JP2023048650A - Inspection device and inspection method - Google Patents

Abstract

To provide an inspection device and an inspection method for accurately aligning the positions of a substrate electrode and a probe.SOLUTION: A plurality of first targets 103 are provided to a probe card 100 and the same number of second targets 71 as the number of the first targets 103 are provided to a placement member. A detection unit is further provided. A control unit executes steps of: acquiring, using a first acquisition unit, the representative position of a probe 102 relative to a reference probe position; moving the placement member to a region below a second acquisition unit located in a region that does not overlap in a plan view with the probe card held by a holding unit and acquiring, using the second acquisition unit, the representative position of an electrode relative to a reference electrode position; acquiring a matching position where all of the first targets simultaneously come to have a prescribed positional relationship in a plan view with the second target 71 that corresponds to the first target; and acquiring a contact position at which the probe and the electrode are brought into contact with each other on the basis of the representative position of the probe 102 and the representative position of the electrode, and correcting the contact position on the basis of the matching position.SELECTED DRAWING: Figure 4

Description

The present disclosure relates to an inspection device and an inspection method.

Patent Document 1 discloses a probe card having a probe detection chamber which is formed in line with an inspection chamber for conducting an electrical characteristic inspection of a semiconductor wafer and has a supporting member which is detachably mounted while positioning the probe card at a predetermined position. A detection device is disclosed. This device comprises at least two components: a probe card positioned and mounted on the predetermined position of the support via a first holder; and the probe card movably provided in the probe detection chamber. and a first imaging device that detects the tip of the probe. Further, the probe card detection device is detachably attached to the predetermined position of the support by positioning it via a second holder instead of the probe card, and corresponds to the at least two probes. a probe compensation card having at least two targets. Differences between the horizontal positions of the tips of the at least two probes and the horizontal positions of the at least two targets are detected by the first imaging device in the probe detection chamber. The difference is detected as a correction value for aligning at least two probes of the probe card and at least two electrode pads of the semiconductor wafer in the inspection room.

JP 2014-75420 A

The technology according to the present disclosure more accurately aligns electrodes provided on a substrate and probes of a probe card in an inspection apparatus that inspects a substrate.

One aspect of the present disclosure is an inspection apparatus for inspecting a substrate, comprising: a mounting member on which the substrate is mounted; a holding unit that holds a probe card having probes that contact electrodes on the substrate; a moving mechanism for holding and moving a member in horizontal and vertical directions; a first acquisition unit fixed to the moving mechanism for acquiring the position of the probe; a second acquisition unit for acquiring the position of the electrode; is provided with the same number of second targets as the first targets, further comprising a detection unit for simultaneously detecting the first targets and the second targets corresponding to the first targets, the control unit is a step of acquiring a representative position of the probe with respect to the probe reference position using the first acquisition unit; a step of moving the mounting member to a region below an acquisition unit and using the second acquisition unit to acquire a representative position of the electrode with respect to the electrode reference position; A step of acquiring a matching position at which a first target simultaneously has a predetermined positional relationship with the second target corresponding to the first target in a plan view; and based on the representative position of the probe and the representative position of the electrode. and acquiring a contact position, which is the position of the mounting member when the probe and the electrode are brought into contact, and correcting the contact position based on the matching position.

According to the present disclosure, in an inspection apparatus that inspects a substrate, it is possible to more accurately align the electrodes provided on the substrate and the probes of the probe card.

It is a cross-sectional view showing the outline of the configuration of the inspection apparatus according to the present embodiment. It is a longitudinal section showing an outline of composition of an inspection device concerning this embodiment. FIG. 3 is a side cross-sectional view of an inspection area; FIG. 4 is a cross-sectional view of the periphery of the pogo frame; It is a bottom view of a probe card. 4 is a top view of the chuck top 70; FIG. It is a figure for demonstrating the determination method of the contact position concerning a form of comparison. FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment; FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment; FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment; FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;

In a semiconductor manufacturing process, a large number of semiconductor devices having predetermined circuit patterns are formed on a semiconductor wafer (hereinafter referred to as "wafer"). The semiconductor devices thus formed are inspected for electrical characteristics and the like, and sorted into non-defective products and defective products. Semiconductor devices are inspected, for example, by using an inspection apparatus in a state of a wafer before being divided into semiconductor devices.

An inspection apparatus is provided with a probe card having a large number of probes, which are needle-like contact terminals. When inspecting the electrical characteristics, first, the wafer and the probe card are brought close to each other, and the probes of the probe card contact each electrode of the semiconductor device formed on the wafer. In this state, an electrical signal is supplied to the semiconductor device through each probe from a tester provided above the probe card. Based on the electrical signal received by the tester from the semiconductor device via each probe, it is determined whether or not the semiconductor device is defective.

In order to appropriately perform such electrical property inspection, the inspection apparatus aligns the probe card and the wafer, more specifically, aligns the probes with the electrodes on the wafer. In recent years, as electronic devices have become more integrated and electrodes have become smaller, it has become necessary to perform the above-described alignment more accurately.

The technology according to the present disclosure provides a substrate inspection apparatus that can more accurately align electrodes on a substrate and probes of a probe card.

An inspection apparatus and an inspection method according to the present embodiment will be described below with reference to the drawings. In the present specification and drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, thereby omitting redundant description.

<Inspection device>
1 and 2 are a cross-sectional view and a vertical cross-sectional view, respectively, showing the outline of the configuration of the inspection apparatus according to this embodiment. Note that FIG. 2 shows only part of an aligner, which will be described later.

The inspection apparatus 1 shown in FIGS. 1 and 2 inspects a wafer W as a substrate, and more specifically, inspects the electrical characteristics of semiconductor devices formed on the wafer W as devices to be inspected. be. The inspection apparatus 1 has a housing 10 , and the housing 10 is provided with a loading/unloading area 11 , a transport area 12 and an inspection area 13 . The loading/unloading area 11 is an area where the wafer W is loaded/unloaded to/from the inspection apparatus 1 . The transport area 12 is an area that connects the loading/unloading area 11 and the inspection area 13 . Also, the inspection area 13 is an area where the electrical characteristics of the semiconductor devices formed on the wafer W are inspected.

The loading/unloading area 11 is provided with a port 20 for receiving a cassette C housing a plurality of wafers W, a loader 21 housing a probe card described later, and a control unit 22 for controlling each component of the inspection apparatus 1. there is The control unit 22 is configured by a computer having a CPU, a memory, etc., and has a storage unit (not shown) that stores various information. The storage unit stores, for example, programs for realizing inspection processing and the like. The program may be recorded in a computer-readable storage medium and installed in the control unit 22 from the storage medium. The storage medium may be temporary or non-temporary. Part or all of the program may be realized by dedicated hardware (circuit board). The storage unit is, for example, a storage device such as an HDD, a memory such as a RAM that temporarily stores necessary information related to program calculation, or a combination thereof.

In the transfer area 12, a transfer device 30 that can freely move while holding a wafer W or the like is arranged. The transfer device 30 transfers the wafer W between the cassette C in the port 20 of the loading/unloading area 11 and the inspection area 13 . Further, the transport device 30 transports probe cards fixed to a pogo frame, which will be described later, in the inspection area 13 and requiring maintenance to the loader 21 in the loading/unloading area 11 . Further, the transport device 30 transports new or maintained probe cards from the loader 21 into the inspection area 13 .

A plurality of testers 40 are provided in the inspection area 13 . Specifically, for example, as shown in FIG. 2, the inspection area 13 is divided into three in the vertical direction, and four testers arranged in the horizontal direction (the X direction in the drawing) are arranged in each divided area 13a. A train of 40 testers is provided. Further, each divided area 13a is provided with an aligner 50 as one moving mechanism and one upper camera 60. As shown in FIG. The number and arrangement of the tester 40, the aligner 50, and the upper camera 60 can be arbitrarily selected.

The tester 40 transmits and receives electrical signals to and from the wafer W for electrical characteristic inspection.
The aligner 50 holds a chuck top 70, which will be described later, and moves it in the horizontal direction (the X direction and the Y direction in FIG. 1, the θ direction around the Z axis in the drawing) and the vertical direction (the Z direction in the drawing). is configured to allow The aligner 50 is also used for alignment between the wafer W placed on the chuck top 70 and probes of a probe card, which will be described later.

The upper camera 60 is provided so as to image the downward direction. In one embodiment, the upper camera 60 is configured to be horizontally movable. The upper camera 60 is positioned, for example, in an area in front of each tester 40 in the inspection where the upper camera 60 is provided, and in an area that does not overlap a probe card held by a pogo frame, which will be described later, in plan view. , the wafer W placed on the chuck top 70 on the aligner 50 is imaged.
Note that the upper camera 60 is controlled by the control unit 22 . In addition, the result of imaging by the upper camera 60 is output to the control section 22 .

The chuck top 70 is an example of a mounting member, and the wafer W is mounted thereon. The chuck top 70 can hold, for example, the mounted wafer W by suction or the like.

In this inspection apparatus 1, while the transfer apparatus 30 is transferring the wafer W toward one tester 40, the other tester 40 tests the electrical characteristics of the electronic devices formed on the other wafer W. be able to.

<Inspection area>
Next, a more detailed configuration of the inspection area 13 will be described with reference to FIGS. 3 to 6. FIG. FIG. 3 is a side sectional view of the inspection area 13. As shown in FIG. FIG. 4 is a cross-sectional view of the periphery of a pogo frame, which will be described later. FIG. 5 is a bottom view of a probe card which will be described later. In FIG. 5, the illustration of probes, which will be described later, is omitted. FIG. 6 is a top view of the chuck top 70. FIG.

Each divided area 13a of the inspection area 13 is provided with the aligner 50 and the upper camera 60 as described above. As shown in FIG. 3, each divided area 13a is provided with a lower camera 80, a pogo frame 90, and a probe card 100, which will be described later.

The aligner 50 has an X stage 51, a Y stage 52 and a Z stage 53, for example.

The X stage 51 moves along the guide rails 51a in the X-axis direction that constitutes the coordinate system of the movement plane (XY plane) of the aligner 50 . The X stage 51 is provided with a position detection mechanism (not shown) for detecting the position of the X stage 51 in the X direction, that is, the position of the chuck top 70 in the X axis direction. The position detection mechanism is, for example, a linear encoder.

The Y stage 52 moves on the X stage 51 . Specifically, it moves along the guide rails 52a in the Y-axis direction that constitutes the coordinate system of the movement plane (XY plane) of the aligner 50 . The Y stage 52 is provided with a position detection mechanism (not shown) for detecting the position of the Y stage 52 in the Y axis direction, that is, the position of the chuck top 70 in the Y axis direction. The position detection mechanism is, for example, a linear encoder.

The Z stage 53 moves in the height direction (Z direction) by means of an extensible shaft 53a that can extend and contract in the height direction (Z direction) perpendicular to the movement plane (XY plane) of the aligner 50 . The Z stage 53 is provided with a position detection mechanism (not shown) for detecting the position of the Z stage 53 in the Z direction, that is, the position of the chuck top 70 in the Z direction. The position detection mechanism is, for example, a linear encoder.
Also, the chuck top 70 is detachably held by suction on the Z stage 53 . The chuck top 70 is held by the Z stage 53 by vacuum suction or the like by a suction holding mechanism (not shown).

The lower camera 80 is an example of a first acquisition unit, and is used to acquire representative positions of probes, which will be described later, provided on the probe card 100 . Also, the lower camera 80 is an example of a first imaging unit, and captures an upward image. Note that the above-described upper camera 60 is an example of a second acquisition unit, and is for acquiring the representative position and the like of the wafer W placed on the chuck top 70 on the aligner 50 . Also, the upper camera 60 is an example of a second imaging section, and captures an image of the downward direction as described above.

A lower camera 80 is fixed to the aligner 50 . Specifically, the lower camera 80 is fixed to the Z stage 53 of the aligner 50 . Being fixed in this way, the lower camera 80 can be moved together with the chuck top 70 by the aligner 50 .
The lower camera 80 is positioned, for example, in an area below the probe card 100 fixed to the pogo frame 90 and images the probe card 100 .

Note that the aligner 50 and the lower camera 80 are controlled by the control section 22 . In addition, the result of imaging by the lower camera 80 and the result of position detection by the position detection mechanisms provided on the X stage 51 , Y stage 52 and Z stage 53 are output to the control section 22 .

The tester 40 has a tester motherboard 41 at its bottom, as shown in FIG. A plurality of inspection circuit boards (not shown) are mounted on the tester motherboard 41 in an upright state. A plurality of electrodes (not shown) are provided on the bottom surface of the tester motherboard 41 .
Furthermore, a pogo frame 90 is provided below the tester 40 .

The pogo frame 90 is an example of a holding section and holds the probe card 100 . Also, the pogo frame 90 electrically connects the probe card 100 and the tester 40 . This pogo frame 90 has pogo pins 91 for the electrical connection described above, and more specifically, has a pogo block 92 that holds a large number of pogo pins 91 .
A probe card 100 is fixed to the lower surface of the pogo frame 90 while being aligned at a predetermined position.

The tester motherboard 41 is vacuum-sucked to the pogo frame 90 by an exhaust mechanism (not shown), and the probe card 100 is vacuum-sucked to the pogo frame 90 . The lower end of each pogo pin 91 of the pogo frame 90 is brought into contact with the corresponding electrode on the upper surface of the card body 101 of the probe card 100, and the upper end of each pogo pin 91 is It is pressed against the corresponding electrodes on the underside of the tester motherboard 41 .

The probe card 100 has a disk-shaped card body 101 with a plurality of electrodes provided on its upper surface. A plurality of probes 102, which are needle-like contact terminals extending downward, are provided on the lower surface of the card body 101. As shown in FIG.
The plurality of electrodes provided on the upper surface of the card body 101 are electrically connected to corresponding probes 102, respectively. During inspection, the probes 102 are brought into contact with electrodes P (see FIG. 6) of semiconductor devices formed on the wafer W, respectively. Therefore, during the electrical characteristic inspection, electrical signals for inspection are transmitted and received between the tester mother board 41 and the semiconductor devices on the wafer W via the pogo pins 91, the electrodes provided on the upper surface of the card body 101, and the probes 102. be done.

Note that the inspection apparatus 1 is provided with a large number of probes 102 so as to cover substantially the entire lower surface of the card body 101 in order to collectively inspect the electrical characteristics of a plurality of semiconductor devices formed on the wafer W.

A bellows 93 is attached to the lower surface of the pogo frame 90 . The bellows 93 is a tubular extendable member that hangs down so as to surround the probe card 100 . Also, the bellows 93 attracts and holds the chuck top 70 at a position below the probe card 100 as indicated by the dotted line in FIG.

The bellows 93 sucks and holds the chuck top 70 to form a closed space S surrounded by the pogo frame 90 including the probe card 100 , the bellows 93 and the chuck top 70 . The contact state between the wafer W and the probes 102 can be maintained by decompressing the sealed space S with a decompression mechanism (not shown).

Furthermore, in the present embodiment, a plurality of first targets 103 are provided on the lower surface of the card body 101 of the probe card 100 as shown in FIGS. 4 and 5 in addition to the probes 102 . The first target 103 is a mark for aligning the wafer W and the probe card 100 . The shape of each first target 103 in plan view is, for example, circular. Further, the first targets 103 are provided at equal intervals on the same circumference around the center of the probe card 100, for example, in a region R2 surrounding the outside of the region R1 where the probes 102 are formed.
The number, shape and arrangement of the first targets 103 are arbitrary as long as the purpose of providing the first targets 103 can be achieved.

Further, in this embodiment, as shown in FIG. 6, the same number of second targets 71 as the first targets 103 are provided on the upper surface of the chuck top 70 . The second target 71 , like the first target 103 , is a mark for aligning the wafer W and the probe card 100 . The shape of each second target 71 in plan view is circular, for example. Further, the second targets 71 are provided at equal intervals on the same circumference around the center of the chuck top 70, for example, in a region R12 surrounding the outside of the region R11 on which the wafer W is placed.
The number, shape and arrangement of the second targets are arbitrary as long as the purpose of providing the second targets can be achieved.

Also, the first target 103 and the second target 71 are provided as follows. That is, the first targets 103 and the second targets 71 are provided so that all the first targets 103 can simultaneously have a predetermined positional relationship with the second targets 71 corresponding to the first targets 103 in plan view. there is Specifically, for example, all the first targets 103 can simultaneously overlap the second targets 71 corresponding to the first targets 103 in plan view (more specifically, their centers are aligned). ), a first target 103 and a second target 71 are provided.

Furthermore, in this embodiment, as shown in FIG. 4, a reference matching camera 110 is provided for each second target 71, that is, each first target 103. FIG.
The reference matching camera 110 is an example of a detection unit, and is for detecting the corresponding first target 103 and the second target 71 corresponding to the first target 103 at the same time. Also, the reference alignment camera 110 is an example of a third imaging unit, is provided at a position below the second target 71 in the aligner 50, and images the upper side.

In order to allow the first target 103 and the second target 71 to be photographed simultaneously by the reference camera 110 and to keep the sealed space S sealed, the first target 103 and the reference camera 110 are arranged as follows. is provided.

That is, the chuck top 70 is formed with a through hole 72 penetrating vertically. The through hole 72 is closed with a window member 73 made of a material transparent to the light used for imaging by the reference alignment camera 110 . A second target 71 is provided on the window member 73 , and the reference alignment camera 110 images the second target 71 and the first target 103 through the through hole 72 . In one embodiment, second target 71 is made smaller than first target 103 so that fiducial camera 110 can image first target 103 through second target 71 . Further, in one embodiment, the second target 71 may be formed in a ring shape having a hole in the center in plan view, and the reference alignment camera 110 may image the first target 103 through the hole.

<How to determine the contact position according to the comparative form>
Next, before explaining the contact position determination method according to the present embodiment, a contact position determination method according to a form different from the present embodiment (hereinafter referred to as a "comparative form") will be described with reference to FIG. will be used to explain. The contact position is the position of the chuck top 70 when the electrodes P of the wafer W supported by the chuck top 70 are brought into contact with the probes 102 .

In the contact position correction method according to the comparison mode, the lower camera 80 is used to obtain the representative position of the probe 102 with respect to the probe reference position. The representative position of the probe 102 with respect to the probe reference position is, in other words, the representative position of the probe 102 in the coordinate system based on the imaging by the lower camera 80 .

In addition, using the upper camera 60 located in an area not overlapping the probe card 100 held by the pogo frame 90 in plan view, a representative image of the electrodes P on the wafer W placed on the chuck top 70 with respect to the electrode reference position is detected. A position is obtained. The representative position of the electrode P with respect to the electrode reference position is, in other words, the representative position of the electrode P in the coordinate system based on the imaging by the upper camera 60 .

Further, information for associating the probe reference position with the electrode reference position, that is, information for associating the coordinate system based on the imaging by the lower camera 80 and the coordinate system based on the imaging by the upper camera 60 is acquired. Specifically, as shown in FIG. 7, an area below the upper camera 60 (hereinafter referred to as an "alignment area") is located in an area that does not overlap the probe card 100 held by the pogo frame 90 in plan view. A, the lower camera 80 is moved. Also, the same target 500 is imaged by the upper camera 60 and the lower camera 80, and information on the position of the Z stage 53 at that time is acquired as information for associating the probe reference position with the electrode reference position.

Then, the contact position is determined based on the obtained representative position of the probe 102 with respect to the probe reference position, the representative position of the electrode P with respect to the electrode reference position, and information for associating the probe reference position with the electrode reference position. be done.

However, the housing 10 in which the aligner 50 is installed is distorted on the order of μm due to expansion or contraction due to changes in the temperature of the housing 10, changes in the centers of gravity of the plurality of aligners 50 within the housing 10, and the like. Also, when the information for associating the probe reference position and the electrode reference position is acquired, that is, when the lower camera 80 is positioned in the alignment area A, the chuck top 70 and the probe card 100 held by the pogo frame 90 are shown. There is a distance from the chuck top 70 . Therefore, if there is distortion as described above, it may not be possible to appropriately contact the probe 102 and the electrode P at the contact position determined by the method according to the comparative embodiment.

<Inspection processing using inspection device 1>
Next, inspection processing involving contact position determination processing using the inspection apparatus 1 will be described with reference to FIGS. 8 to 11. FIG.

(S1: Import)
First, a wafer W to be inspected is carried into a desired divided area 13a.
Specifically, the transfer device 30 and the like are controlled by the control unit 22 , and the wafer W is taken out from the cassette C in the port 20 of the loading/unloading area 11 , loaded into the middle divided area 13 a , and transferred to the aligner 50 . It is placed on the chuck top 70 which is held by suction.

(S2: Determination of contact position)
Next, the contact position is determined by the control unit 22 .

(S2a: Acquisition of representative position of probe)
When determining the contact position, the controller 22 uses the lower camera 80 to acquire a representative position of the probe 102 with respect to the probe reference position. Specifically, under the control of the control unit 22, the chuck top 70 is moved by the aligner 50 so that the lower camera 80 is positioned in the area below the probe card 100 as shown in FIG. Based on the result and the detection result of the position detection mechanism of the aligner 50, the representative position of the probe 102 with respect to the probe reference position is obtained.

The representative position of the probe 102 is, for example, the center-of-gravity position of the probe 102 at a plurality of predetermined locations. The position (specifically, position coordinates) of each probe 102 is determined based on the output from the position detection mechanism of the aligner 50 when the tip of the probe 102 is positioned at the center of the image obtained by the lower camera 80. can be obtained.

Also, the probe reference position may be determined in advance, and may be, for example, a designed position at the center of the probe card 100 .
In one embodiment, in step S2a, the representative position of the first target 103 of the probe card 100 is acquired as the probe reference position by the controller 22 using the lower camera 80 .
The representative position of the first targets 103 is, for example, the center-of-gravity position of the plurality of first targets 103 . The position of each first target 103 is obtained, for example, based on the output from the position detection mechanism of the aligner 50 when the center of the first target 103 is positioned at the center of the image obtained by the lower camera 80. be able to.

In addition, in the above description, it is stated that "○○ position is acquired", etc., but "○○ position" does not have to be actually acquired. It is sufficient if the information has been acquired. The same applies to the following.

(S2b: Acquisition of representative positions of electrodes)
When determining the contact position, the controller 22 moves the chuck top 70 to the alignment area A as shown in FIG. A position is obtained. Specifically, the representative position of the electrode P with respect to the electrode reference position is acquired based on the imaging result of the upper camera 60 and the detection result of the position detection mechanism of the aligner 50 .

The representative position of the electrode P is, for example, the center-of-gravity position of the electrode P at a plurality of predetermined locations. The position (specifically, position coordinates) of each electrode P is determined based on the output from the position detection mechanism of the aligner 50 when the center of the electrode P is positioned at the center of the image obtained by the upper camera 60. can be obtained.

Also, the electrode reference position may be determined in advance, and may be, for example, a designed position at the center of the chuck top 70 .
In one embodiment, in step S2b, the representative position of the second target 71 on the chuck top 70 is acquired as the electrode reference position by the controller 22 using the upper camera 60 .
The representative position of the second targets 71 is, for example, the center-of-gravity position of the plurality of second targets 71 . The position of each second target 71 is obtained, for example, based on the output from the position detection mechanism of the aligner 50 when the center of the second target 71 is positioned at the center of the image obtained by the upper camera 60. be able to.

(S2c: Acquisition of matching position)
When determining the contact position, the control unit 22 uses the reference matching camera 110 to acquire the matching position. The coincident position is the position of the chuck top 70 when all the first targets 103 simultaneously have a predetermined positional relationship with the second targets 71 corresponding to the first targets 103 in plan view. The “predetermined positional relationship in plan view” refers to, for example, a positional relationship in which the center of the first target 103 overlaps the center of the second target 71 corresponding to the first target 103 in plan view.
In this step S2c, under the control of the control unit 22, the chuck top 70 is moved by the aligner 50 so as to be positioned below the probe card 100 as shown in FIG. A matching position is acquired based on the detection result of the position detection mechanism of the aligner 50 .

(S2d: Acquisition and Correction of Temporary Contact Position)
Then, the contact position is obtained by the control unit 22 based on the representative position of the probe 102 with respect to the probe reference position and the representative position of the electrode P with respect to the electrode reference position, and the contact position is obtained based on the matching position obtained in step S2c. is corrected. That is, the control unit 22 acquires a temporary contact position based on the representative position of the probe 102 with respect to the probe reference position and the representative position of the electrode P with respect to the electrode reference position, and the temporary contact position is obtained in step S2c. The corrected temporary contact position is determined as the contact position. Correcting the tentative contact position based on the matching position means, in other words, that the probe reference position and the electrode reference position are associated with each other. The matching position information is information for associating the probe reference position with the electrode reference position.

Specifically, in this step S2d, as shown in FIG. 11, the control unit 22 corrects the provisional contact position B3 based on the positional deviation D of the matching position B2 from the contact reference position B1. is determined as the contact position B4.

The contact reference position B1 is predetermined, for example.
Further, the contact reference position B1 is set by the control unit 22 as
(1) It may be obtained based on the representative position of the first target 103 of the probe card 100 as the probe reference position and the predetermined electrode reference position,
(2) may be obtained based on a predetermined probe reference position and a representative position of the second target 71 on the chuck top 70 as an electrode reference position;
(3) It may be obtained based on the representative position of the first target 103 of the probe card 100 as the probe reference position and the representative position of the second target 71 of the chuck top 70 as the electrode reference position.

(S3: Movement and lifting of chuck top 70)
When the contact position is determined, the chuck top 70 is moved to the contact position by the controller 22, and then the chuck top 70 is raised. Elevation is performed until the probe 102 and the electrode P are in contact.

In one embodiment, during the ascent, the controller 22 acquires the horizontal positional change of the second target 71 with respect to the probe card 100 using the reference alignment camera 110, and based on the acquired result, the position of the chuck top 70 is determined. is corrected. Specifically, during the ascent, the position change in the horizontal direction is acquired by the control unit 22 using the reference matching camera 110, and the position of the chuck top 70 is corrected from the contact position so as to cancel this position change. be.
For example, a pattern such as a square pattern may be provided around the first target 103 on the probe card 100 so that the change in the horizontal position of the second target 71 with respect to the probe card 100 can be easily obtained.

(Step S4: Adsorption of chuck top 70)
After that, the chuck top 70 is attracted to the pogo frame 90 under the control of the controller 22 .
Specifically, while the electrode P and the probe 102 are in contact with each other, a decompression mechanism (not shown) or the like is controlled, and the Z stage 53 of the aligner 50 is lowered. It is separated from the aligner 50 and attached to the pogo frame 90 .

(Step S5: Inspection)
After the chuck top 70 and the aligner 50 are separated, the electrical characteristics of the electronic devices formed on the wafer W are inspected.
An electrical signal for electrical characteristic inspection is input from the tester 40 to the electronic device via the pogo pins 91, the probes 102, and the like.

(S6. Unloading)
Thereafter, the wafer W after inspection is unloaded.
Specifically, the chuck top 70 sucked to the pogo frame 90 is delivered to and held by the aligner 50 . Also, the inspected wafer W on the chuck top 70 held by the aligner 50 is unloaded from the inspection area 13 by the transport device 30 and returned to the cassette C in the port 20 of the loading/unloading area 11 .
During the inspection by one tester 40 , the aligner 50 transports the wafer W to be inspected to another tester 40 and recovers the wafer W after inspection from the other tester 40 .

<Main effects of the present embodiment>
In this embodiment, the moving distance from the position where the information for associating the probe reference position and the electrode reference position to the contact position is shorter than in the comparison mode. Therefore, even if the housing 10 is distorted as described above, the probes 102 and the electrodes P can be brought into contact with each other more appropriately.

Also, as described above, the representative position of the first target 103 may be used as the probe reference position. Thereby, regardless of the state of the probe card 100, the probes 102 and the electrodes P can be brought into contact more appropriately. For example, even when the probe card 100 expands or contracts due to a temperature change of the probe card 100, the probes 102 and the electrodes P can be properly contacted.

Furthermore, as described above, the representative position of the second target 71 may be used as the electrode reference position. Thereby, the probes 102 and the electrodes P can be brought into more appropriate contact regardless of the state of the chuck top 70 . For example, even when the chuck top 70 expands or contracts due to temperature changes in the chuck top 70 , the probes 102 and the electrodes P can be properly brought into contact with each other.

Further, as described above, while the chuck top 70 is ascending, the horizontal position change of the second target 71 with respect to the probe card 100 is acquired using the reference alignment camera 110, and based on the acquired result, the chuck top 70 is The position may be modified. As a result, the probes 102 and the electrodes P can be properly brought into contact with each other even when the positional change occurs while the chuck top 70 is ascending.

<Modification>
Although the first target 103 is provided on the probe card 100 in the above example, the first target may be provided on the pogo frame 90 . Specifically, the first target may be provided within a region surrounded by the bellows 93 on the lower surface of the pogo frame 90 .

In the above example, the aligner 50 is provided with the reference matching camera 110 for simultaneously detecting the first target 103 and the second target 71, and the first target 103 is imaged through the second target 71. . However, the reference matching camera for the simultaneous detection may be provided on the pogo frame 90 .
In this case, in step S3, while the chuck top 70 is being lifted, the control unit 22 uses the reference alignment camera 110 to acquire the change in the horizontal position of the first target 103 with respect to the chuck top 70, and based on the acquisition result, , the position of the chuck top 70 may be corrected.

It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The embodiments described above may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

1 inspection device 22 control unit 50 aligner 60 upper camera 70 chuck top 71 second target 80 lower camera 90 pogo frame 100 probe card 102 probe 103 first target 110 reference matching camera B2 match position B3 contact position B4 contact position P electrode W wafer

Claims (13)

An inspection device for inspecting a substrate,
a mounting member on which the substrate is mounted;
a holder that holds a probe card having probes that contact electrodes on the substrate;
a moving mechanism that holds the mounting member and moves it horizontally and vertically;
a first acquisition unit fixed to the moving mechanism for acquiring the position of the probe;
a second acquisition unit for acquiring the position of the electrode on the substrate placed on the placement member;
a control unit;
A plurality of first targets are provided on at least one of the probe card and the holding unit,
The mounting member is provided with the same number of second targets as the first targets,
further comprising a detection unit for simultaneously detecting the first target and the second target corresponding to the first target;
The control unit
obtaining a representative position of the probe with respect to the probe reference position using the first obtaining unit;
The mounting member is moved to a region below the second obtaining portion, which is located in a region that does not overlap the probe card held by the holding portion in a plan view, and the second obtaining portion is used to move the electrode. obtaining a representative position of the electrode relative to a reference position;
a step of using the detection unit to acquire matching positions where all of the first targets simultaneously have a predetermined positional relationship with the second targets corresponding to the first targets in a plan view;
A contact position, which is a position of the mounting member when the probe and the electrode are brought into contact, is obtained based on the representative position of the probe and the representative position of the electrode, and the contact position is obtained based on the matching position. an inspection device configured to perform a compensating step; The inspection apparatus according to claim 1, wherein the step of acquiring the representative position of the probe includes the step of acquiring the representative position of the first target as the probe reference position using the first acquisition unit. 3. The inspection apparatus according to claim 1, wherein the step of obtaining the representative position of the substrate includes the step of obtaining the representative position of the second target as the electrode reference position using the second obtaining unit. . 4. The inspection apparatus according to claim 1, wherein said correcting step corrects said contact position based on a positional deviation of said matching position from a contact reference position. The correcting step corrects the contact position based on a positional deviation of the matching position from the contact reference position;
4. The inspection apparatus according to claim 2, wherein said contact reference position is obtained based on said probe reference position and said electrode reference position. The control unit
The inspection apparatus according to any one of claims 1 to 5, further comprising a step of raising the mounting member after moving the mounting member to the corrected contact position. The step of elevating the mounting member includes changing the position of the second target in the horizontal direction with respect to the probe card during elevating, or changing the position of the first target with respect to the substrate during elevating, using the detection unit. 7. The inspection apparatus according to claim 6, further comprising the step of acquiring horizontal position change and correcting said contact position based on the acquired result. The inspection apparatus according to any one of claims 1 to 7, wherein the first acquisition section is a first imaging section that captures an upward image. The inspection apparatus according to any one of claims 1 to 8, wherein the second acquisition section is a second image pickup section that picks up an image below. 10. The inspection apparatus according to any one of claims 1 to 9, wherein said detection unit is a third imaging unit provided below said second target in said moving mechanism and imaging above. The placement member is
a through hole penetrating in the vertical direction;
a window member made of a transparent material that closes the through hole;
The second target is provided on the window member,
11. The inspection apparatus according to claim 10, wherein said third imaging unit images said first target and said second target through said through hole. 10. The inspection apparatus according to any one of claims 1 to 9, wherein said detection unit is a third imaging unit provided above said first target and imaging below. A method for inspecting a substrate with an inspection device, comprising:
The inspection device is
a mounting member on which the substrate is mounted;
a holder that holds a probe card having probes that contact electrodes on the substrate;
a moving mechanism that holds the mounting member and moves it horizontally and vertically;
a first acquisition unit fixed to the moving mechanism for acquiring the position of the probe card;
a second acquisition unit for acquiring the position of the electrode on the substrate placed on the placement member;
A plurality of first targets are provided on at least one of the probe card and the holding unit,
A plurality of second targets corresponding to the first targets are provided on the mounting member,
further comprising a detection unit for simultaneously detecting the first target and the second target corresponding to the first target;
a step of acquiring a representative position of the probe with respect to the probe reference position using the first acquisition unit; a step of moving the placement member to a lower region and acquiring a representative position of the electrode with respect to the electrode reference position using the second acquisition unit;
a step of using the detection unit to acquire matching positions where all of the first targets simultaneously have a predetermined positional relationship with the second targets corresponding to the first targets in a plan view;
A contact position, which is a position of the mounting member when the probe and the electrode are brought into contact, is obtained based on the representative position of the probe and the representative position of the electrode, and the contact position is obtained based on the matching position. and a step of correcting.

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