JPH03272127A - Substrate exposure device - Google Patents

Substrate exposure device

Info

Publication number
JPH03272127A
JPH03272127A JP2069837A JP6983790A JPH03272127A JP H03272127 A JPH03272127 A JP H03272127A JP 2069837 A JP2069837 A JP 2069837A JP 6983790 A JP6983790 A JP 6983790A JP H03272127 A JPH03272127 A JP H03272127A
Authority
JP
Japan
Prior art keywords
mask
holder
substrate
sucked
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2069837A
Other languages
Japanese (ja)
Other versions
JP2691631B2 (en
Inventor
Masuzo Ikumi
生見　益三
Hiroshi Suzuki
弘 鈴木
Satoru Iwama
悟 岩間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP2069837A priority Critical patent/JP2691631B2/en
Publication of JPH03272127A publication Critical patent/JPH03272127A/en
Application granted granted Critical
Publication of JP2691631B2 publication Critical patent/JP2691631B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To improve the quality of the title device by blowing out inert gas inward to the wall surface of a notch window of a mask holder. CONSTITUTION:A mask 2 is mounted on the surface of a mask holder 3 fitting to a notch window 1 of the holder 3 and then the holder 3 fitted to the notch window 7 of a mask base 5 is set in the alignment part on the exposure position of a peripheral part. When the whole body is vacuum sucked in such a state, the vacuum sucking trenches 6 of the holder 3 and those 8 of the base 5 are vacuum sucked so that the mask 2 may be sucked at the surface of the holder 3 likewise the rear surface of the holder 3 may be sucked at the surface of the base 5. At this time, the oxygen concentration in the gap between the mask 2 and a substrate 4 can be lowered due to the trenches 12 blowing out the inert gas on the wall surface inward thereby enabling the deterioration in oxidation of resist and the gas production on the substrate surface by the irradiated ultraviolet rays during the printing process to be avoided. Accordingly, a circuit pattern in high resolving power of securing proper ultraviolet ray irradiation can be printed thereby enabling both the quality and the productivity to be improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、回路パターンが形成されたマスクを保持して
位置決め固定し、その回路パターンを露光により基板の
表面に焼き付ける基板露光装置に関し、特に焼き付けの
際の基板の表面におけるレジストの酸化劣化及びガスの
発生を防ぐことにより、焼き付けられる回路パターンの
解像度を向上することができる基板露光装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a substrate exposure apparatus that holds, positions and fixes a mask on which a circuit pattern is formed, and prints the circuit pattern on the surface of the substrate by exposure. The present invention relates to a substrate exposure apparatus that can improve the resolution of printed circuit patterns by preventing oxidative deterioration of resist and generation of gas on the surface of a substrate during printing.

〔従来の技術〕[Conventional technology]

従来のこの種の基板露光装置は、第４図に示すように、
中央部に切欠窓ｌが穿設されこの切欠窓１周辺部により
ガラス基板に回路パターンが形成されたマスク２を保持
するマスクホルダ３と、このマスクホルダ３をレジスト
が塗布された基板４への露光位置に対して位置決めする
マスクベース５とを有して威っていた。そして、上記マ
スクホルダ３の上面の切欠窓１の周辺部に形成された真
空吸着用溝６で真空吸引することにより、上記マスク２
を保持するようになっていた。また、上記マスクベース
５は、中央部に上記マスクホルダ３の切欠窓ｌよりも広
い切欠窓７を有しており、上記マスクベース５の上面の
切欠窓７の周辺部に形成された真空吸着用溝８で真空吸
引することにより、上記マスクホルダ３を基板４への露
光位置に保持するようになっていた。そして、基板４を
基板チャック９の上面に保持して、上記二つの切欠− ２− スフ２と基板４との間の間隙ｌＯに存在する酸素の濃度
を減少させることができるため、焼き付けの際に照射さ
れる紫外線により基板４の表面に塗布されているレジス
トの酸化劣化及びガスの発生を防止できる。従って、照
射する紫外線の強度や量にむらが生じることを防止でき
、適切な紫外線の照射を確保できるため、高解像度の回
路パターンの焼き付けが可能となる。これにより、製品
としての品質を向上できると共に、歩留まりが良くなり
、生産性も向上することができる。A conventional substrate exposure apparatus of this type, as shown in FIG.
A mask holder 3 has a notched window l in the center and holds a mask 2 on which a circuit pattern is formed on a glass substrate using the peripheral part of the notched window 1, and this mask holder 3 is attached to a substrate 4 coated with a resist. It has a mask base 5 which is positioned with respect to the exposure position. Then, the mask holder 3 is vacuum-suctioned by a vacuum suction groove 6 formed around the cutout window 1 on the upper surface of the mask holder 3.
It was supposed to hold. The mask base 5 also has a cutout window 7 in the center that is wider than the cutout window l of the mask holder 3, and a vacuum suction formed around the cutout window 7 on the upper surface of the mask base 5. The mask holder 3 was held in the exposure position to the substrate 4 by vacuum suction through the groove 8 . By holding the substrate 4 on the upper surface of the substrate chuck 9, it is possible to reduce the concentration of oxygen present in the gap lO between the two notches 2 and the substrate 4, so that the It is possible to prevent oxidative deterioration of the resist coated on the surface of the substrate 4 and the generation of gas due to the ultraviolet rays irradiated to the surface of the substrate 4. Therefore, it is possible to prevent unevenness in the intensity and amount of irradiated ultraviolet rays, and to ensure appropriate irradiation of ultraviolet rays, making it possible to print high-resolution circuit patterns. This not only improves the quality of the product, but also improves yield and productivity.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明による基板露光装置の実施例を示す断面
図、第２図はその斜視図、第３図は本発明の基板露光装
置の動作を説明するための要部拡大図、第４図は従来の
基板露光装置を示す断面図である。 １・・・切欠窓、　２・・・マスク、　３・・・マスク
ホルダ、　４・・・基板、　５・・・マスクベース、　
６，８・・・真空吸着用溝、　９・・・基板チャック、
　　１０・・・間隙、　１１・・・壁面、　１２・・・
吹出溝、　１３・・・窒素ガス。FIG. 1 is a sectional view showing an embodiment of the substrate exposure apparatus according to the present invention, FIG. 2 is a perspective view thereof, FIG. 3 is an enlarged view of essential parts for explaining the operation of the substrate exposure apparatus according to the present invention, and FIG. The figure is a sectional view showing a conventional substrate exposure apparatus. DESCRIPTION OF SYMBOLS 1... Notch window, 2... Mask, 3... Mask holder, 4... Substrate, 5... Mask base,
6, 8...Vacuum suction groove, 9...Substrate chuck,
10...Gap, 11...Wall surface, 12...
Blowout groove, 13...Nitrogen gas.

Claims (1)

【特許請求の範囲】[Claims] 中央部に切欠窓が穿設され該切欠窓周辺部によりガラス
基板に回路パターンが形成されたマスクを保持するマス
クホルダと、このマスクホルダをレジストを塗布した基
板への露光位置に対して位置決め固定するマスクベース
とを有して成り、上記回路パターンを露光により基板の
表面に焼き付ける基板露光装置において、上記マスクホ
ルダの切欠窓の壁面に不活性ガスを内向きに吹き出す手
段を設けたことを特徴とする基板露光装置。A mask holder that holds a mask with a cutout window drilled in the center and a circuit pattern formed on a glass substrate around the cutout window, and a mask holder that is positioned and fixed relative to the exposure position on the substrate coated with resist. A substrate exposure apparatus for printing the circuit pattern onto the surface of the substrate by exposure, comprising: a mask base; a substrate exposure apparatus for printing the circuit pattern on the surface of the substrate by exposure, characterized in that a means for blowing inert gas inward is provided on the wall surface of the cutout window of the mask holder. substrate exposure equipment.
JP2069837A 1990-03-22 1990-03-22 Substrate exposure equipment Expired - Lifetime JP2691631B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2069837A JP2691631B2 (en) 1990-03-22 1990-03-22 Substrate exposure equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2069837A JP2691631B2 (en) 1990-03-22 1990-03-22 Substrate exposure equipment

Publications (2)

Publication Number Publication Date
JPH03272127A true JPH03272127A (en) 1991-12-03
JP2691631B2 JP2691631B2 (en) 1997-12-17

Family

ID=13414310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2069837A Expired - Lifetime JP2691631B2 (en) 1990-03-22 1990-03-22 Substrate exposure equipment

Country Status (1)

Country Link
JP (1) JP2691631B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100739424B1 (en) * 2005-10-28 2007-07-13 삼성전기주식회사 Exposure apparatus and method for manufacturing printed circuit board using inert gas injection
JP2013054343A (en) * 2011-08-10 2013-03-21 Nsk Technology Co Ltd Proximity exposure device and proximity exposure method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443480A (en) * 1977-09-12 1979-04-06 Hitachi Ltd Mask aligner
JPS5563826A (en) * 1978-11-09 1980-05-14 Toshiba Corp Pattern exposure device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443480A (en) * 1977-09-12 1979-04-06 Hitachi Ltd Mask aligner
JPS5563826A (en) * 1978-11-09 1980-05-14 Toshiba Corp Pattern exposure device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100739424B1 (en) * 2005-10-28 2007-07-13 삼성전기주식회사 Exposure apparatus and method for manufacturing printed circuit board using inert gas injection
JP2013054343A (en) * 2011-08-10 2013-03-21 Nsk Technology Co Ltd Proximity exposure device and proximity exposure method

Also Published As

Publication number Publication date
JP2691631B2 (en) 1997-12-17

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