JPH03270059A - Feeder for cooling water of lsi - Google Patents

Abstract

PURPOSE:To start an LSI early without generating dew condensation in a cooling piping system and an LSI substrate section on starting by installing cooling-water flow path for supplying the LSI with cooling water from a cooling device and a heating element for heating the cooling water of the cooling-water flow path. CONSTITUTION:When a heater 6 for heating mounted on a cooling flow path 4 for an LSI 3 is operated, a temperature rise up to the set temperature of cooling water for the LSI 3 is quickened. Even when the heater 6 for heating is stopped by the heat capacity, etc., of cooling water for the LSI 3 at that time, the temperature of cooling water is detected previously by a temperature sensor 12 because the temperature of cooling water exceeds the set temperature by inertia, the quantity of heating of the heater 6 for heating is reduced before the temperature of cooling water reaches the set temperature while a compressor 9 is operated, and the quantity of cooling of the compressor is adjusted by an inverter 13 and cooling water is controlled so as to rapidly reach the set temperature. The LSI 3 can be cooled by a refrigerating cycle using the compressor 9 controlled by the inverter 13 during a time when the LSI 3 is operated.

Description

[Detailed description of the invention]

[0001]

[Industrial application field]

The present invention relates to an LSI cooling water supply device, and particularly to an LSI cooling water supply device suitable for cooling computers. [0002]

[Conventional technology]

LSIs used in large-sized computers are generally cooled directly by water by passing cooling water through the back surface of the LSI board. [0003] Related technologies of this type include "Mounting technology for supercomputer SX series that water-cools multi-chip packages" (Nikkei Electronics, No. 243).
Pages 266 to 266).

【○004】

[Problem to be solved by the invention]

The above-mentioned conventional technology has disadvantages such as when the temperature of the cooling water becomes lower than the dew point of the ambient environment, moisture in the air causes dew condensation on the cooling piping system and the LSI board, causing the LSI to malfunction. [0005] In order to increase the temperature of the cooling water of the LSI, converting the power of the pump into kinetic energy of the blades and transmitting this as heat to the cooling water, raising the temperature has been considered, but the temperature of the cooling water There was a problem in that it took a long time to raise the temperature to the set temperature. # In a flow path system that uses a mixing tank to stabilize the temperature when fluids of different temperatures join together, the amount of water held and the force of the piping increases, so the heat capacity increases, and the power of the pump alone is insufficient. It takes a lot of time to reach the set temperature. For example, when a large-sized computer is cooled with water, it is inconvenient that the large-sized computer cannot be operated until the temperature of the cooling water rises to a set temperature. [0006] An object of the present invention is to quickly raise the temperature of LSI cooling water to the above-mentioned set temperature in order to quickly start up the LSI without causing dew condensation on the cooling piping system or the LSI board during startup. The object of the present invention is to obtain an LSI cooling device that can be used as a cooling device. [0007]

[Means to solve the problem]

In order to achieve the above object, an LSI cooling water supply device of the present invention includes a cooling device having a compressor, a heat exchanger for exchanging heat between a refrigerant and an external fluid, and an expansion valve, and cooling by the cooling device. The device is characterized by comprising an LSI, a cooling water flow path for sending cooling water from the cooling device to the LSI, and a heating element for heating the cooling water in the cooling water flow path. [0008]

[Effect]

The cooling water for the LSI is heated by a heating element such as a heater until the temperature reaches a preset temperature prior to starting the LSI. Thereby, the time required for the temperature of the LSI cooling water to rise to the set temperature can be shortened. When the temperature of the LSI cooling water reaches close to the set temperature, the heating element is heated to reduce the amount of heat generated by the heating element and prevent the LSI cooling water from exceeding the set temperature due to heat capacity. After stopping, the cooling system using a compressor is activated to stabilize the water temperature to the set temperature. While the LSI is in operation, it can be cooled by a refrigeration cycle using a compressor. [0009]

【Example】

When the LSI has been stopped for a long time and the heating and air conditioning of the surrounding environment such as indoors has stopped, if the temperature of the indoor environment is suddenly raised by heating, the cooling water of the LSI has a heat capacity. , the LSI cooling water becomes lower than the environmental temperature in the surrounding room, and also lower than the dew point determined from the room temperature and humidity. At this time, moisture in the air condenses on the piping surface or the LSI substrate, which has approximately the same temperature as the LSI cooling water, resulting in dew condensation. Therefore, if the LSI has been stopped for a long time and the LSI cooling water is at a low temperature, when the LSI is activated, the temperature of the LSI cooling water must be lowered to the relatively high temperature level before the room temperature is raised by heating. It is necessary to raise the temperature to the set temperature.

[0010] In order to raise the LSI cooling water to the set temperature, the LSI can be operated by effectively transmitting heat from the outside to the LSI cooling water and shortening the time it takes to raise the LSI cooling water to the set temperature. This makes it possible to speed up the start-up time. As a method for increasing the temperature of the LSI cooling water, a heating element such as a heater can be used to heat the water and raise the temperature.

[0011] When the LSI is in normal operation, heat is transferred to the cooling water in the refrigeration cycle by a heat exchanger that transfers the amount of heat of the cooling water to the refrigerant using a boiling phenomenon. Then, the gasified refrigerant from this heat exchanger is pressurized and compressed by a compressor.
Furthermore, the heat of the refrigerant, which has become high in temperature, is transferred to the external fluid by another heat exchanger via the discharge pipe of the compressor. The refrigerant passes through the expansion valve and returns to the heat exchanger, which exchanges heat between the cooling water and the refrigerant. [0012] The heating heater is installed in a cooling water flow path that circulates through a heat exchanger between an LSI cooling flow path and a refrigerant, and the amount of heat generated can be controlled according to the supplied power. This heater is used to heat the cooling water before starting up the LSI, and the amount of heat generated by the heater is controlled by a temperature sensor installed in the cooling water, and the supplied power is reduced as the temperature approaches the set temperature. By doing so, the temperature can be raised to the set temperature in a short time. Further, by operating the compressor controlled by the inverter together with the heater, even more precise temperature control becomes possible. That is, when inverter control is used, precise temperature control is possible by changing the frequency of the inverter even if there are fluctuations in the external environmental temperature or the amount of heat generated by the LSI. Hereinafter, a specific embodiment of the present invention will be described with reference to FIG. [0013]In a room where indoor air 2 is being conditioned by an air conditioner 1, an LSI 3 constituting a computer or the like and a cooling water supply device for cooling the LSI 3 are installed. The cooling water supply device includes a cooling water passage 4 through which cooling water flows to cool the LSI 3, a pump 5, a useless heater 6 for heating the cooling water in the cooling water passage 4, and a temperature sensor 12 for detecting the temperature of the cooling water.
, a heat exchanger 8 that exchanges heat between the cooling water and the refrigerant flowing through the refrigerant flow path 7, a compressor 9 that compresses the refrigerant, an inverter 13 that controls the compressor, and heat between the refrigerant and the indoor air 2. It is comprised of a heat exchanger 10 for performing exchange, and an expansion valve 11 for forming a refrigerant cycle. Note that the arrows in the figure indicate the flow direction of the refrigerant or LSI cooling water. [0014] In the cooling water supply system as shown in FIG.
When the temperature of the SI cooling water falls below the dew point determined by room temperature and humidity, there is a possibility that dew condensation may form on the surface of the cooling water piping or on the LSI board. In order to prevent this condensation, the set temperature is set higher than the dew point determined from the indoor temperature and humidity, and the LSI is operated while maintaining this set temperature. [0015] In this case, assuming that the indoor temperature is 20°C, the set temperature of the cooling water is determined to be 25°C for safety reasons. At this time, for example, if the LSI 3 of the computer is temporarily stopped in the winter and the indoor air conditioner 1 is also stopped, the indoor temperature and the cooling water temperature after stopping are both set to 10° C., depending on the outside air temperature, for example. When the computer is operated again, the indoor air conditioner 1 rapidly heats the room until the temperature reaches 20°C. Since the cooling water for the LSI has heat capacity, the temperature will rise above 10°C, but it will not reach 20°C. was not reached,
At this time, the indoor temperature falls below the dew point determined by the 20° C. and humidity, and condensation occurs on the cooling water piping of the LSI 3 and the LSI board. For this reason, it is necessary to raise the temperature of the LSI cooling water before heating the room. The LSI cooling water content is increased to the above-mentioned set temperature (e.g. 25°C), and the outside air temperature (e.g. 10°C), which is the initial temperature of the LSI3 cooling water.
), the LSI cooling water is circulated without operating the compressor 9, the pump power is transmitted through the pump blades, the temperature of the LSI 3 cooling water exceeds the dew point, and the temperature is raised to the set temperature. In this case, the temperature of the cooling water of the LSI 3 rises slowly, and it takes a long time to reach the set temperature of the LSI 3. Cooling channel 4 of LSI 3 of this embodiment
According to the method of activating the heater 6 installed in the LSI 3, the temperature of the cooling water of the LSI 3 rises to the set temperature more quickly. In this case, even if the heating heater 6 is stopped due to the heat capacity of the cooling water of the LSI 3, the set temperature will be exceeded due to inertia, so the temperature sensor 12 detects the cooling water temperature in advance, and the temperature is detected before the set temperature is reached. While reducing the amount of heating by the heater 6, the compressor 9 is operated, and the inverter 13 controls the amount of cooling to quickly reach the set temperature. While the LSI 3 is in operation, L is
SI3 can be cooled. [0016] FIG. 2 is a diagram showing another embodiment of the present invention. In this embodiment, a heater 6 is wound around the outside of the cooling water pipe as a heating element that heats the cooling water for cooling the LSI at startup, and heats the cooling water. [0017]

【Effect of the invention】

According to the present invention, since the cooling water is heated by the heating element, it is possible to prevent dew condensation when starting up the LSI, and moreover, the temperature of the cooling water for the LSI can be raised to the set temperature at which the LSI can operate in a short period of time. There is an effect that it can be done.

[Brief explanation of drawings]

[Figure 1] FIG. 1 is a cooling system diagram showing an embodiment of the present invention.

[Figure 2] FIG. 6 is a cooling system diagram showing another embodiment of the present invention.

[Explanation of symbols]

1 Indoor air conditioner indoor air LSI Cooling water flow path pump heating heater Refrigerant flow path Heat exchanger compressor O heat exchanger 1 Expansion valve 2 Temperature sensor 3 Inverter

【Document name】

[Figure 1] drawing 1°Nitunai Akane et al. Shufuzawa 21 to Uchikasa Tadashi 3: LSI 4: LSI glue/Reikai water) road 5:, tj nfupa 6: Shirigai 1 usage 7: Refrigerant flow t 8: Right pulse generator 9: Compression-like 10: Heat exchanger 1 central unit l 1:, 1rij Roasted Moon Chotan 12 nigger 7 degree sensor 332- JP-A-3-270059 (8)

[Figure 2]

Claims (1)

[Claims] 1. A cooling device having a compressor, a heat exchanger for exchanging heat between a refrigerant and an external fluid, and an expansion valve; an LSI cooled by the cooling device; and a cooling device that supplies cooling water from the cooling device to the LSI. 1. A cooling water supply device for an LSI, comprising: a cooling water flow path for feeding the cooling water to the cooling water flow path; and a heating element for heating the cooling water in the cooling water flow path.