１１Ｍ
！！加工が施されるが、セラミック単板１ａ〜４ａに上
記の反りが発生していた場合、この表面研磨を行うこと
が出来ず、焼成されたセラミック基板１ａ〜４ａは不良
品となってしまうため、歩留りが悪化してしまう。The fired ceramic substrates 18 to 4a are then heated to a surface 1111M in order to form a surface layer by sm on the substrate surface.
! ! Processing is performed, but if the above-mentioned warpage occurs in the ceramic veneers 1a to 4a, this surface polishing cannot be performed and the fired ceramic substrates 1a to 4a will become defective products. , the yield will deteriorate.
また、セラミック基板１ａ〜４ａが板厚が厚く、かつＷ
４騎セラミック基板であった場合には、ｒＡｓを行なう
と胴間が表面に現われ各層に形成されたバイル（ＶＩＡ
：孔）が別々に表面に出るため高精度の表面層が作成で
きなくなってしまう。Moreover, the ceramic substrates 1a to 4a are thick and W
In the case of a four-layer ceramic substrate, when rAs is performed, the torso appears on the surface and the vias (VIA) formed in each layer appear on the surface.
: pores) appear on the surface separately, making it impossible to create a high-precision surface layer.
本発明は上記の点に鑑みてなされたものであり、高精度
でかつ信頼性の高いセラミック基板をｖＪ″Ｉｔｉしつ
るグリーンシートの多段焼成方法を提供することを目的
とする。。The present invention has been made in view of the above points, and it is an object of the present invention to provide a multi-stage firing method for green sheets in which highly accurate and reliable ceramic substrates are assembled.
上記課題を解決するために、本発明り法では、複数のグ
リーンシーＩ・を多段に積み重ねて焼成処理を行うグリ
ーンシー・トの多段焼成７１法において、
一１記グリーンシートの焼成処理を２回に分ｉノ、１回
目の焼成処理終了後、上記多段に積み重ねられたグリー
ンシートを」−下反転させ、続いてこの反転させたグリ
ーンシートに対し２回目の焼成１１１理を行うことをｖ
１徴とづるものである。In order to solve the above problems, in the method of the present invention, in the method 71 for multi-stage firing of green sheets in which a plurality of green sheets I are stacked in multiple stages and fired, After the first firing process is completed, the green sheets stacked in multiple stages are turned upside down, and then the second firing process is performed on the inverted green sheets.
It is spelled as 1 symptom.
上記のグリーンシートの多段焼成７Ｊ法にＪ、れば、１
回目の焼成処理の終了後にグリーンシートを上下反転さ
せ２回目の焼成５１！１％を行うため、■下で温度分布
差のある焼成炉であっても積み重ねられた各グリーンシ
ートに均一に焼成熱を印加することができる。J to the multistage firing 7J method of the above green sheet, then 1
After the first firing process, the green sheets are turned upside down and the second firing is performed at 51!1%, so even if the firing furnace has a difference in temperature distribution, the firing heat is uniformly applied to each stacked green sheet. can be applied.
このため、焼成されたセラミック基板１８〜４ａに生ず
る縮みも均一化し、反りの発生を防止することができる
。Therefore, the shrinkage that occurs in the fired ceramic substrates 18 to 4a is made uniform, and the occurrence of warpage can be prevented.
次に本発明の実績例について図面と共に説明する。第１
図Ｕ本発明の一実施例であるグリーンシートの多段焼成
方法を示す工程図である。Next, practical examples of the present invention will be explained with reference to the drawings. 1st
Figure U is a process diagram showing a multi-stage firing method for green sheets, which is an embodiment of the present invention.
グリーンシート１〜４を焼成するには、先ず第１図（Ａ
）に示されるように焼成治具５十にグリーンシート１〜
４を多段に積み重ねる。この際、隣接する各グリーンシ
ート間にはダミー板６〜８を介装する。このダミー板６
〜８は焼成処理中に各グリーンシート１〜４同十が焼結
するのを防止するために設けられるものである。また、
各グリーンシート１〜４は例えば銅ペーストパターンが
形成された薄いグリーンシートを複数枚１１１ｆｆｉＬ
、た積層グリーンシートである。To fire the green sheets 1 to 4, first, as shown in Fig. 1 (A
) As shown in Fig. 5, green sheets 1~
Stack 4 in multiple layers. At this time, dummy plates 6 to 8 are interposed between adjacent green sheets. This dummy board 6
8 are provided to prevent each green sheet 1 to 4 from being sintered during the firing process. Also,
Each green sheet 1 to 4 is a plurality of 111ffiL thin green sheets on which a copper paste pattern is formed, for example.
, is a laminated green sheet.
焼成治具５に各グリーンシート１〜４が取り付けられる
と、焼成治具５は焼成炉９に送り込まれる。焼成炉９は
第１閃（Ｂ）に示されるように、第１焼成炉１０と第２
焼成炉１１とにより構成されており、焼成治具５は１ン
ベヤー１２に搬送されて先ず第１の焼成炉１０内に進入
し、続いて第２の焼成炉１１にｌ入する。After each of the green sheets 1 to 4 is attached to the baking jig 5, the baking jig 5 is sent into the baking furnace 9. The firing furnace 9 has a first firing furnace 10 and a second firing furnace 10, as shown in the first picture (B).
The firing jig 5 is conveyed to a conveyor 12, first enters the first firing furnace 10, and then enters the second firing furnace 11.
第１焼成炉１０で行われる１１１焼成凱理は、主に積層
された各グリーンシート躬に形成されている銅ペースト
パターンやＶＩＡに含有されているバインダーをグリー
ンシート１〜４から抜くために行われる処理である。ま
た、第２焼成炉１１で行われる第２焼成１１！Ｉ！は、
Ｊにグリーンシート１〜４を焼結させるために行われる
処理である。The 111 firing process performed in the first firing furnace 10 is mainly performed to remove the binder contained in the copper paste pattern and VIA formed on each of the stacked green sheets from the green sheets 1 to 4. This is a process in which Also, the second firing 11 performed in the second firing furnace 11! I! teeth,
This is a process performed to sinter the green sheets 1 to 4.
焼成治８５が第１焼成炉１０に送り込まれることにより
、グリーンシート１〜４には第１焼成凱理が実施される
。この第１焼成処理により上記のように各グリーンシー
ト１〜４からバインダーが抜番ノると共に、焼成熱の印
加により各グリーンシート１〜４には第１１１成炉１０
のｍ度分布に応じた反りが発生する。The first firing process is performed on the green sheets 1 to 4 by sending the firing process 85 into the first firing furnace 10 . Through this first firing process, the binder is removed from each of the green sheets 1 to 4 as described above, and by applying firing heat, each of the green sheets 1 to 4 is
Warpage occurs according to the m degree distribution.
上記第１焼成処理が終了づると、焼成治具５は−ｔａ第
１焼成炉１０から出る。この時点で本発明方法の特徴と
なる、各グリーンシート１〜４の上下反転処理を行う。When the first firing process is completed, the firing jig 5 is removed from the -ta first firing furnace 10. At this point, each of the green sheets 1 to 4 is turned upside down, which is a feature of the method of the present invention.
この上下反転処理は、具体的には多段に積み炉ねられた
グリーンシート１〜４を上下逆さとなるようにＲき換え
るだけの簡単な処理である。これにより第１図（Ｃ）に
示すように、第１焼成処理において一番上に配設されて
いたグリーンシート１は一番下に位ＴＩｔ′！ｊること
になり、また一番下に配設されていたグリーンシート４
は−Ｉ％士に伶欝することになる。Specifically, this up-and-down reversal process is a simple process in which the green sheets 1 to 4 stacked in multiple stages are turned over so that they are turned upside down. As a result, as shown in FIG. 1(C), the green sheet 1 placed at the top in the first firing process is moved to the bottom TIt'! Green sheet 4, which was placed at the bottom,
-I% will be disappointed.
このように各グリーンシー１−１〜４が上下反転された
焼成治具５は続いて第２焼成炉１１内に送り込まれ、上
記したように主にグリーンシート１〜４を焼結するため
の焼成５１Ｌ坤が行われる。この第２の焼成処理によっ
ても、焼成炉１２内に温度分布によって各グリーンシー
ト１〜４に反りが発生する。The firing jig 5 with each of the green sheets 1-1 to 4 turned upside down in this way is then sent into the second firing furnace 11, and is used mainly for sintering the green sheets 1 to 4 as described above. Firing 51L is performed. Even in this second firing process, each of the green sheets 1 to 4 is warped due to the temperature distribution in the firing furnace 12.
しかるに、第１焼成５１！ＬＩｌｐにより各グリーンシ
ート１〜４には既に反りが１じており、またｆｆ１２ｍ
成処理においては各グリーンシート１〜４は上下反転さ
れた状態で焼成処理が行われる７更に、第１焼成炉１０
及び第２焼成炉１１は同一構成の焼成炉であり、炉内の
２！度分和はほぼ同じである。However, the first firing is 51! Each green sheet 1 to 4 has already warped by 1 degree due to LIlp, and ff12m
In the firing process, each of the green sheets 1 to 4 is fired in an upside-down state.7 Furthermore, the first firing furnace 10
and the second firing furnace 11 are firing furnaces with the same configuration, and the 2! The sum of degree divisions is almost the same.
よって、第１焼戒及び第２焼成全体としては各グリーン
シート１〜４には均一な焼成熱が印加されることとなり
、第１焼成で発生した反りも劉２焼成処即にＪ、り生ず
る反りによりｗｌ消され、第１１ｉ［１（Ｄ）に示すよ
うに第２焼成炉１１を通過した状態で、焼成された各セ
ラミック単板１８〜４ａは反りの無い平らな基板となる
。本発明名の実ａｔ二よると、上記の方法で焼成された
セラミックｙ板に発生する反りの最大値は１５０μｍで
あった。この値はセラミック基板１ａ−／ｌａのその後
の製造工程において不都合を生じない佑である。Therefore, uniform firing heat is applied to each green sheet 1 to 4 during the first firing and second firing as a whole, and the warping that occurred during the first firing also occurs immediately during the second firing. The fired ceramic veneers 18 to 4a become flat substrates without warping after passing through the second firing furnace 11 as shown in 11i[1(D). According to Act II of the present invention, the maximum value of warpage that occurred in the ceramic Y plate fired by the above method was 150 μm. This value is such that it will not cause any inconvenience in the subsequent manufacturing process of the ceramic substrates 1a-/la.
このように第１焼成姐卸の終了後、多段に栖み重ねたグ
リーンシート１〜４を上下反転させた上で第２の焼成Ｉ
／Ｂ］ｌＩを行うことにより、各グリーンシート１〜４
に印加される焼成熱を均一化する事ができ、焼結された
セラミック基板１ａ〜４ａに発生する反りを防止する事
ができる。よって、焼成処理後に行われる研磨工程にお
いて不都合が生じるようなことはなく、また多胴セラミ
ック基板の場合には研摩した後表面となる層が１１１だ
けとなるため、高精度でかつ高信頼性をｈするセラミッ
ク基板１ａ〜４ａを歩沼り良く製造することができる。After completing the first firing, the green sheets 1 to 4 stacked in multiple stages are turned upside down and then subjected to the second firing.
/B] By performing II, each green sheet 1 to 4
The firing heat applied to the sintered ceramic substrates 1a to 4a can be made uniform, and warpage occurring in the sintered ceramic substrates 1a to 4a can be prevented. Therefore, there will be no inconvenience in the polishing process that is performed after the firing process, and in the case of multi-body ceramic substrates, only the layer 111 will be the surface after polishing, so high precision and high reliability can be achieved. It is possible to manufacture ceramic substrates 1a to 4a with high efficiency.
尚、上記したように本発明ｙＪ法では、焼成処理を２回
に分ける必要があるが、一般に半導体装飲用のセラミッ
ク単板の焼成■稈では従来より焼成処理を２回に分けて
実施しており、本発明を使用するために、特に焼成■稈
が複雑になるようなことはない。As mentioned above, in the YJ method of the present invention, it is necessary to divide the firing process into two times, but in general, when firing ceramic veneers for semiconductor packaging, the firing process is conventionally carried out in two times. Therefore, the use of the present invention does not require any particular complications in the firing process.
また、上記実施例では多胴セラミック幕板の焼成方法を
例に挙げて説明したが、本発明方法は単一セラミック基
板の焼成に対しても用いる事ができることは勿論である
。Further, in the above embodiments, the method for firing a multi-cylindrical ceramic curtain plate was explained as an example, but it goes without saying that the method of the present invention can also be used for firing a single ceramic substrate.
更に、焼成炉内のｍ度分布を制御ｍｌすることにより本
発明と同様な効果を得る事ができるが、焼成炉内の温度
制御は現実問題として困難であり、装欝構造も複卸とな
る。これに対して本発明り法では、単にグリーンシート
を上下反転させるだけでよく、焼成炉の構造も変更しな
くて済むため、その効果は上記の構成よりも大である。Furthermore, the same effect as the present invention can be obtained by controlling the m degree distribution inside the firing furnace, but controlling the temperature inside the firing furnace is difficult as a practical matter, and the charging structure also needs to be doubled. . On the other hand, in the method of the present invention, it is only necessary to simply turn the green sheet upside down, and there is no need to change the structure of the firing furnace, so the effect is greater than that of the above structure.
上述のように、本発明によれば、焼成時における反りの
発生を防止する事ができるため、焼成されるセラミック
基板の１ｉｆｌ［を向上できると共に、信頼性を高める
ことができる等の特長を有する。As described above, according to the present invention, since it is possible to prevent the occurrence of warping during firing, it is possible to improve the 1ifl [1ifl] of the fired ceramic substrate, and to improve the reliability. .
第１図は本発明の一実施例であるグリーンシートの多段
焼成方法の焼成工程を工程順に示′１Ｊ図、第２図は従
来のグリーンシートの多段焼成方法の一例を説明するた
めの図、
第３図は焼成時にグリーンシートに生じる反りを説明す
るための図である。
図において、
１〜４はグリーンシート、
１８〜４ａはセラミック基板、
５は焼成治具、
９は焼成炉、
１０は第１焼成炉、
１１は第２焼成炉
を示す。
（Ａ）Figure 1 shows the firing steps of a multi-stage firing method for green sheets according to an embodiment of the present invention in the order of steps; Figure 2 is a diagram for explaining an example of a conventional multi-stage firing method for green sheets; FIG. 3 is a diagram for explaining the warping that occurs in the green sheet during firing. In the figure, 1 to 4 are green sheets, 18 to 4a are ceramic substrates, 5 is a firing jig, 9 is a firing furnace, 10 is a first firing furnace, and 11 is a second firing furnace. (A)
Claims (1)
成処理を行うグリーンシートの多段焼成方法において、 上記グリーンシート（１〜４）の焼成処理を２回に分け
、１回目の焼成処理終了後、上記多段に積み重ねられた
グリーンシート（１〜４）を上下反転させ、 続いて該反転させたグリーンシート（１〜４）に対し２
回目の焼成処理を行う構成としたことを特徴とするグリ
ーンシートの多段焼成方法。[Claims] In a multi-stage firing method for green sheets in which a plurality of green sheets (1 to 4) are stacked in multiple stages and fired, the firing process for the green sheets (1 to 4) is divided into two times, After the completion of the second firing process, the green sheets (1 to 4) stacked in multiple stages are turned upside down, and then 2
A multi-stage firing method for green sheets, characterized in that a second firing process is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2076476A JPH03275571A (en) | 1990-03-26 | 1990-03-26 | Method for firing green sheets in piled state |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2076476A JPH03275571A (en) | 1990-03-26 | 1990-03-26 | Method for firing green sheets in piled state |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03275571A true JPH03275571A (en) | 1991-12-06 |
Family
ID=13606243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2076476A Pending JPH03275571A (en) | 1990-03-26 | 1990-03-26 | Method for firing green sheets in piled state |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03275571A (en) |
-
1990
- 1990-03-26 JP JP2076476A patent/JPH03275571A/en active Pending
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