JPH03270034A - Inspection device - Google Patents

Abstract

PURPOSE:To realize electrical contacts having high precision, and to miniaturize a device by forming a seal for X, a seal for Z and air curtains blown off from each air blow-off port of a fluid tank into clearances among each stage of X, Y and Z and between the fluid tank and the X stage and closing the opening section of the fluid tank. CONSTITUTION:The inside of a fluid tank 13 is supplied with a fluorine based inert fluid from nonconductive inert fluid introducing pipes 57 at the same time as alignment, and a work 3 is brought to a state in which it is dipped in a nonconductive inert fluid 15. A measuring section 56 is lowered by driving a Z stage while the upper section and periphery of a measuring object chip 2a are supplied with the nonconductive fluid 15, and the probing pin of a pin block 21 is made to abut against an electrode pad for measurement while being dipped in the nonconductive fluid 15, thus inspecting the chip 2a. when air is blown off from each air blow-off port at that time, air pressure is increased in each clearance, thus sealing the vapor of the nonconductive inert fluid 15 in the fluid tank 13. Accordingly, space on one plane can be made smaller than structure in which X and Y-axes seal have been conducted on one plane.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to an inspection device.

(Conventional technology) Comprehensive inspection of semiconductor modules, in which multiple chips of different standards are mounted on a board with internal wiring and can operate as a module, is performed to improve inspection accuracy. It is essential to electrically contact the probe bottle with high precision to the electrode pad provided corresponding to the electrode of It is necessary to respond flexibly to these issues.

In addition, recent LSI chips, etc., tend to generate more heat when energized due to higher integration and faster processing speeds, and require electrical contact with precision on the order of tens of micrometers. In testing semiconductor modules, it is very important to prevent electrode pads from shifting due to heat generation in order to improve testing accuracy. For example, semiconductor ueno＼
In blow μ, etc., where chips formed on the test piece are inspected, a cooling jacket is installed inside the holding part of the semiconductor wafer 1 to be inspected, and the test is carried out at a temperature that corresponds to the environment in which the chip is used. However, such cooling methods do not have enough cooling effect to suppress operational heat generation, and the inspection accuracy is particularly difficult to obtain for chips mounted on ceramic substrates, etc., such as the semiconductor module mentioned above. No cooling effect can be expected for maintenance.

In this way, in order to accurately and quickly test a semiconductor module configured with multiple standard chips, it is necessary to obtain highly accurate electrical contact with each chip. It is particularly important to prevent misalignment due to heat generation during operation, and there is a strong desire to develop a semiconductor module inspection device that satisfies such requirements.

(Problems to be Solved by the Invention) The present invention has been made to satisfy these demands. The purpose of the present invention is to provide an inspection device that can make electrical contact with a high degree of accuracy, maintain high inspection accuracy and high inspection efficiency, and downsize the device.

[Structure of the Invention] (Means for Solving the Problem) In order to achieve the above object, the inspection device of the present invention has x-
In an inspection device that positions an inspection terminal using a stage movable in the y-z direction and performs an inspection by bringing the inspection terminal into contact with an electrode terminal of a board that is an object to be inspected, a non-conductive tube for immersing the object to be inspected is used. A liquid tank having an air outlet opening at one end face and blowing out air in the Z direction at the circumferential edge of this opening, and a liquid tank having an opening and having an an X stage disposed so as to be movable in the direction; a Y stage having an opening of the same size as the X stage and disposed on the X stage so as to be movable in the Y direction;
It has a Z stage movably arranged in the Z direction within the openings of the Y stage and the X stage, and an air outlet that blows out air in the Z direction. It has an X seal that covers it with a small gap, and an air outlet that blows air in the X and Y directions toward the center that is covered with a small gap by the Z stage, and is attached to the bottom of the Y stage. It is equipped with a Z seal that covers the air outlet of the seal with a small gap.

(Function) In the inspection device of the present invention, air is blown from the X seal, the Z seal, and the air outlet of the liquid tank into the gaps between the x, y, and z stages and between the liquid tank and the X stage. Since an air curtain is formed by the wind pressure of air to close the opening of the liquid tank, it is possible to realize a three-dimensional air seal structure, thereby reducing the space required on a plane.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

1 and 2 are diagrams schematically showing the configuration of an inspection apparatus according to an embodiment of the present invention, in which an apparatus main body 1 transports and inspects a semiconductor module 2, which is a test object, in a non-conductive liquid. An inspection unit 1 that performs a predetermined inspection of the work 3 that has been brought into a possible state.
0, and a contact terminal supply unit 20 that accommodates a plurality of inspection contact terminals corresponding to a plurality of semiconductor elements (hereinafter referred to as chips) mounted on the semiconductor module 2, and performs replacement and alignment of these contact terminals. The main body of the device 1
A work loader section 30 for loading and unloading the workpiece 3 is removably installed at the end of the inspection section 10 side. Moreover, on the apparatus main body 1 and the work loader part 30, there are arranged parts that are movable along the parallel direction (hereinafter referred to as the X direction) of the work loader part 30, the inspection part 10, and the contact terminal supply part 20, respectively. Workpiece conveyance mechanism 40
and a contact terminal moving mechanism 50 are mounted.

The work 3 is, for example, as shown in FIG. 3, a semiconductor module 2 is attached to the bottom of a semiconductor module 2 configured by bonding a plurality of chips 2a onto a multilayer ceramic substrate 2b having internal wiring. A socket 4 and a socket board 5 are electrically contacted with each of the input/output pins (not shown), and a support board 8 is provided as a clamp part with a liquid-tight seal formed on the outer circumferential side of the semiconductor module 2 by a presser plate 6 and an O-ring 7. It is arranged and configured. Although not shown, measurement electrode pads are provided around the chip 2a, and the multilayer ceramic substrate 2b
Alignment targets are provided at three corners on the top surface, thermal expansion correction targets are provided at two diagonal corners on the bottom surface, and positioning holes are provided at the four corners of the support board 8.

The inspection section 10 includes a tank outer wall 11a and a tank inner wall 11b protruding from the upper surface side of the inspection section base 11 installed on the base 1a of the apparatus main body 1, and a lip formed of, for example, neoprene rubber. shaped workpiece mounting table 12 and workpiece 3
The workpiece 3 is held against the workpiece mounting table 12 by the clamp 14.
They are tightly secured to form a liquid-tight seal. and,
The work 3 is immersed in the non-conductive inert liquid 15 injected into the liquid 13, and the inspection is performed in that state.

In addition, inside the inspection unit base 11, there are a tank outer wall 11a and a tank inner wall 1.
A discharge pipe 16a for overflowing the non-conductive liquid 15 and a discharge pipe 16b for replacing the workpiece are provided between the pipe 1b and the workpiece 1b, and each is connected to a cooling mechanism (not shown). Further, a workpiece set includes a number of pogo pins (not shown) that are inserted into the socket board 5 of the workpiece 3 and make an electrical connection below the opening of the workpiece mounting table 12. A base unit 17 is arranged.

Further, depending on the formation position of a pair of thermal expansion correction targets provided on the lower surface of the ceramic substrate 2b of the workpiece 3, the lower alignment cameras 18a, 18b and the transfer of the workpiece 3 between the workpiece transport mechanism 40 and the workpiece mounting table 12 are performed. One workpiece transfer pin that can be raised and lowered is provided. Here, the lower alignment cameras 18a and 18b are constructed by integrating a camera body 1sC, a borescope 18d1, an adapter 18e, and a CCD camera 18f in this order.

The borescope 18c is fixed by bolts to a fixing part 18g attached to the lower surface of the workpiece mounting table 12 and to a fixing part 18j attached to the support members 18h and 18i.

The long collar 18 is fixed to the borescope with adhesive. In addition, the borescope 18c has a male thread 18.
A handle 18m and a collar 18n having a handle 18m and a collar 18n are attached, and the male thread 181 thereof meshes with the female thread 18p formed in the fixing part 18''.

When the handle 18m is rotated, the lower alignment cameras 18a and 18b move in the vertical direction.

Further, the contact terminal supply section 20 includes a plurality of pin blocks 21 in which probe pins are implanted according to the shape and pitch of the 71#I standard electrode pads formed around the chip 2a mounted on the semiconductor module 2. The pin block changer 22 includes a plurality of pin block changers 22, for example, nine pin block changers 22, each of which individually holds the pin block changers 22, and a pin block correction camera 23 that confirms the position of the pin block 21 passed to the contact terminal moving mechanism 50 side.

The pin block changer 22 includes a pin block 21
and a cylinder mechanism 25, for example, which raises the holding part 24 toward the contact terminal moving mechanism 50 side, and individually raises the pin blocks 21 to be used according to the inspection program. It is supplied to the contact terminal moving mechanism 50.

The workpiece conveyance mechanism 40 is movable along the X direction, and the contact terminal movement mechanism 50, like the workpiece conveyance mechanism 40, has an opening shape mounted on the stage guides 30a and lb. X stage 51, a mouth-shaped Y having the same opening area arranged on this X stage.
Measurement in which the chuck part 54 of the bottle block 21 fixed to the Z stage 53 and the upper alignment camera 55 are installed by the stage 52 and the Z stage 53 arranged in the openings of the X stage 51 and Y stage 52. The portion 56 is configured to be movable in the x-y-z directions, and the chuck portion 54 is rotatable by a θ drive mechanism (not shown). Then, the bottle block 21 held by the chuck section 54 is lowered into the liquid tank 13 of the inspection section 10 by the Z stage 53, and
Contact is made with the workpiece 3 immersed in the liquid bath 13.

Here, the vapor seal structure of the liquid tank 13 will be explained.

For example, as shown in FIGS. 4 and 5, an air outlet 11c for blowing air in the Z direction is formed in the outer wall 11a of the liquid tank 13 at its peripheral end. A tube lle communicates with the air outlet lie through a pore 11d.

Reference numeral 51b denotes a mouth-shaped X seal having an air outlet 51a that blows out air in the Z direction, and this X seal 51b is attached to the bottom of the X stage 51.

An X wing 51c extending in the X direction with the X seal 51b sandwiched therebetween is attached to the side surface of the X seal 51b.

Reference numeral 53b is a Z-shaped seal having an air outlet 53a that blows air toward the center in the X and Y directions. A Yg 52b extending in the Y direction with the Z seal 53b sandwiched therebetween is attached to the side surface of the Z seal 53b.

Xg51c is the air outlet 1 on the tank outer wall 11a.
1c, the YW 52b is arranged so as to cover the air outlet 51a of the X seal 51b, respectively. Also Z
The air outlet 53a of the seal 53b for the JFI
It is covered by the side surface of the fixed part 56.

Further, each air outlet 11c, 51. The gaps between a, 53a and the side surfaces of the X blade 51c, Y blade 52b5, and measuring portion 56 are set to 1 mo+ or less, thereby increasing the wind eve in each gap.

A non-conductive inert liquid introduction pipe 57 connected to a cooling mechanism (not shown) is disposed close to the chuck part 54 in the Njl fixing part 56, and a bottle is provided in the upper part of the chuck part 54. A touch plate connected to the block 21 and a tester (not shown) is arranged, and the touch plate establishes an electrical connection between the bottle block 21 and the tester.

Regarding the inspection procedure in the semiconductor inspection equipment with the above configuration,
This will be explained below with reference to FIG.

First, the work 3 is placed in the work accommodating portion 32a of the work setting table 32 in the work loader part 30, and the work setting table 32 is driven to move the work 3 to the delivery position above the work lifting mechanism 33. . Next, the lifting table 33a of the workpiece lifting mechanism 33
While positioning the workpiece 3, the workpiece conveyor fg4
0 to the holding part 41 position. After confirming that the workpiece 3 has risen, the workpiece 3 is held by the pair of pawls 42 of the holding section 4 (FIG. 6-a).

Next, the work transport mechanism 40 is driven to transport the work 3 to the work transfer position above the work mounting table 12 of the inspection section 10. At this time, the contact terminal moving mechanism 50 moves toward the contact terminal supply section.

The workpiece 3 transported to the workpiece delivery position is inspected by the inspection section 10
The workpiece is transferred onto the workpiece transfer bin 19 raised from the side. At this time, the tip of one workpiece transfer bin is pushed into positioning holes provided at the four corners of the support board 8 for the workpiece 3, and the workpiece 3 is positioned. After that, the workpiece transfer bin 19 is lowered, the workpiece 3 is placed on the workpiece mounting table 12, and the workpiece transfer bin 19 is placed on the workpiece mounting table 12 by the clamp 14.
The socket board 5 of the workpiece 3 is electrically connected to the workpiece set base unit 17 on the inspection section 10 side (FIG. 6-b). At this time, the initial position of the thermal expansion correction target provided on the lower surface of the multilayer ceramic substrate 2b of the workpiece 3 is recognized by the lower alignment cameras 18a and 18b.

Before and after setting workpiece 3, set bin block 2.
1 is installed. First, the contact terminal moving mechanism 50 is attached to the bin block changer 22 holding the bin block 21 corresponding to the chip 2a to be inspected first, automatically according to the inspection program.
The X stage 51 and the Y stage 52 are driven so that the chuck portion 54 is positioned. When the chuck part 54 reaches the delivery position of the bottle block 21, the cylinder mechanism 25 of the bottle block changer 22 rises, and the bin block 21 is held by the chuck part 54 (
Figure 6-b).

After that, the bin block correction camera 23 captures an image of the holding state of the bin block 21, and after confirming the position with the upper alignment camera 55, the contact terminal moving mechanism 50 moves upward to the inspection section]0. .

Next, the contact terminal moving mechanism 5 has moved upward to the inspection section 10.
The upper alignment camera 55 arranged in the measuring section 56 of 0
Accordingly, the work 3 and the bin block 21 are aligned. In this alignment, first, the upper alignment camera 55 images the surface of the multilayer ceramic substrate 2b and recognizes the position of the alignment target provided at the triangular corner as the position coordinate on the X-Y stage on the contact terminal moving mechanism 50 side. Then, the position of each chip 2a based on the alignment target position input in advance is determined as the position coordinates of the XY stage. Then, according to the position coordinates of the chip 2a, the bin block 2
1 is determined, and the X stage 51 and Y stage 52
and ゛The chip 2 is driven by the θ drive mechanism (not shown).
Alignment is performed between the measurement electrode pads formed around a and the probe bottle implanted in the bottle block 21.

At the same time as this alignment, for example, a fluorine-based inert liquid is supplied into the liquid tank 13 from the non-conductive inert limb introduction pipe 57, and the workpiece 3 is immersed in the non-conductive inert liquid 15. .

After that, while supplying the non-conductive liquid 15 onto and around the chip 2a to be measured, the Z stage 53 is driven to lower the measuring unit 56, and the probe bottle of the bottle block 21 is immersed in the non-conductive liquid 15. While soaking, 1lll
Contact the single layer electrode pad. Then, a test voltage is supplied to the semiconductor module 2 to test the chip 2a (
Fig. 6-C) At this time, each air outlet 11c, 51
a.

When air is blown out from 53a, the wind pressure is increased in each gap, so that the non-conductive inert liquid 15, for example, the vapor of Fluorinert, turns into liquid Il! Contained within 13.

According to the inspection device of this embodiment, the vapor of the non-conductive inert lubricant is confined in the liquid tank by the x, y, and z stages arranged in a stacked manner. Compared to the conventional structure in which X- and Y-axis seals are performed on a plane, the space on one plane can be made smaller.

The reason why seal mechanisms for XSY and Z are provided separately in the inspection apparatus according to this embodiment is that space can be saved in terms of structure. That is, a sealing mechanism that can move in the X and Y directions on the same plane requires less space in the Z direction, but requires space in the X and Y directions, which affects the overall size of the device.

[Effects of the Invention] As explained above, according to the inspection device of the present invention, it is possible to make high-precision electrical contact with each object to be inspected provided on a board, taking into consideration operational heat generation, It is possible to downsize the device while maintaining high inspection accuracy and high inspection efficiency.

[Brief explanation of drawings]

1 and 2 are diagrams schematically showing the configuration of a semiconductor inspection device according to an embodiment of the present invention, and FIG. 3 is a workpiece that fixes a semiconductor module to be inspected by the semiconductor inspection device so that it can be transported and inspected. FIG. 4 is a perspective view showing the vapor seal structure of the semiconductor inspection equipment of FIG. 1, and FIG.
The figure is a cross-sectional view showing the function of the steam seal structure, and Figure 6 (
a) to (c) are diagrams for explaining the inspection procedure. DESCRIPTION OF SYMBOLS 1...Device body, 1a...Base, 2...Semiconductor module, 2a...Chip, 3...Work, 4...
Socket, 5... Socket board, 8... Support board, 10... Inspection section, lla... Tank outer wall, ll
c, 51a. 53a... Air outlet, 12... Workpiece mounting table, 13... Liquid tank, 14... Clamp, 15... Non-conductive inert liquid, 21... Pin block, 30...
・Work loader section, 40... Work conveyance mechanism, 50.
...Contact terminal moving mechanism, 51...X stage, 51b
...X seal, 51cmX14.52 b-Y wing,
53 b-Z Lu.

Claims (1)

[Claims] In an inspection apparatus that positions an inspection terminal by a stage movable in the X-Y-Z direction and performs an inspection by bringing the inspection terminal into contact with an electrode terminal of a substrate that is an object to be inspected, for immersing the object to be inspected. A liquid tank is provided with a non-conductive cooling liquid, and has an air outlet opening at one end surface and blowing out air in the Z direction at the circumferential edge of the opening, and An X stage disposed on the tank so as to be movable in the X direction, a Y stage having an opening of the same size as the X stage and movable in the Y direction on the X stage, and this Y stage. and a Z stage movably disposed in the opening of the X stage in the Z direction, and an air outlet that blows out air in the Z direction, which is attached to the X stage and has an air outlet of the liquid tank. an X seal that covers with a small gap, and an air outlet that blows air in the X and Y directions toward the center covered with a small gap by the Z stage, and is attached to the bottom of the Y stage,
An inspection device comprising: a Z seal that covers the air outlet of the X seal with a small gap.