JPH03269023A - Production of prepreg - Google Patents
Production of prepregInfo
- Publication number
- JPH03269023A JPH03269023A JP6833990A JP6833990A JPH03269023A JP H03269023 A JPH03269023 A JP H03269023A JP 6833990 A JP6833990 A JP 6833990A JP 6833990 A JP6833990 A JP 6833990A JP H03269023 A JPH03269023 A JP H03269023A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- varnish
- prepreg
- curing
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 239000002966 varnish Substances 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 11
- 238000013329 compounding Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 3
- 238000005470 impregnation Methods 0.000 description 11
- 238000000465 moulding Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000009472 formulation Methods 0.000 description 3
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241001600434 Plectroglyphidodon lacrymatus Species 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、積層板用基材にワニスを複数回塗布・含浸す
ることにより、加熱加圧成形時の成形性か良好なプリプ
レグを得る方法に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention is a method for obtaining a prepreg with good moldability during hot-press molding by applying and impregnating a varnish on a base material for a laminate multiple times. It is related to.
(従来の技術)
従来、プリプレグを製造する際、基材へのワニス含浸性
を良くする方法としてワニスを複数回塗布することが行
われている。(Prior Art) Conventionally, when manufacturing a prepreg, a method of improving varnish impregnation into a base material is to apply varnish multiple times.
この場合、例えば、(1)同しワニスを複数回使用する
、(2)初めに樹脂成分の少ないワニスを塗布する、(
3)低粘度の樹脂を最初に塗布する、(4)ワニスと置
換しやすい有機溶剤を予め塗布する、等の方法がある。In this case, for example, (1) the same varnish is used multiple times, (2) a varnish with a low resin content is applied first, (
There are methods such as 3) applying a low viscosity resin first, and (4) applying in advance an organic solvent that can easily replace the varnish.
これらの方法は基材への含浸性は改良されるが、上記(
1)、 (2)及び(3)の場合では初めに塗布したり
ニスの樹脂が乾燥中に硬化が進んだり粘度が上ったりし
て、加熱加圧成形時プリプレグからの脱泡が悪く、成形
性の良い積層板を製造する方法とじては十分てはなかっ
た。(4)の有機溶剤を予め塗布する場合、乾燥を行わ
ずに次のワニス含浸を行うので、プリプレグ中の樹脂分
のコントロールが困難であるという欠点かあった。These methods improve the impregnating properties of the base material, but the above (
In the cases of 1), (2), and (3), the initial coating or varnish resin hardens or increases in viscosity during drying, making it difficult to remove air from the prepreg during hot-pressure molding. There has not been a sufficient method for manufacturing laminates with good formability. When the organic solvent (4) is applied in advance, the next varnish impregnation is performed without drying, which has the disadvantage that it is difficult to control the resin content in the prepreg.
(発明が解決しようとする課題)
従って、本発明は、プリプレグを得る際における基材へ
のワニス含浸性を改良し、成形時プリプレグからの脱泡
か容易で成形性の良好な積層板の製造方法を提供するも
のである。(Problems to be Solved by the Invention) Therefore, the present invention aims to improve the impregnation of varnish into a base material when obtaining a prepreg, and to produce a laminate with good moldability and easy degassing from the prepreg during molding. The present invention provides a method.
(課題を解決するための手段)
本発明は、硬化速度の異なる複数種の樹脂ワニスを基材
に塗布・含浸するにあたり、硬化速度の遅い樹脂ワニス
から順に塗布・含浸することを特徴とするプリプレグの
製造方法である。(Means for Solving the Problems) The present invention provides a prepreg characterized in that when applying and impregnating a base material with multiple types of resin varnishes having different curing speeds, the resin varnishes having a slow curing speed are applied and impregnated in order. This is a manufacturing method.
本発明において用いられる樹脂ワニスとしては通常積層
板用として使用されているものであり、エポキシ樹脂、
ポリイミド樹脂、フェノール樹脂、ポリエステル樹脂等
である。The resin varnish used in the present invention is one normally used for laminated boards, and includes epoxy resin,
These include polyimide resin, phenol resin, polyester resin, etc.
エポキシ樹脂の場合、硬化剤としてアミン類、酸無水物
、ノボラック樹脂等で更に通常硬化触媒を加え、必要に
より難燃剤、充填剤等を配合する。In the case of epoxy resins, curing agents such as amines, acid anhydrides, and novolac resins are used, and a curing catalyst is usually added, and if necessary, flame retardants, fillers, etc. are added.
他の樹脂の場合も、必要により硬化触媒、難燃剤、充填
材等を配合する。樹脂ワニスにおいて、硬化速度の異な
るものを得るためには、例えばエポキシ樹脂の場合、初
めの含浸に使用するワニスとして、硬化の遅い樹脂を用
いる、通常の樹脂の一部を硬化の遅いものに置換えるな
との方法かあり、硬化剤についても同様である。更に硬
化触媒の量を減少させる等の方法がある。In the case of other resins, curing catalysts, flame retardants, fillers, etc. are added as necessary. In order to obtain resin varnishes with different curing speeds, for example, in the case of epoxy resins, it is necessary to use a slow-curing resin as the varnish used for the initial impregnation, or to replace part of the usual resin with a slow-curing one. There is also a method using Luna, and the same applies to hardening agents. Furthermore, there are methods such as reducing the amount of curing catalyst.
本発明において、実施の容易さ、得られた積層板の特性
の把握のしやすさを考慮すれば、硬化触媒の量を減少さ
せるのが最も好ましい。In the present invention, it is most preferable to reduce the amount of curing catalyst in consideration of ease of implementation and ease of understanding the properties of the obtained laminate.
硬化速度の遅いワニス中の硬化触媒量(樹脂に対する割
合)と硬化速度の速いワニス中の硬化触媒量の比は0.
6〜0.95が好ましい。この比が0.6より小さいと
、成形時の硬化が遅くなり、積層板の耐熱性が低下する
傾向となり、0.95より大きいと乾燥中にプリプレグ
の1次含浸のワニスの硬化が進みすぎ、成形時の成形性
が劣るようになる。The ratio of the amount of curing catalyst in a varnish with a slow curing speed (ratio to resin) and the amount of curing catalyst in a varnish with a fast curing speed is 0.
6 to 0.95 is preferred. If this ratio is smaller than 0.6, the curing during molding will be delayed and the heat resistance of the laminate will tend to decrease, while if it is larger than 0.95, the varnish in the primary impregnation of the prepreg will harden too much during drying. , the moldability during molding becomes poor.
他の樹脂の場合についても同様にして、初めの含浸に使
用するワニスとして硬化の遅い樹脂ワニスを用いる。In the case of other resins, a slowly curing resin varnish is used as the varnish used for the initial impregnation.
(作 用)
樹脂含浸されたプリプレグは乾燥機により乾燥されるか
、通常の乾燥機は輻射熱と熱風による乾燥か同時に行わ
れ、効率のよいものである。(Function) The resin-impregnated prepreg is dried using a dryer, or an ordinary dryer uses radiant heat and hot air to dry at the same time, which is efficient.
この場合、輻射熱によってはプリプレグの樹脂は基材の
モノフィラメント周辺から表面層の順に硬化か進み熱風
によってはプリプレグの表面層から基材のモノフィラメ
ント周辺へ硬化が進む。従って、以前の熱風乾燥のみの
乾燥機に比較して、効率はよいか、プリプレグの樹脂は
基材フィラメント周辺の硬化がより進んでいるので、形
成時において、プリプレグ中の気泡か逃げにくく、成形
不良が発生しやすい欠点がある。In this case, depending on the radiant heat, the resin of the prepreg is cured from the vicinity of the monofilament of the base material to the surface layer, and depending on the hot air, the resin of the prepreg is cured from the surface layer of the prepreg to the vicinity of the monofilament of the base material. Therefore, compared to the previous dryer that only used hot air drying, it may be more efficient.The prepreg resin has more advanced curing around the base filament, so it is difficult for air bubbles to escape in the prepreg during the forming process. It has the disadvantage of being prone to defects.
これを解決するために、基材フィラメント周辺の硬化を
遅くする処理をすればよいが、従来このような処理方法
は工業的には実施困難である。従って、プリプレグ全体
の硬化度を下げて成形する、あるいは成形時の昇温をゆ
っくりにする等の方法か実施されているが、積層板の板
厚精度やプレス効率なとに問題があった。In order to solve this problem, a treatment may be performed to slow down the curing around the base filament, but conventionally, such a treatment method is difficult to implement industrially. Therefore, methods such as lowering the degree of curing of the prepreg as a whole or slowing down the temperature rise during molding have been implemented, but there have been problems with the accuracy of the thickness of the laminate and press efficiency.
本発明の場合、硬化速度の遅い樹脂ワニスか基材に含浸
され乾燥され(必要により溶剤を除く程度)、続いてよ
り硬化速度の速い樹脂ワニスを含浸するので、樹脂は硬
化がそれ程進まないうちに基材内部、即ち、基材の繊維
間の微小な間隙まで浸透する。そして、乾燥機により効
率よく乾燥される。In the case of the present invention, the base material is impregnated with a resin varnish that has a slow curing speed, is dried (to the extent that the solvent is removed if necessary), and is then impregnated with a resin varnish that has a faster curing speed, so that the resin is not cured very much. It penetrates into the inside of the base material, that is, into the minute gaps between the fibers of the base material. Then, it is efficiently dried by a dryer.
通常成形特積層されたプリプレグのうち、中心層付近の
プリプレグ、特にモノフィラメント間の間隙に気泡が残
留しやすい。本発明ではこの部分において樹脂の含浸が
よく、かつ樹脂の流動性が優れているので、積層板の端
部から必要以上の樹脂の流出を伴うことなく、気泡の残
留を防止することができる。従って、積層板の板厚精度
も優れたものとなる。Air bubbles tend to remain in the prepreg near the center layer, especially in the gaps between the monofilaments, among the prepregs that are usually formed and laminated. In the present invention, since the resin is well impregnated in this part and the resin has excellent fluidity, it is possible to prevent bubbles from remaining without excessive resin flowing out from the end of the laminate. Therefore, the thickness accuracy of the laminate is also excellent.
(実施例)
以下、ガラスクロスにエポキシ樹脂ワニスを2回含浸す
る場合について、実施例を示す。2次含浸する樹脂ワニ
スの処方は次の通りである。(Example) Hereinafter, an example will be shown in which a glass cloth is impregnated twice with epoxy resin varnish. The formulation of the resin varnish for secondary impregnation is as follows.
エポキシ樹脂 100部(
ビスフェノールA型、エポキシ当量750)ジンアンジ
アミド 1.4部2エチル4−メ
チルイミダゾール(触媒)0.1部溶 剤
100 部1
次含浸する樹脂ワニスの処方は、前記2次含浸ワニス処
方の硬化触媒である2エチレン4−メチルイミダゾール
の量を変えたものである。触媒量は第1表の通りである
。100 parts of epoxy resin (
Bisphenol A type, epoxy equivalent: 750) Dianediamide 1.4 parts 2-ethyl 4-methylimidazole (catalyst) 0.1 part Solvent
100 part 1
The formulation of the resin varnish to be subsequently impregnated is such that the amount of 2ethylene 4-methylimidazole, which is a curing catalyst, is changed from the formulation of the secondary impregnated varnish. The amount of catalyst is shown in Table 1.
プレグを得た。次いで2次含浸し、同様に乾燥して、樹
脂分42%でゲルタイム(170℃)約60秒のプリプ
レグを得た。但し、比較例2は1次ワニスの含浸を行っ
ていないので、2次含浸のみて樹脂分か他の例と同等に
なるように調整した。Got preg. Next, a second impregnation was carried out and drying was carried out in the same manner to obtain a prepreg with a resin content of 42% and a gel time (170° C.) of about 60 seconds. However, in Comparative Example 2, since the primary varnish impregnation was not performed, only the secondary impregnation was performed and the resin content was adjusted to be equal to that of the other examples.
各側において、得られたプリプレグ8枚を重ね合わせ、
170°C140kg/a(て120分間加熱加圧して
厚さ1.60の積層板を得た。On each side, stack the 8 sheets of prepreg obtained,
A laminate with a thickness of 1.60 was obtained by heating and pressing at 170° C. and 140 kg/a (120 minutes).
以上の製造工程において、成形性、積層板のガラス転移
点、板厚精度をそれぞれ測定し、第2表の結果を得た。In the above manufacturing process, the moldability, glass transition point of the laminate, and plate thickness accuracy were measured, and the results shown in Table 2 were obtained.
ガラスクロスに1次ワニスを含浸し、熱風輻射乾燥機で
1.70℃、1.5分間乾燥し樹脂分25%のブリ第2
表
測定結果
(測定方法)
成形性:積層板の外観を観察した。A glass cloth was impregnated with the primary varnish and dried in a hot air radiation dryer at 1.70°C for 1.5 minutes to form a yellowtail with a resin content of 25%.
Surface measurement results (measurement method) Formability: The appearance of the laminate was observed.
ガラス転移点 粘弾性スペクトルより求めた。Glass transition point: Determined from viscoelastic spectrum.
板厚精度:横方向基材端により10111111の点と
中心点及びその間を8等分して計9点において、基材厚
みを測定し、次式で厚み精度を求めた。Plate thickness accuracy: The base material thickness was measured at a total of 9 points by dividing the 10111111 point and the center point into 8 equal parts by the lateral base material edge, and the thickness accuracy was determined using the following formula.
(発明の効果)
以上の結果からも明らかなように、本発明によるプリプ
レグを使用して得られた積層板は、成形性が良好であり
、従って通常の1回含浸の場合に比較して優れた特性を
有りでお−7)、−7フインバタン等高度の性能の要求
される回路用基板として好適である。(Effects of the Invention) As is clear from the above results, the laminate obtained using the prepreg according to the present invention has good formability, and is therefore superior to the case of ordinary one-time impregnation. It is suitable as a circuit board that requires high performance such as O-7) and -7 Finbatan.
Claims (3)
を基材に塗布・含浸するにあたり、硬化速度の遅い樹脂
ワニスから順に塗布・含浸することを特徴とするプリプ
レグの製造方法。(1) A prepreg manufacturing method characterized in that when applying and impregnating a base material with two or more resin varnishes having different curing speeds, the resin varnishes having a slow curing speed are coated and impregnated in order.
によるものであることを特徴とする請求項1記載のプリ
プレグの製造方法。(2) The prepreg manufacturing method according to claim 1, wherein the difference in curing speed of the resin varnish is due to a difference in the amount of curing catalyst.
硬化触媒配合割合(樹脂に対する)の比が0.6〜0.
95である請求項2記載のプリプレグの製造方法。(3) The ratio of the curing catalyst compounding ratio (relative to the resin) of the slow curing speed resin varnish and the fast curing speed resin varnish is 0.6 to 0.
95. The method for manufacturing a prepreg according to claim 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6833990A JP2898690B2 (en) | 1990-03-20 | 1990-03-20 | Manufacturing method of prepreg |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6833990A JP2898690B2 (en) | 1990-03-20 | 1990-03-20 | Manufacturing method of prepreg |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03269023A true JPH03269023A (en) | 1991-11-29 |
JP2898690B2 JP2898690B2 (en) | 1999-06-02 |
Family
ID=13370987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6833990A Expired - Fee Related JP2898690B2 (en) | 1990-03-20 | 1990-03-20 | Manufacturing method of prepreg |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2898690B2 (en) |
-
1990
- 1990-03-20 JP JP6833990A patent/JP2898690B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2898690B2 (en) | 1999-06-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |