JP2969745B2 - High frequency circuit board - Google Patents
High frequency circuit boardInfo
- Publication number
- JP2969745B2 JP2969745B2 JP6689390A JP6689390A JP2969745B2 JP 2969745 B2 JP2969745 B2 JP 2969745B2 JP 6689390 A JP6689390 A JP 6689390A JP 6689390 A JP6689390 A JP 6689390A JP 2969745 B2 JP2969745 B2 JP 2969745B2
- Authority
- JP
- Japan
- Prior art keywords
- mica
- resin
- substrate
- frequency circuit
- loss tangent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、衛星放送受信平面アンテナ用基板等に好適
な高周波回路用基板に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a high-frequency circuit suitable for a substrate for a satellite broadcast receiving flat antenna or the like.
［従来の技術および問題点］ 衛星放送受信平面アンテナ用基板のようなマイクロ波
帯域で用いられる高周波回路用基板では、基板材料の誘
電正接が大きいと信号の伝送ロスも大きくなることか
ら、誘電正接が小さく、かつ寸法安定性の優れた材料が
要求される。そこで、これらの用途には、従来、誘電特
性に優れたフッ素樹脂やポリオレフィンを素材とし、寸
法安定性を改良した基板が用いられてきた。しかしなが
ら、これらは極めて高価なものであることから民生用ア
ンテナ基板に適用するのは難しく、誘電特性は劣るが寸
法安定性に優れたPETフィルム基板を採用せざるを得な
い場合も多かった。また、その他の基板として特開昭62
−121758号公報に見られるようにポリフェニレンエーテ
ル樹脂に架橋性ポリマー、架橋性モノマーおよび無機充
填剤を加えて硬化させた積層板を用いる試みもあるが、
誘電特性が不十分で、10GHz以上の周波数には適用し難
いことおよび硬化性樹脂であることから製造法が限定さ
れ、高価なものになってしまうこと等の問題があった。[Related Art and Problems] In a substrate for a high-frequency circuit used in a microwave band such as a substrate for a satellite broadcast receiving flat antenna, a large dielectric loss tangent of a substrate material causes a large signal transmission loss. A material having a small size and excellent dimensional stability is required. Therefore, in these applications, conventionally, a substrate made of a fluororesin or a polyolefin excellent in dielectric properties and having improved dimensional stability has been used. However, since these are extremely expensive, it is difficult to apply them to a commercial antenna substrate, and in many cases, a PET film substrate having inferior dielectric properties but excellent dimensional stability has to be employed. In addition, as other substrates,
There is also an attempt to use a laminated board cured by adding a crosslinkable polymer, a crosslinkable monomer and an inorganic filler to a polyphenylene ether resin as seen in -121758.
Due to insufficient dielectric properties, it is difficult to apply to a frequency of 10 GHz or more, and since it is a curable resin, the production method is limited, and there is a problem that it is expensive.
こうした点から、低誘電正接、高寸法安定性を満足
し、かつ低価格な高周波回路用基板が強く求められてい
た。From such a point, there has been a strong demand for a low-cost circuit board for a high-frequency circuit which satisfies a low dielectric loss tangent and high dimensional stability.
［問題点を解決するための手段］ 本発明者らは、上記問題点を解決する目的で、ポリス
チレン系樹脂またはポリフェニレンエーテル樹脂および
ポリスチレン系樹脂からなる樹脂が誘電特性、寸法安定
性等に優れた特性を有することに着目し、これらの誘電
特性を損なわずにさらに寸法安定性を基板として使用可
能なレベルに向上させるため鋭意検討した結果、これら
の樹脂に特定範囲の配合量でマイカを充填することによ
り、高周波回路用基板材料として極めて好適な特性が得
られることを見いだし、これに従って本発明を完成し
た。[Means for Solving the Problems] For the purpose of solving the above problems, the present inventors have found that a polystyrene-based resin or a resin comprising a polyphenylene ether resin and a polystyrene-based resin has excellent dielectric properties, dimensional stability, and the like. Focusing on having properties, these resins were filled with mica in a specific range of mixing amount as a result of intensive studies to further improve dimensional stability to a level that can be used as a substrate without impairing these dielectric properties As a result, it has been found that characteristics very suitable as a substrate material for a high-frequency circuit can be obtained, and accordingly, the present invention has been completed.
すなわち本発明は、（Ａ）ポリフェニレンエーテル樹
脂および（Ｂ）ポリスチンレン系樹脂および（Ｃ）マイ
カからなる樹脂組成物、または（Ｂ）ポリスチレン系樹
脂および（Ｃ）マイカからなる樹脂組成物を用いた絶縁
層を有する基板であって、該樹脂組成物中のマイカの含
有率は10〜70重量％であり、かつ該基板の10GHzにおけ
る誘電正接が0.0020以下である高周波回路である。組成
を上記範囲から選ぶことにより、寸法安定性に優れ、か
つ低コストな基板が得られる。以下に本発明についてさ
らに詳しく説明する。That is, the present invention provides an insulation using a resin composition comprising (A) a polyphenylene ether resin and (B) a polystyrene resin and (C) mica, or a resin composition comprising (B) a polystyrene resin and (C) mica. A high-frequency circuit comprising a substrate having a layer, wherein the content of mica in the resin composition is 10 to 70% by weight and the dielectric loss tangent at 10 GHz of the substrate is 0.0020 or less. By selecting the composition from the above range, a substrate having excellent dimensional stability and low cost can be obtained. Hereinafter, the present invention will be described in more detail.
本発明に用いられるポリフェニレンエーテル樹脂と
は、それ自体公知のものであり、次の一般式（Ｉ）で表
される構造単位を骨格に持つ重合体の総称であって、前
記構造単位の一種のみからなる単独重合体であっても、
二種以上が組み合わされた共重合体であってもよい。The polyphenylene ether resin used in the present invention is known per se, and is a generic name of a polymer having a structural unit represented by the following general formula (I) in the skeleton, and only one type of the structural unit is used. Even a homopolymer consisting of
A copolymer in which two or more kinds are combined may be used.
（ここにR1およびR2は低級アルキル基、R3は水素または
低級アルキル基を表わす）本発明に好適なポリフェニレ
ンエーテル樹脂としては、ポリ（2,6−ジメチル−1,4−
フェニレン）エーテルおよび2,6−ジメチルフェノール
と2,3,6−トリメチルフェノールとのランダム共重合体
が例示される。また、これらのポリフェニレンエーテル
樹脂を、分子中にエチレン性不飽和二重結合とカルボキ
シル基、酸無水物基、あるいはグリシジル基とを有する
変性剤で変性した樹脂も、金属箔との接着性を増大する
効果を有することから、好ましいものである。 (Where R 1 and R 2 represent a lower alkyl group, and R 3 represents a hydrogen or a lower alkyl group) Examples of the polyphenylene ether resin suitable for the present invention include poly (2,6-dimethyl-1,4-
Examples thereof include phenylene) ether and a random copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol. In addition, resins obtained by modifying these polyphenylene ether resins with a modifier having an ethylenically unsaturated double bond and a carboxyl group, an acid anhydride group, or a glycidyl group in the molecule also increase the adhesion to the metal foil. This is preferable because it has the effect of
本発明で用いるポリスチレン系樹脂もそれ自体公知の
ものであり、次の一般式（II）で示される繰り返し構造
単位をその重合体中に25重量％以上有するスチレン系重
合体を指す。The polystyrene resin used in the present invention is also known per se, and refers to a styrene polymer having a repeating structural unit represented by the following general formula (II) in the polymer in an amount of 25% by weight or more.
（ここにR4は水素または低級アルキル基、Ｚはハロゲン
または低級アルキル基を示し、ｐは０または１〜３の整
数である） 特に好ましいポリスチレン系樹脂としては、スチレン
単独重合体が挙げられる。 (Here, R 4 is hydrogen or a lower alkyl group, Z is a halogen or a lower alkyl group, and p is 0 or an integer of 1 to 3.) A particularly preferred polystyrene resin is a styrene homopolymer.
本発明ではこれらのポリフェニレンエーテル樹脂およ
びポリスチレン系樹脂とマイカもしくはポリスチレン系
樹脂単独とマイカとの樹脂組成物が使用し得る。ポリフ
ェニレンエーテル樹脂およびポリスチレン系樹脂を使用
する場合はポリフェニレンエーテル樹脂とポリスチレン
系樹脂との配合比については特に制約はないがポリフェ
ニレンエーテル樹脂の比率が大きすぎると成形性が悪く
なり、また逆に小さすぎる場合には、耐熱温度が低くな
るとともに脆くなる傾向がある。そこで、一般に好まし
い配合比としては重量で9:1〜1:9、より好ましくは7:3
〜3:7の範囲であることが望ましい。In the present invention, a resin composition of these polyphenylene ether resin and polystyrene resin and mica, or polystyrene resin alone and mica can be used. When using a polyphenylene ether resin and a polystyrene resin, there is no particular limitation on the mixing ratio of the polyphenylene ether resin and the polystyrene resin, but if the ratio of the polyphenylene ether resin is too large, the moldability deteriorates, and conversely, it is too small. In such a case, there is a tendency that the heat resistance temperature becomes lower and the material becomes brittle. Therefore, a generally preferred blending ratio is 9: 1 to 1: 9 by weight, more preferably 7: 3.
It is desirably in the range of ~ 3: 7.
然しながら、耐熱性や脆さを問題にしない場合には、
ポリスチレン系樹脂の方がポリフェニレンエーテル樹脂
と比較して誘電特性が優れているためポリスチレン系樹
脂単独にマイカを配合すると最も好ましい特性を得るこ
とができる。また、本発明で充填材として用いるマイカ
の種類としては、特に限定されないが、天然白雲母、天
然金雲母、合成金雲母合成カリ四ケイ素雲母等が好まし
いものとして例示される。マイカの粒度、厚み、および
アスペクト比についても、特に限定されないが、一般的
には、20μ〜0.64cmのフレーク径、0.5〜10μの厚み、
（1978年２月発行の工業材料２月号の強化材の特性「マ
イカ」参照）を有するものであり、基板の寸法安定性を
高めるには、アスペクト比が10以上、より好ましくは15
以上であることが望ましい。これらのマイカは、高周波
帯域における誘電正接が極めて小さいことから、誘電正
接の小さい樹脂に配合した場合の特性低下は最小限に抑
えることができる。また寸法安定性の向上効果も著し
く、しかも繊維状充填材を配合した場合に見られるよう
な異方性を生じない点で極めて優れている。However, if you do not care about heat resistance and brittleness,
Since the polystyrene resin has better dielectric properties than the polyphenylene ether resin, the most preferable properties can be obtained by mixing mica with the polystyrene resin alone. Further, the type of mica used as a filler in the present invention is not particularly limited, but preferred examples include natural muscovite, natural phlogopite, synthetic phlogopite and synthetic potassium tetrasilicic mica. The particle size, thickness, and aspect ratio of mica are also not particularly limited, but generally, a flake diameter of 20 μm to 0.64 cm, a thickness of 0.5 μm to 10 μm,
(Refer to the property “mica” of the reinforcing material in the February issue of Industrial Materials, February 1978). In order to enhance the dimensional stability of the substrate, the aspect ratio is 10 or more, and more preferably 15 or more.
It is desirable that it is above. Since these mica have an extremely small dielectric loss tangent in a high-frequency band, it is possible to minimize the deterioration in characteristics when mixed with a resin having a small dielectric loss tangent. Further, the effect of improving dimensional stability is remarkable, and further, it is extremely excellent in that anisotropy does not occur as seen when a fibrous filler is blended.
マイカの好ましい配合量としては、樹脂組成物中のマ
イカの含有率が10〜70重量％、より好ましくは15〜50重
量％の範囲であることが望ましく、70重量％を越えると
基板を成形することが困難となり、また10重量％未満で
は寸法安定性が不十分となる。本発明の樹脂組成物中に
は、これらの成分のほかにさらに、他の樹脂、エラスト
マー、ゴム、抗酸化剤や燃焼剤等の添加剤、および無機
充填剤を本発明の趣旨を損なわない範囲で添加できる。The preferred amount of mica is such that the content of mica in the resin composition is in the range of 10 to 70% by weight, more preferably 15 to 50% by weight, and when it exceeds 70% by weight, the substrate is formed. When the content is less than 10% by weight, the dimensional stability becomes insufficient. In the resin composition of the present invention, in addition to these components, other resins, elastomers, rubbers, additives such as antioxidants and combustion agents, and inorganic fillers in a range that does not impair the spirit of the present invention. Can be added.
上記樹脂組成物を用いて基板を成形する方法として
は、押出成形、射出成形、プレス、キャスティング等の
各種の方法が適用可能である。Various methods such as extrusion molding, injection molding, pressing, and casting can be applied as a method for molding a substrate using the resin composition.
また、基板上に金属層を形成する方法については、銅
箔、アルミ箔等の金属箔を熱融着もしくは接着剤を用い
て張合わせる方法が最も好ましいが、金属メッキや蒸着
等の方法も用い得る。Further, as a method of forming a metal layer on a substrate, a method of bonding a metal foil such as a copper foil or an aluminum foil using a heat seal or an adhesive is most preferable, but a method such as metal plating or vapor deposition is also used. obtain.
本発明による高周波回路用基板について、以下実施例
および比較例によって更に詳細に説明する。The substrate for a high-frequency circuit according to the present invention will be described in more detail below with reference to Examples and Comparative Examples.
実施例 １ 25℃、クロロホルム中で測定した固有粘度が0.47d1/g
のポリ（2,6−ジメチル−1,4−フェニレン）エーテル樹
脂 25部、ポリスチレン樹脂（三菱モンサント化成社製
ダイヤレックスHH−102）25部、および天然白雲母（ク
ラレ社製300W:平均フレーク径30μ、アスペクト比40）5
0部を混合した後、二軸押出機を用いて290℃で溶融混練
し、ペレット化した。Example 1 The intrinsic viscosity measured in chloroform at 25 ° C. was 0.47 d1 / g.
25 parts of poly (2,6-dimethyl-1,4-phenylene) ether resin, 25 parts of polystyrene resin (Dialex HH-102 manufactured by Mitsubishi Monsanto Kasei Co., Ltd.), and natural muscovite (Kuraray 300W: average flake diameter) 30μ, aspect ratio 40) 5
After mixing 0 parts, the mixture was melt-kneaded at 290 ° C. using a twin-screw extruder and pelletized.
上記ペレットを用いて、260℃、10kg/cm2の圧力で30
分間プレスし、300mm角、厚さ1mmのシートを得た。Using the above pellets, 260 ° C., 30 at a pressure of 10 kg / cm 2
After pressing for 300 minutes, a sheet of 300 mm square and 1 mm thick was obtained.
次いで、このシートの両面に厚さ35μｍの圧延銅箔を
重ね、220℃、10kg/cm2の圧力で30分間プレスすること
により熱融着し、両面銅張シートを得た。Next, a rolled copper foil having a thickness of 35 μm was overlaid on both sides of the sheet, and pressed at 220 ° C. under a pressure of 10 kg / cm 2 for 30 minutes to be thermally fused to obtain a double-sided copper-clad sheet.
このシートの熱膨張係数、誘電率および誘電正接の測
定結果を表１に示した。Table 1 shows the measurement results of the coefficient of thermal expansion, the dielectric constant, and the dielectric loss tangent of this sheet.
実施例２〜５ 実施例１に示したポリフェニレンエーテル樹脂、ポリ
スチレン樹脂および天然白雲母を用いて、表１に示され
る組成で同様にして両面銅張シートを得た。これらのシ
ートの熱膨張係数、誘電率および誘電正接の測定結果を
表１に示した。Examples 2 to 5 Using the polyphenylene ether resin, polystyrene resin, and natural muscovite shown in Example 1, with the composition shown in Table 1, a double-sided copper-clad sheet was similarly obtained. Table 1 shows the measurement results of the thermal expansion coefficient, the dielectric constant, and the dielectric loss tangent of these sheets.
実施例６〜８ 実施例１における天然白雲母の代わりに、下記に示さ
れるマイカ50部をそれぞれ用いた以外はすべて実施例１
と同様にして、両面銅張シートを得た。Examples 6 to 8 Example 1 was repeated except that 50 parts of mica shown below were used instead of the natural muscovite in Example 1.
In the same manner as in the above, a double-sided copper-clad sheet was obtained.
実施例６ 天然金雲母 （クラレ社製200KI（平均フレ
ーク径90μ、アスペクト比50） 実施例７ 合成金雲母 トピー工業社製PDM−７−325 実施例８ 合成カリ四ケイ素雲母 トピー工業社製PDM
−Ｋ（Ｇ）−325 これらのシートの熱膨張係数、誘電率および誘電正接
の測定結果を表１に示した。Example 6 Natural phlogopite (200KI manufactured by Kuraray Co., Ltd. (average flake diameter 90 μ, aspect ratio 50)) Example 7 Synthetic phlogopite PDM-7-325 manufactured by Topy Industries Co., Ltd. Example 8 Synthetic potassium tetrasilicic mica PDM manufactured by Topy Industries KK
-K (G) -325 Table 1 shows the measurement results of the coefficient of thermal expansion, the dielectric constant, and the dielectric loss tangent of these sheets.
比較例１ 実施例１に示したポリフェニレンエーテル樹脂50部、
ポリスチレン樹脂50部を用いて、同様にしてマイカを含
まない両面銅張シートを得た。このシートの熱膨張係
数、誘電率および誘電正接の測定結果を表１に示した。Comparative Example 1 50 parts of the polyphenylene ether resin shown in Example 1,
Similarly, a mica-free double-sided copper-clad sheet was obtained using 50 parts of a polystyrene resin. Table 1 shows the measurement results of the coefficient of thermal expansion, the dielectric constant, and the dielectric loss tangent of this sheet.
実施例 ９ 実施例１に示したポリスチレン樹脂70部および天然白
雲母30部を用いて、二軸押出機による溶融混練温度を23
0℃、およびシート作製時のプレス温度を220℃とした以
外はすべて実施例１と同様にして両面銅張シートを得
た。Example 9 Using 70 parts of the polystyrene resin shown in Example 1 and 30 parts of natural muscovite, the melt-kneading temperature of a twin-screw extruder was set to 23.
A double-sided copper-clad sheet was obtained in the same manner as in Example 1 except that the temperature was set to 0 ° C. and the pressing temperature during the sheet preparation was set to 220 ° C.
このシートの誘電率、誘電正接および熱膨張係数の測
定結果を表１に示した。Table 1 shows the measurement results of the dielectric constant, dielectric loss tangent, and coefficient of thermal expansion of this sheet.
比較例 ２ 実施例１に示したポリスチレン樹脂を用いて二軸押出
機による溶融混練を省略した以外はすべて実施例９と同
様にして両面銅張シートを得た。Comparative Example 2 A double-sided copper-clad sheet was obtained in the same manner as in Example 9 except that the polystyrene resin shown in Example 1 was omitted and melt kneading by a twin-screw extruder was omitted.
このシートの誘電率、誘電正接および熱膨張係数の測
定結果を表１に示した。Table 1 shows the measurement results of the dielectric constant, dielectric loss tangent, and coefficient of thermal expansion of this sheet.
実施例10 25℃、クロロホルム中で測定した固有粘度が0.47d1/g
のポリ（2,6−ジメチル−1,4−フェニレン）エーテル樹
脂35部、ポリスチレン樹脂（三菱モンサント化成社製：
ダイヤレックスHH−102）35部、及び天然金雲母（株式
会社レプコ社製:S200HG、平均フレーク径;55μｍ、アス
ペクト比；約55）30部を混合した後、二軸押出機を用い
て290℃で溶融混練し、ペレット化した。Example 10 25 ° C., the intrinsic viscosity measured in chloroform was 0.47 d1 / g.
35 parts of poly (2,6-dimethyl-1,4-phenylene) ether resin and polystyrene resin (manufactured by Mitsubishi Monsanto Kasei Co., Ltd .:
After mixing 35 parts of Dialex HH-102) and 30 parts of natural phlogopite (manufactured by Repco Co., Ltd .: S200HG, average flake diameter; 55 μm, aspect ratio; about 55), the mixture was mixed at 290 ° C. using a twin-screw extruder. And the mixture was melt-kneaded and pelletized.
上記ペレットを用いて射出成形機（東芝機械社製:IS1
50B）にてシリンダー温度290℃金型温度80℃の条件で20
0mm角、厚さ1.6mmの平板の成形品を得た。尚、使用した
金型は、1.0mm厚みのフィルムゲートであった。An injection molding machine (TOSHIBA MACHINE CO., LTD .: IS1)
50B) at a cylinder temperature of 290 ° C and a mold temperature of 80 ° C
A flat product of 0 mm square and 1.6 mm thickness was obtained. The mold used was a 1.0 mm thick film gate.
次いで、この成形品の両面に厚さ35μｍの圧延銅箔を
重ね、220℃、10kg/cm2の圧力で30分間プレスする事に
より熱融着し、両面銅張りシートを得た。この成形品の
熱膨張係数及び誘電正接を測定した。結果を表２に示
す。Next, a rolled copper foil having a thickness of 35 μm was superimposed on both surfaces of the molded product, and was thermally fused by pressing at 220 ° C. under a pressure of 10 kg / cm 2 for 30 minutes to obtain a double-sided copper-clad sheet. The thermal expansion coefficient and the dielectric loss tangent of this molded product were measured. Table 2 shows the results.
比較例３ 実施例９と同じポリ（2,6−ジメチル−1,4−フェニレ
ン）エーテル樹脂35部及びポリスチレン樹脂35部を290
℃に設定した二軸押出機に供給した。樹脂が完全に溶融
したゾーンにチョップドガラス繊維（日本電気硝子社
製:03T−488 13μm/3mm）30部を供給してペレットを得
た。Comparative Example 3 The same poly (2,6-dimethyl-1,4-phenylene) ether resin 35 parts and polystyrene resin 35 parts
The mixture was fed to a twin-screw extruder set to ° C. 30 parts of chopped glass fiber (manufactured by Nippon Electric Glass Co., Ltd .: 03T-488 13 μm / 3 mm) was supplied to the zone where the resin was completely melted to obtain pellets.
上記ペレットを用いて射出成形機（東芝機械社製:IS1
50B）にてシリンダー温度290℃金型温度80℃の条件で20
0mm角、厚さ1.6mmの平板の成形品を得た。尚、使用した
金型は1.0mm厚みのフィルムゲートであった。An injection molding machine (TOSHIBA MACHINE CO., LTD .: IS1)
50B) at a cylinder temperature of 290 ° C and a mold temperature of 80 ° C
A flat product of 0 mm square and 1.6 mm thickness was obtained. The mold used was a 1.0 mm thick film gate.
次いで、この成形品の両面に厚さ35μｍの圧延銅箔を
重ね、220℃、10kg/cm2の圧力で30分間プレスする事に
より熱融着し、両面銅張りシートを得た。この成形品の
熱膨張係数及び誘電正接を測定した。結果を表２に示
す。Next, a rolled copper foil having a thickness of 35 μm was superimposed on both surfaces of the molded product, and was thermally fused by pressing at 220 ° C. under a pressure of 10 kg / cm 2 for 30 minutes to obtain a double-sided copper-clad sheet. The thermal expansion coefficient and the dielectric loss tangent of this molded product were measured. Table 2 shows the results.
比較例４ 天然金雲母を用いなかった以外は、実施例９と同じポ
リ（2,6−ジメチル−1,4−フェニレン）エーテル樹脂及
びポリスチレン樹脂を、それぞれ50部ずつ用いて実施例
９と同様にして、充填材を含まない両面銅張りシートを
得た。この成形品の熱膨張係数及び誘電正接を測定し
た。結果を表２に示す。Comparative Example 4 Same as Example 9 except that natural polyphlogopite was not used, and 50 parts each of the same poly (2,6-dimethyl-1,4-phenylene) ether resin and polystyrene resin as in Example 9 were used. Thus, a double-sided copper-clad sheet containing no filler was obtained. The thermal expansion coefficient and the dielectric loss tangent of this molded product were measured. Table 2 shows the results.
［発明の効果］ 実施例１〜10および比較例１〜４から明らかなよう
に、本発明のポリフェニレンエーテル樹脂およびポリス
チレン系樹脂およびマイカからなる樹脂組成物もしくは
ポリスチレン系樹脂およびマイカからなる樹脂組成物を
用いた基板は、寸法安定性に優れ、かつ10GHzにおける
誘電正接もマイカを含まない組成物を僅かに上回る程度
で、0.0020以下の極めて小さい値であり、高周波回路用
基板、特に衛星放送用平面アンテナ、移動体通信用平面
アンテナ等の基板として好適なものである。[Effects of the Invention] As is clear from Examples 1 to 10 and Comparative Examples 1 to 4, a resin composition comprising the polyphenylene ether resin and the polystyrene resin and mica of the present invention or a resin composition comprising the polystyrene resin and mica The substrate using is excellent in dimensional stability and has a dielectric loss tangent at 10 GHz slightly higher than that of a composition containing no mica, an extremely small value of 0.0020 or less. It is suitable as a substrate for an antenna, a planar antenna for mobile communication, or the like.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０１Ｂ 3/44 Ｈ０１Ｂ 3/44 Ｋ Ｈ０５Ｋ 1/03 ６１０ Ｈ０５Ｋ 1/03 ６１０Ｒ (58)調査した分野(Int.Cl.6，ＤＢ名) H01B 3/00 H01B 3/04 H01B 3/44 C08K 3/34 C08L 25/06 C08L 71/12 H05K 1/03 610 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 identification code FI H01B 3/44 H01B 3/44 K H05K 1/03 610 H05K 1/03 610R (58) Fields surveyed (Int. Cl. 6 , (DB name) H01B 3/00 H01B 3/04 H01B 3/44 C08K 3/34 C08L 25/06 C08L 71/12 H05K 1/03 610
Claims (3)
（Ｂ）ポリスチレン系樹脂および（Ｃ）マイカからなる
樹脂組成物を用いた絶縁層を有する基板であって、該樹
脂組成物中のマイカの含有率が10〜70重量％であり、該
基板の10GHzにおける誘電正接が0.0020以下である高周
波回路用基板。(A) a polyphenylene ether resin,
A substrate having an insulating layer using a resin composition comprising (B) a polystyrene-based resin and (C) mica, wherein the content of mica in the resin composition is 10 to 70% by weight. A high-frequency circuit board with a dielectric loss tangent at 10 GHz of 0.0020 or less.
イカからなる樹脂組成物を用いた絶縁層を有する基板で
あって、該樹脂組成物中のマイカの含有量が10〜70重量
％あり、該基板の10GHzにおける誘電正接が0.0020以下
である高周波回路用基板。2. A substrate having an insulating layer using a resin composition comprising (B) a polystyrene resin and (C) mica, wherein the content of mica in the resin composition is 10 to 70% by weight. A high-frequency circuit substrate having a dielectric loss tangent at 10 GHz of 0.0020 or less.
重量％である請求項１乃至２記載の高周波回路用基板。3. The method according to claim 1, wherein the content of mica in the resin composition is 15 to 50.
3. The high-frequency circuit board according to claim 1, wherein the weight percentage is weight percent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6689390A JP2969745B2 (en) | 1990-03-19 | 1990-03-19 | High frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6689390A JP2969745B2 (en) | 1990-03-19 | 1990-03-19 | High frequency circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03269910A JPH03269910A (en) | 1991-12-02 |
| JP2969745B2 true JP2969745B2 (en) | 1999-11-02 |
Family
ID=13329053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6689390A Expired - Lifetime JP2969745B2 (en) | 1990-03-19 | 1990-03-19 | High frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2969745B2 (en) |
-
1990
- 1990-03-19 JP JP6689390A patent/JP2969745B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03269910A (en) | 1991-12-02 |
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