JPH04206557A - Cooling water feeding device for lsi - Google Patents
Cooling water feeding device for lsiInfo
- Publication number
- JPH04206557A JPH04206557A JP32932390A JP32932390A JPH04206557A JP H04206557 A JPH04206557 A JP H04206557A JP 32932390 A JP32932390 A JP 32932390A JP 32932390 A JP32932390 A JP 32932390A JP H04206557 A JPH04206557 A JP H04206557A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- cooling water
- pump
- lsi
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000498 cooling water Substances 0.000 title claims abstract description 40
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 238000005057 refrigeration Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract 1
- 238000004904 shortening Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＬＳＩの冷却水を供給する装置において、起
動時にＬＳＩの冷却水を迅速に設定温度に到達させる手
段に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a means for quickly reaching a set temperature of cooling water for an LSI at startup in an apparatus for supplying cooling water for an LSI.
ＬＳＩが多数用いられているコンピュータの設置室の室
温よりも、コンピュータの冷却水が低温であると、冷却
水の配管、あるいはモジュール近くの流路に結露を生じ
、水分が付着して故障の原因となる。このため、とくに
冬期における起動時には、空調設備による室温の急上昇
に伴って、コンピュータの起動時には冷却水温度を設定
温度まで上昇させる必要がある。このため、コンピュー
タ用の冷却装置は、特開昭６３−１７６９５６号公報に
示されているように、コンピュータの起動時にはヒート
ポンプ作用などを行うことによりＬＳＩの冷却水を加熱
する方法が考えられている。If the temperature of the computer cooling water is lower than the room temperature of the computer installation room where many LSIs are used, condensation may occur in the cooling water piping or in the flow paths near the modules, causing moisture to adhere and cause malfunctions. becomes. For this reason, especially during startup in winter, as the room temperature rises rapidly due to air conditioning equipment, it is necessary to raise the cooling water temperature to a set temperature when the computer is started. For this reason, as shown in Japanese Patent Application Laid-open No. 176956/1983, cooling devices for computers have been designed to heat cooling water for LSIs by performing a heat pump action when the computer is started. .
ＬＳＩの冷却水流路に結露を生じさせないために冷却水
を加熱する方法として、従来は冷凍サイクルを逆サイク
ル運転してヒートポンプ作用にるもの、あるいは、ヒー
タを冷却水流路に装着する方法が考えられている。しか
し、これらの方法は加熱手段をＬＳＩの流路、あるいは
冷凍サイクル配管に付加しなければならず、冷却システ
ムが複雑化する欠点があった。Conventional methods for heating cooling water to prevent condensation from forming in the cooling water flow path of LSI include running the refrigeration cycle in reverse cycle to create a heat pump effect, or installing a heater in the cooling water flow path. ing. However, these methods have the disadvantage that heating means must be added to the flow path of the LSI or the refrigeration cycle piping, which complicates the cooling system.
上記目的を達成するために、本発明はコンビュ−夕冷却
用としてとくに設置されている故障時のバックアップに
用いているポンプを熱源としてコンピュータの起動時に
用い、循環用ポンプとバックアップ用のポンプの両方を
起動時に運転することによって、冷却水へポンプが運転
されることによって発生する熱をより多く付加し低温の
冷却水温度の上昇速度を速くして、設定温度に早く近づ
けるようにしたものである。In order to achieve the above object, the present invention uses a pump that is especially installed for computer cooling and is used as a backup in the event of a failure as a heat source when starting up the computer, and both the circulation pump and the backup pump are used as a heat source. By operating the pump at startup, more heat generated by the pump operation is added to the cooling water, increasing the speed at which the low-temperature cooling water temperature rises, allowing it to quickly approach the set temperature. .
冷却水の流路のポンプのモータでの電力損失による発熱
量が、ポンプの構成材料を経て伝わっていき、冷却水へ
伝達される。また、ポンプの羽根車が回転することによ
り、冷却水と流体壁面との摩擦エネルギが増え、冷却水
の温度上昇が起こる。The amount of heat generated due to power loss in the motor of the pump in the cooling water flow path is transmitted through the constituent materials of the pump and is transmitted to the cooling water. Furthermore, as the impeller of the pump rotates, the frictional energy between the cooling water and the fluid wall increases, causing a rise in the temperature of the cooling water.
通常の冷却水を冷却装置からＬＳＩモジュールへ循環さ
せるポンプと、この循環ポンプのバックアップ用ポンプ
により、複数台で運転することによって、−台運転の場
合よりポンプからの発熱量が増加し、冷却水の温度が設
定温度に早く到達する。By operating multiple units using a pump that circulates normal cooling water from the cooling device to the LSI module and a backup pump for this circulation pump, the amount of heat generated by the pump increases compared to the case of -unit operation, and the cooling water temperature reaches the set temperature quickly.
以下、本発明の一実施例を第１図により説明する。ＬＳ
Ｉの冷却水は、定常的には循環ポンプ１によって、ＬＳ
Ｉの流路２内を流れ、ＬＳＩモジュール３近辺とＬＳＩ
の冷却装置の蒸発器４を経て循環し、圧縮機５．凝縮器
６．膨張弁７及び蒸発器４から成る冷凍サイクルによっ
て冷却水の熱が、蒸発器４で冷媒へ伝達され、冷却水が
冷却される。また、ＬＳＩの冷却水はＬＳＩモジュール
３近辺へ流れて、ＬＳＩの基板８上の発熱するＬＳＩモ
ジ五−ル３の熱が伝達される。循環ポンプ１が故障した
場合に備えて作動するバックアップポンプ９が循環ポン
プ１と並列に配設されている。An embodiment of the present invention will be described below with reference to FIG. L.S.
The cooling water of I is regularly supplied to the LS by the circulation pump 1.
Flows through the flow path 2 of I, near the LSI module 3 and the LSI
It is circulated through the evaporator 4 of the cooling device of the compressor 5. Condenser6. A refrigeration cycle consisting of an expansion valve 7 and an evaporator 4 transfers the heat of the cooling water to the refrigerant in the evaporator 4, thereby cooling the cooling water. Further, the LSI cooling water flows to the vicinity of the LSI module 3, and the heat generated by the LSI module 3 on the LSI board 8 is transferred. A backup pump 9 that operates in case the circulation pump 1 fails is arranged in parallel with the circulation pump 1.
ＬＳＩの冷却水流路中に設置された温度センサ１０が、
起動時にまず水温を計測し、ある温度共′下であれば制
御回路によって、循環ポンプ１の他にバックアップ用ポ
ンプ９が作動するようになっていて、それと同時にバッ
クアップポンプと直列に設置されたバルブ１３があけら
れ、また、循環ポンプと直列に設置されたバルブ１１は
流速が過大にならないように少し閉じられるようになっ
ている。温度センサ１０で検知されるＬＳＩの冷却水の
温度が設定温度になれば、制御回路１２によってバック
アップのポンプは停止し、バンクアップポンプ９と直列
に設置されたバルブ１３は全開となり、また循環ポンプ
と直列バルブ１１は全開となる。その後、仮りに循環ポ
ンプ１１が故障した場合は、バックアップ用のポンプ１
３が作動し。A temperature sensor 10 installed in the cooling water flow path of the LSI,
At startup, the water temperature is first measured, and if the water temperature is below a certain level, the control circuit operates the backup pump 9 in addition to the circulation pump 1, and at the same time a valve installed in series with the backup pump is activated. 13 is opened, and the valve 11 installed in series with the circulation pump is slightly closed to prevent the flow rate from becoming excessive. When the temperature of the LSI cooling water detected by the temperature sensor 10 reaches the set temperature, the control circuit 12 stops the backup pump, fully opens the valve 13 installed in series with the bank-up pump 9, and closes the circulation pump. Then, the series valve 11 becomes fully open. After that, if the circulation pump 11 breaks down, the backup pump 1
3 is activated.
ＬＳＩの冷却装置が停止せずに運転が継続される。Operation continues without stopping the LSI cooling device.
第２図は、他の実施例を示した図である。第１図では、
冷凍サイクルを用いてＬＳＩの冷却水を冷却していたが
、第２図では水−空気熱交換器で。FIG. 2 is a diagram showing another embodiment. In Figure 1,
A refrigeration cycle was used to cool the LSI cooling water, but in Figure 2, a water-air heat exchanger is used.
室内の空気を用いてＬＳＩの冷却水を冷却している。但
し、この場合、水−空気熱交換器１４が大形化する欠点
がある。Indoor air is used to cool the LSI cooling water. However, in this case, there is a drawback that the water-air heat exchanger 14 becomes large in size.
第３図は、コンピュータの冷却装置の起動時からの時間
を横軸に、また、ＬＳＩの冷却水の温度を縦軸に示した
。第３図において、実線は循環ポンプとバックアップポ
ンプの両方が作動した場合の温度の立上りを示していて
、点線は１ｉｉｆｌｉポンプのみ作動した場合の立上り
曲線を示している。In FIG. 3, the horizontal axis shows the time from the start of the computer cooling device, and the vertical axis shows the temperature of the LSI cooling water. In FIG. 3, the solid line shows the temperature rise when both the circulation pump and the backup pump are operated, and the dotted line shows the rise curve when only the 1iifli pump is operated.
ＬＳＩの冷却水が室温より低くなり、設定温度（例えば
２５℃）まで早く到達する必要があるが。The cooling water of the LSI becomes lower than room temperature and needs to quickly reach the set temperature (for example, 25°C).
ポンプを複数台で運転した方がより早く水温が設定温度
になる。Running multiple pumps will bring the water temperature to the set temperature more quickly.
本発明によれば、ＬＳＩの冷却水の温度を早く設定温度
まで立上げられるので、コンピュータのＬＳＩが演算を
スタートできるまでの待ち時間を少なくすることができ
る。このため、コンピュータのオペレータの待ち時間が
短縮され、操作のしやすいコンピュータを実現すること
ができる。According to the present invention, since the temperature of cooling water for an LSI can be quickly raised to a set temperature, the waiting time until the LSI of a computer can start calculation can be reduced. Therefore, the waiting time for the computer operator is shortened, and a computer that is easy to operate can be realized.
第１図は本発明の一実施例の冷却系統図、第２図は、本
発明の他の実施例を示す冷却系統図、第３図は、本発明
の冷却水の温度変化を示す特性図である。
１・・・循環ポンプ、２・・・ＬＳＩの冷却水の流路、
３・・・ＬＳＩモジュール、４・・・蒸発器、５・・・
圧縮機、６・・水冷凝縮器、７・・・膨張弁、８・・・
ＬＳＩの基板。
９・・・バックアップポンプ、１０・・・温度センサ、
１１ ・循環ポンプと直列に設置されたバルブ。
１２・・・制御回路、１３・・・バックアップポンプと
直第 １１
／２
第２ 図
Ｚ３ 国
ム
峰Ｐ５Fig. 1 is a cooling system diagram of one embodiment of the present invention, Fig. 2 is a cooling system diagram of another embodiment of the invention, and Fig. 3 is a characteristic diagram showing temperature changes of cooling water of the present invention. It is. 1... Circulation pump, 2... LSI cooling water flow path,
3...LSI module, 4...evaporator, 5...
Compressor, 6... Water-cooled condenser, 7... Expansion valve, 8...
LSI board. 9...Backup pump, 10...Temperature sensor,
11 - A valve installed in series with the circulation pump. 12...Control circuit, 13...Backup pump and direct line 11/2 2nd figure Z3 Kunimu peak P5
Claims (1)
、蒸発器、凝縮器、膨張弁から構成される冷凍サイクル
を用いて冷却する冷却装置において、 前記循環ポンプと別のバックアップポンプを前記循環ポ
ンプとともに起動時に作動させることを特徴とするＬＳ
Ｉの冷却水供給装置。[Scope of Claims] 1. A cooling device that cools LSI cooling water circulated by a circulation pump using a refrigeration cycle consisting of a compressor, an evaporator, a condenser, and an expansion valve, comprising: LS characterized in that another backup pump is activated together with the circulation pump at startup.
I cooling water supply device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32932390A JPH04206557A (en) | 1990-11-30 | 1990-11-30 | Cooling water feeding device for lsi |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32932390A JPH04206557A (en) | 1990-11-30 | 1990-11-30 | Cooling water feeding device for lsi |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04206557A true JPH04206557A (en) | 1992-07-28 |
Family
ID=18220175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32932390A Pending JPH04206557A (en) | 1990-11-30 | 1990-11-30 | Cooling water feeding device for lsi |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04206557A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0766308A2 (en) * | 1995-09-29 | 1997-04-02 | General Electric Company | Reduced thermal cycling of water cooled power electronic devices |
| JP2022020053A (en) * | 2015-11-09 | 2022-01-31 | コーニンクレッカ フィリップス エヌ ヴェ | Magnetic resonance examination system having fluid cooking device |
-
1990
- 1990-11-30 JP JP32932390A patent/JPH04206557A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0766308A2 (en) * | 1995-09-29 | 1997-04-02 | General Electric Company | Reduced thermal cycling of water cooled power electronic devices |
| EP0766308A3 (en) * | 1995-09-29 | 1998-06-10 | General Electric Company | Reduced thermal cycling of water cooled power electronic devices |
| JP2022020053A (en) * | 2015-11-09 | 2022-01-31 | コーニンクレッカ フィリップス エヌ ヴェ | Magnetic resonance examination system having fluid cooking device |
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