JPH03269910A - Substrate for high-frequency circuit - Google Patents
Substrate for high-frequency circuitInfo
- Publication number
- JPH03269910A JPH03269910A JP6689390A JP6689390A JPH03269910A JP H03269910 A JPH03269910 A JP H03269910A JP 6689390 A JP6689390 A JP 6689390A JP 6689390 A JP6689390 A JP 6689390A JP H03269910 A JPH03269910 A JP H03269910A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mica
- substrate
- polyphenylene ether
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 27
- 239000010445 mica Substances 0.000 claims abstract description 26
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 19
- 239000011342 resin composition Substances 0.000 claims abstract description 16
- 229920005990 polystyrene resin Polymers 0.000 claims description 23
- 239000000203 mixture Substances 0.000 abstract description 5
- 238000010348 incorporation Methods 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- YGANSGVIUGARFR-UHFFFAOYSA-N dipotassium dioxosilane oxo(oxoalumanyloxy)alumane oxygen(2-) Chemical compound [O--].[K+].[K+].O=[Si]=O.O=[Al]O[Al]=O YGANSGVIUGARFR-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229910052627 muscovite Inorganic materials 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052628 phlogopite Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- WBDVBAABEUKEGA-UHFFFAOYSA-N [Si].[Si].[Si].[Si].[K] Chemical compound [Si].[Si].[Si].[Si].[K] WBDVBAABEUKEGA-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229940035289 tobi Drugs 0.000 description 2
- NLVFBUXFDBBNBW-PBSUHMDJSA-N tobramycin Chemical compound N[C@@H]1C[C@H](O)[C@@H](CN)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O[C@@H]2[C@@H]([C@@H](N)[C@H](O)[C@@H](CO)O2)O)[C@H](N)C[C@@H]1N NLVFBUXFDBBNBW-PBSUHMDJSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 poly(2,6-dimethyl-1,4-phenylene) Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
し産業上の利用分野］
本発明は、衛星放送受信平面アンテナ用基板等に好適な
高周波回路用基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high frequency circuit board suitable for a satellite broadcast receiving flat antenna board and the like.
衛星放送受信平面アンテナ用基板のようなマイクロ波帯
域で用いられる高周波回路用基板では、基板材料の誘電
正接か大きいと信号の伝送ロスも大きくなることから、
誘電正接が小さく、かつ寸法安定性の優れた材料が要求
される。そこで、これらの用途には、従来、誘電特性に
優れたフン素樹脂やポリオレフィンを素材とし、寸法安
定性を改良した基板が用いられてきた。しかしながら、
これらは極めて高価なものであることから民生用アンテ
ナ基板に適用するのは難しく、誘電特性；よ劣るが寸法
安定性に優れたＰＥＴフィルム基板を採用せざるを得な
い場合も多かった。また、その他の基板として特開昭６
２−１２１７５８号公報に見られるようにポリフェニレ
ンエーテル樹脂に架橋性ポリマー、架橋性モノマーおよ
び無機充填剤を加えて硬化させた積層板を用いる試みも
あるが、誘電特性が不十分で、１０ＧＨｚ以上の周波数
には適用し難いことおよび硬化性樹脂であることから製
造法が限定され、高価なものになってしまうこと等の問
題があった。For high-frequency circuit boards used in the microwave band, such as boards for satellite broadcast receiving flat antennas, if the dielectric loss tangent of the board material is large, the signal transmission loss will also be large.
Materials with low dielectric loss tangent and excellent dimensional stability are required. Therefore, in the past, substrates made of fluorine resins or polyolefins with excellent dielectric properties and with improved dimensional stability have been used for these applications. however,
Since these are extremely expensive, it is difficult to apply them to consumer antenna substrates, and it is often necessary to use PET film substrates, which have poor dielectric properties but excellent dimensional stability. In addition, as other substrates, JP-A-6
As seen in Japanese Patent No. 2-121758, there has been an attempt to use a laminate made by adding a crosslinkable polymer, a crosslinkable monomer, and an inorganic filler to polyphenylene ether resin and curing it, but the dielectric properties were insufficient and the There are problems in that it is difficult to apply to high frequencies, and because it is a curable resin, manufacturing methods are limited and the product becomes expensive.
こうした点から、低誘電正接、高寸法安定性を満足し、
かつ低価格な高周波回路用基板が強く求められていた。From these points, it satisfies low dielectric loss tangent and high dimensional stability.
There was a strong demand for low-cost high-frequency circuit boards.
［問題点を解決するための手段］
本発明者らは、上記問題点を解決する目的で、ポリスチ
レン系樹脂またはポリフェニレンエーテル樹脂およびポ
リスチレン系樹脂からなる樹脂が誘電特性、寸法安定性
等に優れた特性を有することに着目し、これらの誘電特
性を損なわずにさらに寸法安定性を基板として使用可能
なレヘルに向上させるため鋭意検討した結果、これらの
樹脂に特定範囲の配合量でマイカを充填することにより
、高周波回路用基板材料として極めて好適な特性が得ら
れることを見いだし、これに従って本発明を完成した。[Means for Solving the Problems] In order to solve the above problems, the present inventors have discovered that a resin made of polystyrene resin, polyphenylene ether resin, and polystyrene resin has excellent dielectric properties, dimensional stability, etc. As a result of intensive study to improve the dimensional stability to a level that can be used as a substrate without impairing these dielectric properties, we filled these resins with mica in a specific range of blending amounts. It was discovered that by doing so, extremely suitable characteristics as a substrate material for high frequency circuits could be obtained, and the present invention was completed based on this finding.
すなわち本発明は、（Ａノボリフエニレンエーテル樹脂
および（Ｂ）ポリスチレン系樹脂および（Ｃ）マイカか
らなる樹脂組成物もしくは（Ｂ）ポリスチレン系樹脂お
よび（Ｃ）マイカからなる樹脂組成物を用いた絶縁層を
有する高周波回路用基板である。ポリフェニレンエーテ
ル樹脂およびポリスチレン系樹脂を使用する場合は樹脂
組成としては（Ａ）ポリフェニレンエーテル樹脂と（Ｂ
）ポリスチレン系樹脂との比率は任意でよいが、樹脂組
成物中のマイカの配合量は１０〜７０重量％の範囲であ
ることが好ましい。組成を上記範囲から選ぶことにより
、１０ＧＨｚにおける誘電正接が０．００２０以下と極
めて低く、寸法安定性に優れ、かつ低コストな基板が得
られる。以下に本発明についてさらに詳しく説明する。That is, the present invention provides an insulation using a resin composition consisting of (A novolifenylene ether resin and (B) a polystyrene resin and (C) mica, or a resin composition consisting of (B) a polystyrene resin and (C) mica). This is a high frequency circuit board having a layer.When polyphenylene ether resin and polystyrene resin are used, the resin composition is (A) polyphenylene ether resin and (B).
) Although the ratio of mica to the polystyrene resin may be arbitrary, it is preferable that the amount of mica blended in the resin composition is in the range of 10 to 70% by weight. By selecting the composition from the above range, a substrate with an extremely low dielectric loss tangent of 0.0020 or less at 10 GHz, excellent dimensional stability, and low cost can be obtained. The present invention will be explained in more detail below.
本発明に用いられるポリフェニレンエーテル樹脂とは、
それ自体公知のものであり、次の一般式（■）で表され
る構造単位を骨格に持つ重合体の総称であって、前記構
造単位の一種のみからなる単独重合体であっても、二種
以上が組み合わされた共重合体であってもよい。The polyphenylene ether resin used in the present invention is
It is known per se, and is a general term for polymers having a structural unit represented by the following general formula (■) in its skeleton, and even if it is a homopolymer consisting of only one type of the above structural unit, It may also be a copolymer in which more than one species is combined.
（ここにＲ，およびＲ２は低級アルキル基、Ｒ３は水素
または低級アルキル基を表わす）本発明に好適なポリフ
ェニレンエーテル樹脂としては、ポリ（２，６−シメチ
ルー１．４−フェニレン）エーテルおよび２，６−シメ
チルフエノールと２３．６−１リメチルフエノールとの
ランダム共重合体が例示される。また、これらのポリフ
ェニレンエーテル樹脂を、分子中にエチレン性不飽和二
重結合とカルボキシル基、酸無水物基、あるいはグリシ
ジル基とを有する変性剤で変性した樹脂も、金属箔との
接着性を増大する効果を有することから、好ましいもの
である。(Here, R and R2 represent a lower alkyl group, and R3 represents hydrogen or a lower alkyl group.) Polyphenylene ether resins suitable for the present invention include poly(2,6-dimethyl-1,4-phenylene) ether and 2, A random copolymer of 6-dimethylphenol and 23.6-1-limethylphenol is exemplified. In addition, resins modified by modifying these polyphenylene ether resins with a modifier that has an ethylenically unsaturated double bond and a carboxyl group, an acid anhydride group, or a glycidyl group in the molecule also increase adhesion to metal foil. This is preferable because it has the effect of
本発明で用いるポリスチレン系樹脂もそれ自体公知のも
のであり、次の一般式（ＩＩ）で示される繰り返し構造
単位をその重合体中に２５重量％以上有するスチレン系
重合体を指す。The polystyrene resin used in the present invention is also known per se, and refers to a styrene polymer having 25% by weight or more of repeating structural units represented by the following general formula (II).
（ここにＲ１は水素または低級アルキル基、Ｚはハロゲ
ンまたは低級アルキル基を示し、ｐは０または１〜３の
整数である）
特に好ましいポリスチレン系樹脂としては、スチレン単
独重合体が挙げられる。(R1 here represents hydrogen or a lower alkyl group, Z represents a halogen or a lower alkyl group, and p is 0 or an integer of 1 to 3.) Particularly preferred polystyrene resins include styrene homopolymers.
本発明ではこれらのポリフェニレンエーテル樹脂および
ポリスチレン系樹脂とマイカもしくはポリスチレン系樹
脂単独とマイカとの樹脂組成物が使用し得る。ポリフェ
ニレンエーテル樹脂およびポリスチレン系樹脂を使用す
る場合はポリフェニレンエーテル樹脂とポリスチレン系
樹脂との配合比については特に制約はないがポリフェニ
レンエテル樹脂の比率が大きすぎると成形性が悪くなり
、また逆に小さすぎる場合には、耐熱温度が低くなると
ともに脆くなる傾向がある。そこで、−Ｃに好ましい配
合比としては重量で９：１〜１；９、より好ましくは７
：３〜３ニアの範囲であることが望ましい。In the present invention, resin compositions of these polyphenylene ether resins, polystyrene resins, and mica, or polystyrene resins alone and mica can be used. When using polyphenylene ether resin and polystyrene resin, there are no particular restrictions on the blending ratio of polyphenylene ether resin and polystyrene resin, but if the ratio of polyphenylene ether resin is too large, moldability will deteriorate, and conversely, if it is too small. In some cases, the heat resistance temperature tends to decrease and the material tends to become brittle. Therefore, the preferred blending ratio for -C is 9:1 to 1:9, more preferably 7:1 to 1:9 by weight.
: Desirably in the range of 3 to 3 near.
然しながら、耐熱性や脆さを問題にしない場合には、ポ
リスチレン系樹脂の方がポリフェニレンエーテル樹脂と
比較して誘電特性が優れているためポリスチレン系樹脂
単独にマイカを配合すると最も好ましい特性を得ること
ができる。また、本発明で充填材として用いるマイカの
種類としては、特に限定されないが、天然白雲母、天然
金雲母、合成金雲母、合成カリ四ケイ素雲母等が好まし
いものとして例示される。マイカの粒度、厚み、および
アスペクト比についても、特に限定されないが、基板の
寸法安定性を高めるためには、アスペクト比が１０以上
、より好ましくは１５以上であることが望ましい。これ
らのマイカは、高周波帯域における誘電正接が極めて小
さいことから、誘電正接の小さい樹脂に配合した場合の
特性低下は最小限に抑えることができる。また寸法安定
性の向上効果も著しく、しかも繊維状充填材を配合した
場合に見られるような異方性を生しない点で極めて優れ
ている。However, if heat resistance and brittleness are not an issue, polystyrene resin has better dielectric properties than polyphenylene ether resin, so adding mica to polystyrene resin alone will yield the most favorable properties. I can do it. Further, the type of mica used as a filler in the present invention is not particularly limited, but preferred examples include natural muscovite, natural phlogopite, synthetic phlogopite, and synthetic potassium tetrasilicon mica. The particle size, thickness, and aspect ratio of mica are also not particularly limited, but in order to improve the dimensional stability of the substrate, it is desirable that the aspect ratio be 10 or more, more preferably 15 or more. Since these micas have extremely small dielectric loss tangents in high frequency bands, deterioration in characteristics when blended with resins having small dielectric loss tangents can be minimized. Furthermore, the effect of improving dimensional stability is remarkable, and it is also extremely excellent in that it does not cause anisotropy as seen when fibrous fillers are blended.
マイカの好ましい配合量としては、樹脂組成物中のマイ
カの含有率が１０〜７０重量％、より好ましくは１５〜
５０重景％の範囲であることが望ましく、７０重量％を
越えると基板を成形することが困難となり、また１０重
量％未満では寸法安定性が不十分となる。 本発明の樹
脂ｍ酸物中には、これらの収骨のほかにさらに、他の樹
脂、エラストマー、ゴム、抗酸化剤や難燃剤等の添加剤
、および無機充填材を本発明の趣旨を損なわない範囲で
添加できる。The preferred blending amount of mica is such that the content of mica in the resin composition is 10 to 70% by weight, more preferably 15 to 70% by weight.
It is desirable that the content be in the range of 50% by weight; if it exceeds 70% by weight, it will be difficult to mold the substrate, and if it is less than 10% by weight, the dimensional stability will be insufficient. In addition to these components, the resin m-acid of the present invention may contain other resins, elastomers, rubbers, additives such as antioxidants and flame retardants, and inorganic fillers that would impair the purpose of the present invention. It can be added within the range.
上記樹脂ｍ放物を用いて基板を成形する方法としては、
押出成形、射出成形、プレス、キャスティング等の各種
の方法が適用可能である。As a method of molding a substrate using the resin m paraboloid,
Various methods such as extrusion molding, injection molding, pressing, and casting are applicable.
また、基板上に金属層を形成する方法については、銅箔
、アルミ箔等の金属箔を熱融着もしくは接着剤を用いて
張合わせる方法が最も好ましいが、金属メツキや蒸着等
の方法も用い得る。Regarding the method of forming a metal layer on the substrate, the most preferable method is to bond metal foil such as copper foil or aluminum foil using heat fusion or adhesive, but methods such as metal plating and vapor deposition may also be used. obtain.
発明明番こよる高周波回路用基板について、以下実施例
および比較例によって更に詳細に説明する実施例 １
２５°Ｃ、クロロホルム中で測定した固有粘度が０．４
７ｄｌ／ｇのポリ（２，６−シメチルー１４−フェニレ
ン）エーテル樹脂 ２５部、ポリスチレン樹脂（三菱モ
ンサント化或社製ダイヤレックスＨＨ−１０２）２５部
、および天然白雲母（クラレ社製３００Ｗ）５０部を混
合した後、軸押出機を用いて２９０°Ｃで溶融７昆練し
、ペレット化した。The high-frequency circuit board according to the invention will be described in more detail below with reference to Examples and Comparative Examples.Example 1: The intrinsic viscosity measured in chloroform at 25°C is 0.4.
25 parts of 7 dl/g poly(2,6-dimethyl-14-phenylene) ether resin, 25 parts of polystyrene resin (Dialex HH-102 manufactured by Mitsubishi Monsanto Chemical Co., Ltd.), and 50 parts of natural muscovite (300W manufactured by Kuraray Co., Ltd.) After mixing, the mixture was melted and kneaded at 290°C using a shaft extruder to form pellets.
上記ヘレットを用いて、２６０°Ｃ１１０ｋ ｇ ／
ｃｍ２の圧力で３０分間プレスし、３００ｍｍ角、厚さ
１ｍｍのシートを得た。Using the above Hellet, 260°C 110kg/
It was pressed for 30 minutes at a pressure of cm2 to obtain a sheet 300 mm square and 1 mm thick.
次いで、このシートの両面に厚さ３５μｍの圧延銅箔を
重ね、２２０″Ｃ，１０ｋ ｇ／ｃｍｚの圧力で３０分
間プレスすることにまり熱融着し、両面銅張シートを得
た。Next, rolled copper foil with a thickness of 35 μm was layered on both sides of this sheet, and heat-sealed by pressing at 220″C and a pressure of 10 kg/cmz for 30 minutes to obtain a double-sided copper-clad sheet.
このシートの熱膨張係数、誘電率および誘電正接の測定
結果を表ｔｃこ示した。The measurement results of the thermal expansion coefficient, dielectric constant and dielectric loss tangent of this sheet are shown in Table tc.
実施例２〜５
実施例１に示したポリフェニレンエーテル樹脂、ポリス
チレン樹脂および天然白雲母を用いて、表１に示される
組成で同様にして両面銅張シートを得た。これらのシー
トの熱膨張係数、誘電率および誘電正接の測定結果を表
１に示した。Examples 2 to 5 Double-sided copper-clad sheets were similarly obtained using the polyphenylene ether resin, polystyrene resin, and natural muscovite shown in Example 1 and having the compositions shown in Table 1. Table 1 shows the measurement results of the thermal expansion coefficient, dielectric constant, and dielectric loss tangent of these sheets.
実施例６〜８
実施例１における天然白雲母の代わりに、下記に示され
るマイカ５０部をそれぞれ用いた以外はすべて実施例１
と同様↓こして、両面銅張シートを得た。Examples 6 to 8 All the same as Example 1 except that 50 parts of the mica shown below was used in place of the natural muscovite in Example 1.
A double-sided copper-clad sheet was obtained by straining in the same manner as ↓.
実施例６ 天然金雲母 クラレ社製２００ＫＩ実施例７
合成金雲母 トビ−工業社製ＰＤＭ−３２５
実施例８ 合成カリ四ケイ素雲母 トビ−工業社製ＰＤ
Ｍ−Ｋ （Ｇ）−３２５
これらのシートの熱膨張係数、誘電率および誘電正接の
測定結果を表１に示した。Example 6 Natural phlogopite 200KI manufactured by Kuraray Example 7
Synthetic phlogopite PDM-325 manufactured by Tobi Industries Co., Ltd. Example 8 Synthetic potassium tetrasilicon mica PD manufactured by Tobi Industries Co., Ltd.
M-K (G)-325 Table 1 shows the measurement results of the thermal expansion coefficient, dielectric constant, and dielectric loss tangent of these sheets.
比較例１
実施例１に示したポリフェニレンエーテル樹脂５０部、
ポリスチレン樹脂５０部を用いて、同様にしてマイカを
含まない両面銅張シートを得た。Comparative Example 1 50 parts of the polyphenylene ether resin shown in Example 1,
A mica-free double-sided copper-clad sheet was obtained in the same manner using 50 parts of polystyrene resin.
このシートの熱膨張係数、誘電率および誘電正接の測定
結果を表１に示した。Table 1 shows the measurement results of the thermal expansion coefficient, dielectric constant, and dielectric loss tangent of this sheet.
実施例 ９
実施例１に示したポリスチレン樹脂７０部および天然白
雲母３０部を用いて、二軸押出機による溶融混練温度を
２３０°Ｃ１およびシート作製時のプレス温度を２２０
°Ｃとした以外はすべて実施例１と同様にして両面銅張
シートを得た。Example 9 Using 70 parts of the polystyrene resin and 30 parts of natural muscovite shown in Example 1, the melt-kneading temperature using a twin-screw extruder was set to 230°C1, and the pressing temperature during sheet production was set to 220°C.
A double-sided copper-clad sheet was obtained in the same manner as in Example 1 except that the temperature was changed to °C.
このシートの誘電率、誘電正接および熱膨張係数の測定
結果を表１に示した。Table 1 shows the measurement results of the dielectric constant, dielectric loss tangent, and thermal expansion coefficient of this sheet.
比較例 ２
実施例１に示したポリスチレン樹脂を用いて二軸押出機
による溶融混練を省略した以外はすべて実施例９と同様
にして両面銅張シートを得た。Comparative Example 2 A double-sided copper-clad sheet was obtained in the same manner as in Example 9 except that the polystyrene resin shown in Example 1 was used and the melt-kneading using the twin-screw extruder was omitted.
このシートの誘電率、誘電正接および熱膨張係数の測定
結果を表１に示した。Table 1 shows the measurement results of the dielectric constant, dielectric loss tangent, and thermal expansion coefficient of this sheet.
［発明の効果］
実施例１〜９、および比較例１〜２から明らかなように
、本発明のポリフェニレンエーテル樹脂およびポリスチ
レン系樹脂およびマイカからなる樹脂組成物もしくはポ
リスチレン系樹脂およびマイカからなる樹脂組成物を用
いた基板は、寸法安定性に優れ、かつ１０ＧＨｚにおけ
る誘電正接もマイカを含まない組成物を僅かに上回る程
度で、０．００２０以下の極めて小さい値であり、高周
波回路用基板、特に衛星放送用平面アンテナ、移動体通
信用平面アンテナ等の基板として好適なものである。[Effects of the Invention] As is clear from Examples 1 to 9 and Comparative Examples 1 to 2, a resin composition comprising the polyphenylene ether resin of the present invention, a polystyrene resin, and mica, or a resin composition comprising a polystyrene resin and mica The substrate using Mica has excellent dimensional stability, and the dielectric loss tangent at 10 GHz is only slightly higher than that of a composition that does not contain mica, which is an extremely small value of 0.0020 or less. It is suitable as a substrate for a flat antenna for broadcasting, a flat antenna for mobile communications, etc.
表１ ７６Table 1 76
Claims (3)
ポリスチレン系樹脂および（Ｃ）マイカからなる樹脂組
成物もしくは（Ｂ）ポリスチレン系樹脂および（Ｃ）マ
イカからなる樹脂組成物を用いた絶縁層を有する高周波
回路用基板。(1) (A) polyphenylene ether resin and (B)
A high frequency circuit board having an insulating layer using a resin composition comprising a polystyrene resin and (C) mica, or a resin composition comprising (B) a polystyrene resin and (C) mica.
％の範囲である請求項１記載の高周波回路用基板。(2) The high frequency circuit board according to claim 1, wherein the amount of mica blended in the resin composition is in the range of 10 to 70% by weight.
０以下である請求項１記載の高周波回路用基板。(3) The dielectric loss tangent of the substrate at 10GHz is 0.002
2. The high-frequency circuit board according to claim 1, wherein the amount of the high-frequency circuit board is 0 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6689390A JP2969745B2 (en) | 1990-03-19 | 1990-03-19 | High frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6689390A JP2969745B2 (en) | 1990-03-19 | 1990-03-19 | High frequency circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03269910A true JPH03269910A (en) | 1991-12-02 |
| JP2969745B2 JP2969745B2 (en) | 1999-11-02 |
Family
ID=13329053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6689390A Expired - Lifetime JP2969745B2 (en) | 1990-03-19 | 1990-03-19 | High frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2969745B2 (en) |
-
1990
- 1990-03-19 JP JP6689390A patent/JP2969745B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2969745B2 (en) | 1999-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5739193A (en) | Polymeric compositions having a temperature-stable dielectric constant | |
| CN111320848A (en) | Low dielectric constant liquid crystal polymer composition and preparation method thereof | |
| CN111286176A (en) | Liquid crystal polymer composition and preparation method thereof | |
| CN107227015B (en) | Low dielectric material | |
| CN112592554B (en) | Circuit material and printed circuit board | |
| JP2016062955A (en) | Film for electronic circuit board and electronic circuit board | |
| JP2018095815A (en) | Thermosetting resin composition, and resin varnish, prepreg, metal foil with resin, resin film, metal-clad laminate and printed wiring board each using the same | |
| JP2002513431A (en) | Polymer composition having stable relative permittivity with temperature | |
| JP3248424B2 (en) | Process for producing modified polyphenylene oxide, epoxy resin composition using modified polyphenylene oxide by this process, prepreg using this composition, and laminate using this prepreg | |
| TW201428055A (en) | Dielectric material with low dielectric loss | |
| KR100835785B1 (en) | Resine composition for printed circuit board and composite substrate and copper laminates using the same | |
| JPH05214129A (en) | Solventless high-temperature mixing process for producing thermosetting polyphenylene oxide/epoxy laminate | |
| JPH03269910A (en) | Substrate for high-frequency circuit | |
| KR100835783B1 (en) | Resine composition for printed circuit board and composite substrate and copper laminates using the same | |
| KR100832803B1 (en) | Thermally Curable Composite Resin Having Low Dielectric Constant and Low Dielectric Loss | |
| EP1055708A1 (en) | Resin composition, molded article thereof, and process for producing resin composition | |
| CN115305031A (en) | Low-dielectric high-Tg hydrocarbon bonding sheet and high-frequency copper-clad plate prepared from same | |
| KR100835782B1 (en) | Resine composition for printed circuit board and composite substrate and copper laminates using the same | |
| JP3339301B2 (en) | Epoxy resin composition, prepreg using this resin composition, and laminate using this prepreg | |
| JP4228568B2 (en) | Polyphenylene oxide resin composition, production method thereof, prepreg, laminated board, printed wiring board, multilayer printed wiring board | |
| TWI618097B (en) | Low dielectric material | |
| JPH0414282A (en) | Substrate for high-frequency circuit | |
| JP6994660B2 (en) | Metal-clad laminate and printed wiring board | |
| JPS5822056B2 (en) | Heat resistant rubber composition | |
| CN112824451B (en) | Low dielectric resin composition, prepreg, and copper-clad laminate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070827 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080827 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080827 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080827 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090827 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100827 Year of fee payment: 11 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100827 Year of fee payment: 11 |