JPS58171896A - Wet multilayer ceramic board and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wet multilayer ceramic substrate and a method for manufacturing the same, and more particularly to a single multilayer ceramic substrate having a batten shape that can reduce warpage during sintering of the substrate and a method for manufacturing the same.

As is well known, wet multilayer ceramic substrates are
High-density wiring is possible. In addition, the wet multilayer ceramic substrate allows circuit components such as capacitors to be formed in a laminated pattern.

For this reason, when applying the wet multilayer ceramic substrate technology to form a circuit for a television tuner, for example, there is an advantage that the tuner can be made smaller.

Furthermore, since the ceramic itself that forms the substrate part of the wet type multi-layer ceramic board has excellent weather resistance, when forming the tuner, etc., it is difficult to use one of fairly high quality. There is a possibility that it can be realized.

However, when forming a high-frequency circuit such as the above-mentioned tuner using a wet multilayer ceramic substrate, as is well known, there is a ceramic part (only ceramic part) in between.
It has to be divided into two parts: the ground electrode part, which includes the computer circuit, and the high-frequency one-wave electrode part.

This is because, as is well known, the same diode is used in the tuner, and its cathode electrode must have a stray capacitance as small as possible.

As mentioned above, in Figure 1, the electrode part (hereinafter referred to as the conductor button) mainly consisting of a conductor layer such as tungsten is clearly touched in two parts, i.e., a wet multilayer ceramic with a ceramic part intervening in a certain area. FIG. 2 is a plan view showing an example of a substrate.

In the figure, reference numeral 1 indicates a ceramic substrate part (also 41 ceramic part), and reference numerals 2 and 3 indicate conductor buttons which are printed and fired on at least one arbitrary conductor layer and are connected to other circuit components.

- As shown in FIG. 1, when a ceramic part is present in a certain region, the conductor batten and the ceramic part have different shrinkage rates during firing of the wet multilayer ceramic board, so the conductor batten and the ceramic part have different shrinkage rates. The problem was that the matching between the two parts was broken and local warping occurred.

As mentioned above, for example, in the case of a tuner, it cannot be used with these 17 and 2 remaining, so conventionally (j.
They took measures to correct the problem (for example, placing a weight on it) and fired it again.

For this reason, in the case of the above-mentioned wet multilayer ceramic substrate, the distortion of the substrate further increases and hair cracks occur during the re-firing, which is one of the major causes of quality deterioration. Ta.

Further, as mentioned above, since re-firing is performed, there is a drawback that the cost increases accordingly.

The object of the present invention is to eliminate the drawbacks of the prior art mentioned above and to
An object of the present invention is to provide a wet multilayer ceramic substrate having a batten shape with less warpage and a method for manufacturing the same.

The lll1 mold of the wet multilayer ceramic substrate of the present invention is applied to the required number of layers on the ceramic substrate part according to the desired pattern.
, at least one conductor layer is formed on the ceramic part interposed over a certain area between the conductor patterns overlapped with alignment with an insulating layer interposed therebetween, and the conductor batten, and an independent The point is that a plurality of lands are provided.

In addition, the manufacturing method of the present invention is characterized by printing the required number of layers of insulating paste on the green sheet according to the desired pattern, and then printing the conductive paste that will become the conductive button after firing while aligning the layers. and printing at least one layer of conductor paste that will become lands after firing in a plurality of independent areas other than the conductor paste, and then sinter these together with the green sheet. At the point.

Hereinafter, the present invention will be explained using the drawings.

Figure @2 is a plan view showing an example of a wet multilayer ceramic substrate manufactured by the method of the present invention. In this figure, the same parts and parts as in FIG. 1 are indicated by the same reference numerals. Further, 4-1 to 4-4 are lands that are linearly and completely independently provided in groups between the conductor patterns 2 and 3 according to this embodiment.

First, a method for manufacturing a single multilayer ceramic substrate according to this embodiment will be described.

The method for manufacturing the wet multilayer ceramic substrate of this example is as follows: First, conductive paste is applied in a desired pattern onto a green sheet that will become the ceramic substrate part 1 after firing, at the positions of conductive patterns 2 and 3 shown in FIG. Print while adjusting the required number of layers and positioning accordingly.

Note that when printing multilayer conductor paste, it is necessary to print an insulating paste between them, as is well known.

Furthermore, in this embodiment, when printing the conductive paste, only one layer of the conductive paste is printed at positions that will become the lands 4-1-4-4 after firing.

Next, the green sheet and the conductive paste printed thereon (conductive paste and insulating paste in the case where the conductive pattern becomes multiple layers after firing) are sintered all at once.

By the method described above, the wet multilayer ceramic substrate of this example can be obtained.

In this example, as can be seen from FIG. 2, the linear conductive paste that forms the land 1 after firing is formed into several sets between the conductive pastes that will become the conductive patterns 2 and 3 after firing. I placed it.

This is because the rate of increase in floating weight between conductor patterns 2 and 3 varies depending on the difference in the pattern shape of the land provided between them.
In this case, according to the inventor's experimental results, when four or more independent lands are arranged as a set, the increase in number can be suppressed to - compared to the conventional example shown in Fig. 1. This is because I understand that it is difficult to understand.

This increase in availability can be adequately addressed by appropriately selecting other circuit components connected to the conductor patterns 2 and 3, as described above.

Further, FIG. 3 is a plan view showing another embodiment of the wet multilayer ceramic substrate of the present invention.

In this figure, the same parts and parts as in FIGS. 1 and 2 are indicated by the same reference numerals. Further, in place of the linear lands 4-1 to 4-4 shown in FIG. 2, 5 is provided in a circular shape and completely independently between the conductor patterns 2 and 3 according to this embodiment. It is a land.

The method for manufacturing a wet multilayer ceramic substrate of this example is as follows:
The method for manufacturing the wet multilayer ceramic substrate shown in the figure is explained below. However, the only difference is the shape of the conductive paste that forms the land 5 after firing.

According to the experimental results of the present inventor, the rate of increase in stray capacitance of the wet multilayer ceramic substrate shown in FIG. 3 is similar to that of FIG. I was able to keep it down to

Further, similar results were obtained even when a polygonal land was arranged like the round land 5 instead of the round land 5.

In addition, in the above explanation, the number of layers of the conductive paste that will become the land after firing is one layer, but the number of layers of the conductive paste that will become the conductor pattern after firing is the same as the number of layers of the conductive paste that will become the conductor pattern after firing. ” can be reduced.

□Furthermore, on the back side of the green sheet that will form the ceramic substrate part after firing, conductive paste that will form the land after firing is printed uniformly in one or more layers in a linear, round, polygonal, etc. By batch sintering, it is possible to obtain a wet multilayer ceramic substrate with even less warpage in each layer.

As is clear from the above description, in the manufacturing method according to the present invention, a conductor paste that becomes a conductor button after firing is printed, and the conductor paste is also printed uniformly on areas other than the conductor paste, that is, on the ceramic part. I decided to do so. As a result, according to the manufacturing method of the present invention, 'warpage'
This has the effect of making it possible to obtain a high-quality wet multilayer ceramic substrate □ with less.

In addition, in the wet multilayer ceramic substrate of the present invention,
As mentioned above, there is less 'warping' and an increase in floating cages.
As a high-frequency circuit, we were able to suppress the range in which no interlude occurs.

[Brief explanation of drawings]

Figure 1 shows an example of a conventional wet multilayer ceramic substrate.
FIG. 2 is a plan view showing an embodiment of the wet multilayer ceramic substrate of the present invention, and FIG. 3 is a plan view showing an embodiment of the wet multilayer ceramic substrate of the present invention. l... Ceramic substrate part (or ceramic part), 2.
3...Conductor bang, 4.5...Lant agent Michihito Hiraki, patent attorney

Claims (9)

[Claims] (1) A conductor pattern is stacked on a ceramic substrate part in a required number of layers according to a desired pattern, with an insulating layer interposed therebetween, and aligned, and a ceramic part interposed between the conductor buttons. 1. A wet multilayer ceramic substrate having a plurality of independent lands formed of at least one conductor layer in the ceramic portion. (2) The wet multilayer ceramic substrate according to item 1 of the patent, wherein the land is provided on both the front and back surfaces of the ceramic substrate portion. (3) The wet multilayer ceramic substrate according to claim 1 or 2, wherein the land is linear. (4) The wet multilayer ceramic substrate according to claim 1 or (J), wherein the land is round. (5) The wet multilayer ceramic substrate according to item 1 or 2 of the patent application, wherein the land is polygonal. (6) Print the required number of layers of 5ζ insulating paste in between, according to the desired pattern, on the green sheet that will become the ceramic substrate part after firing, and print the conductive paste that will become the conductor button after firing while aligning. Then, in a part other than the printed part of the conductive paste, at least one layer of conductive paste is printed on a plurality of independent areas lζ that will become lands after firing, and then these are printed together with the green sheet. A method for manufacturing a ceremonial multilayer ceramic substrate, characterized by sintering. (7) A method for manufacturing a patented layer ceramic substrate, characterized in that a conductive paste that will become a land after firing is printed on both the front and back sides of the green sheet. (8) The independent area is linear! l
! ? 11. A method for manufacturing a wet multilayer ceramic substrate according to claim 6 or 7. (9) The method for manufacturing a wet multilayer ceramic substrate according to claim 6 or 7, wherein the independent region is round. αG The method for manufacturing a wet multilayer ceramic substrate according to claim 1 @ claim 6 or 7, wherein the independent region is polygonal.