JPS6026036A - Production of laminated sheet - Google Patents
Production of laminated sheetInfo
- Publication number
- JPS6026036A JPS6026036A JP13464683A JP13464683A JPS6026036A JP S6026036 A JPS6026036 A JP S6026036A JP 13464683 A JP13464683 A JP 13464683A JP 13464683 A JP13464683 A JP 13464683A JP S6026036 A JPS6026036 A JP S6026036A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pva
- resin
- saponification
- degree
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
本発明は、紙等の基材を用いるフェノール樹脂積層板の
打抜き加工性を改良した製造法に関する。
近年、印刷回路パターンの大形化、高密度化。
部品実装工程の自動化1こ伴い1寸法精度及び密集小穴
の打抜き加工性の向上が要求されている。
高度の寸法精度の要求から、回路基板の打抜き温度は吐
下し、常温で打抜かれる例もある。その場合、低温域で
基板である積層板か可塑化されていることと同時1こ眉
間密着性の強い事が必要である。
樹脂ワニスの下塗り、上塗りの2段塗工により積層材料
を製造する場合、その目的は高度の電気特性、耐湿耐水
性を得ることである。そのため、樹脂ワニスの基材への
浸透性の観点から、従来は下塗り1こフェノール樹脂初
期縮合物力を多く用いられている。これらは低分子量で
、ある程度の水溶性を有するため基材の処理効果は大き
い。この傾向は特1こ紙基材1こおいて顧著である。
一方、現在使用されている上塗り用掴脂は、多くは桐油
等の天然乾性油変性フェノール樹脂のため、親油性が強
くなり、紙基材あるいは前記下塗り処理後の基材との親
和性力1′低下し、打抜き時の局間密着のflt−1・
、穴間クラック、眉間剥離等の現象が[、ば(7ば発生
[る1、さらに、」ユ塗り用樹脂を可塑化するため、桐
油等の天然乾性油の含量を増加させたり、あるいはリン
系化合物を使用すれば、それたり基材との親和性は低下
する。この場合、下塗り用樹脂をノニルフェノール等の
アルキル変性フェノール樹脂にすると、層間密着か向、
1−することが知られているが、アルキルフェノール含
有量が増加すると水溶性を失い、基材の処理効果か低下
するので限界かある。
本発明は、上記の問題を解決するため、ポリビニルアル
コール(以下PVAと略す)をフェノール樹脂切開縮合
物に添加した混合物で基材殊ζこ紙基材を予め処理する
ことにより、基材の処理効果を保持すると共に、層間密
着の向上及び低温時の可塑化を保持して積層板の打抜き
加工性を向」−さぜることを目的とする。
PVAは従来より紙処理剤、水溶性接着剤として多く用
いられており、その分子構造中の水酸基により基材、殊
に紙基材との親和性か゛期待される。また、残存酢酸基
、C−C結合部の作用により界面活性剤的効果も期待で
き、」−塗り用樹脂との親和性も+411待できる。さ
らに、積層材料の層間に、ある程度高分子量のPVAを
分散させる事により、低温時の積層板の1■塑化か゛可
能である。本発明で使用するPVAは、フェノール樹脂
初期縮合物の水1メタノール溶Itご溶解させるために
、ケン化度は低い方が望ましく、70〜80%か適当で
ある。80%を越えると前記フェノール樹脂初期縮合物
の水1メタノール溶液には溶解せず、70%未満では、
基材の処理効果、層間密着力の向上が不充分である。ま
た、本発明で使用するPVAは、積層材料中で硬化反応
に関4するものでないため、ある程度高分子量のものが
好ましいが、溶解時の粘度から実用的には分子量100
0〜1700程度が適当である。
尚、PVAの添加量としては、重量比で(PVA/フェ
ノール樹脂初期縮合物固形)−5/95〜20 / 8
0か望ましい。P’VAの添加量か少量の場合、所定の
効果は小さく、多量の場合は下塗り樹脂の硬化阻害及び
下塗り樹脂混合物の粘度増大を生じ実用的ではない。
以下実施例1こよって具体的に説明する。
実施例1
撹拌、渦度旧、冷却器をつけた3日フラスコに、フェノ
ール1000j1.86’%バラホルムアルデヒド74
0P、l・リンチルアミン50yを加え、80℃で反応
させ、生成物の160℃熱盤上でのゲル化時間か8分1
こなった時点で冷却し、メタノールで樹脂分50チに調
整した(ワニスAとする〕。
ワニスAをoooy、ケン化度75%、分子量1500
のPVAを50F、水’175f。
メタノール776ノを配合し、下塗り用樹脂混合物を得
る(ワニスBとする)。
に
次ξこ、同じく80フラス=λμ油720y%m−クレ
ゾール580p 、P TS酸074Fを投入し、80
℃で1時間反応後、フェノール 5−
500y、86%バラホルムアルデヒド450)、25
%アンモニア水35yを投入シ、80℃で反応を続け、
生成物の160℃熱盤上でのゲル化時間が6分になった
時点で脱水し、後lこメタノールを加えて樹脂分50%
に調整The present invention relates to a manufacturing method that improves the punching processability of a phenolic resin laminate using a base material such as paper. In recent years, printed circuit patterns have become larger and more dense. With the automation of the component mounting process, improvements in dimensional accuracy and punching workability for densely packed small holes are required. Due to the requirement for a high degree of dimensional accuracy, the punching temperature for circuit boards is reduced, and in some cases, circuit boards are punched at room temperature. In that case, it is necessary that the laminate plate serving as the substrate is plasticized in a low temperature range and at the same time has strong adhesion between the eyebrows. When producing a laminated material by applying a two-stage coating of resin varnish, such as an undercoat and a topcoat, the purpose is to obtain high electrical properties, moisture resistance, and water resistance. Therefore, from the viewpoint of the permeability of the resin varnish into the base material, conventionally, a phenol resin initial condensate is often used as an undercoat. These have a low molecular weight and have a certain degree of water solubility, so they have a great effect on treating substrates. This tendency is particularly noticeable in paper substrates. On the other hand, most of the lubricants currently used for topcoating are made of natural drying oil-modified phenolic resins such as tung oil, so they have strong lipophilicity and have an affinity for paper base materials or base materials after the above-mentioned undercoat treatment. 'flt-1 of the contact between the holes during punching.
In addition, in order to plasticize the coating resin, the content of natural drying oils such as tung oil or phosphorous If such a compound is used, the compatibility with the base material will be reduced.In this case, if an alkyl-modified phenol resin such as nonylphenol is used as the undercoat resin, interlayer adhesion will be reduced.
However, there is a limit because as the alkylphenol content increases, water solubility is lost and the treatment effect on the substrate is reduced. In order to solve the above-mentioned problems, the present invention has been developed by pre-treating a base material, especially a paper base material, with a mixture in which polyvinyl alcohol (hereinafter abbreviated as PVA) is added to a phenolic resin cutting condensate. The purpose is to improve the punching workability of the laminate by maintaining the effect, improving interlayer adhesion, and maintaining plasticization at low temperatures. PVA has conventionally been widely used as a paper treatment agent and a water-soluble adhesive, and is expected to have compatibility with substrates, especially paper substrates, due to the hydroxyl groups in its molecular structure. In addition, it can be expected to have a surfactant effect due to the action of the residual acetate group and the C--C bond, and it can also be expected to have a 411 degree of affinity with coating resins. Furthermore, by dispersing PVA of a certain degree of high molecular weight between the layers of the laminated material, it is possible to plasticize the laminated plate at low temperatures. The degree of saponification of the PVA used in the present invention is desirably low, and is suitably 70 to 80% in order to dissolve the phenolic resin initial condensate in water and methanol. If it exceeds 80%, the phenolic resin initial condensate will not dissolve in a water-methanol solution, and if it is less than 70%,
The treatment effect of the base material and the improvement of interlayer adhesion are insufficient. Furthermore, since the PVA used in the present invention is not involved in the curing reaction in the laminated material, it is preferable to have a relatively high molecular weight.
Approximately 0 to 1700 is appropriate. The amount of PVA added is in a weight ratio (PVA/phenol resin initial condensate solid) -5/95 to 20/8.
0 or desirable. If the amount of P'VA added is small, the desired effect will be small; if it is added in a large amount, curing of the undercoat resin will be inhibited and the viscosity of the undercoat resin mixture will increase, making it impractical. Example 1 will be specifically explained below. Example 1 Phenol 1000j 1.86'% formaldehyde 74 was added to a 3-day flask equipped with stirring, vorticity, and condenser.
Add 50y of 0P, l-lyntylamine, react at 80°C, and gel the product on a 160°C heating plate for about 8 minutes.
At this point, it was cooled and the resin content was adjusted to 50% with methanol (referred to as varnish A).Varnish A was oooy, saponification degree 75%, molecular weight 1500.
PVA 50F, water '175F. 776 methanol was blended to obtain a resin mixture for undercoating (referred to as varnish B). Next, add 80 flask = λμ oil 720y% m-cresol 580p, PTS acid 074F,
After reacting for 1 hour at °C, phenol 5-500y, 86% formaldehyde 450), 25
Add 35y of ammonia water and continue the reaction at 80℃.
When the gelation time of the product on a 160°C heating plate reaches 6 minutes, it is dehydrated and then methanol is added to reduce the resin content to 50%.
adjusted to
【7、桐油変性フェノール樹脂を得た(ワニスC
とする)。
クラフト紙をワニスBに浸漬処理し、(付着樹脂量/浸
漬熟理後積層材料重量)=20チとし、140℃で5分
間乾燥後、続いてワニスCを総樹脂量50%となる様に
塗工乾燥する。この様にして得られた積層材料8枚と3
5μ厚の接着剤付き銅箔を重ね合わせ、温度160〜1
65℃、圧力xookV/mの条件下で60分間加熱加
圧し、1.fimm厚の銅張り積層板を得た。
実施例2
実m例1と同様の装置にノニルフェノール220y、3
7%ホルマリン60y、86%パラホルムアルデヒド8
0P、トリメチルア 6−
ミソ65ノを投入し、81)′″Oで2時間反応後、フ
ェノール600y、8f1%パラホルム450ノを投入
し、80”Oで反応を続け、生成物の160°O熱盤1
.でのゲル化時間か3分になるまで反応させた後玲却し
メタノール樹脂分50チに調整した(ワニスDとする)
。
ワニスDを900)、ケン化度70%1分子11000
の1)V、Aを50y、水’I’159゜メタノール7
75yを配合し、下塗り用樹脂混合物を得る(ワニスE
とする)。
クラフト紙をワニスEを用いて浸漬処理l7、以下実施
例】と同様にして1.61厚の銅張り積層板を得た。
比較例1
ワニスAを1000F、水7505E、メタノール75
09配合した溶液でクラフト紙を浸漬処理し、以下実施
例1と同様の方法で1.6關厚の飼張り積層板を得た。
比較例2
ワニスDIE:]000p、水750.F、メタノール
750りを配合した溶液でクラフト紙を浸漬処理し、以
下実施例と同様の方法で1.6關厚の銅張り積層板を得
た。
これらの飼張り積層板の特性を第1表に示す。
第 1 表
(→ポンチ径0.8+nJ21 、1.6rtan ピ
ッチ第1表から明らかなように、本発明によれば、フェ
ノール樹脂初期縮合物IこPVAを添加した溶液で基材
を予め処理、乾燥すること1こより、積層板の打抜き加
工時の層間密着力か向」ニし、打抜き湿度を1m下させ
得ることで高密度の打抜きパターンに対応できる点、そ
の工業的価値は極めて大なるものである。
特許出願人
9−一[7. Obtained phenolic resin modified with tung oil (varnish C
). Kraft paper was immersed in varnish B, (adhesive resin amount/laminated material weight after soaking) = 20 inches, dried at 140°C for 5 minutes, and then varnish C was added so that the total resin amount was 50%. Apply and dry. Eight laminated materials obtained in this way and three
Copper foil with adhesive of 5μ thickness is overlapped and heated to 160~1
Heat and pressurize for 60 minutes at 65°C and a pressure of xookV/m, 1. A copper-clad laminate with a fimm thickness was obtained. Example 2 Nonylphenol 220y, 3 was added to the same apparatus as Example 1.
7% formalin 60y, 86% paraformaldehyde 8
After 2 hours of reaction at 81)''O, 600y of phenol and 450y of 8F1% paraform were added, and the reaction was continued at 80''O. hot plate 1
.. After reacting until the gelation time reached 3 minutes, the mixture was cooled and the methanol resin content was adjusted to 50 g (referred to as varnish D).
. Varnish D 900), degree of saponification 70% 1 molecule 11000
1) V, A 50y, water 'I' 159° methanol 7
75y to obtain a resin mixture for undercoating (Varnish E
). Kraft paper was immersed in varnish E in the same manner as in Example 17 below to obtain a copper-clad laminate having a thickness of 1.61 mm. Comparative Example 1 Varnish A 1000F, water 7505E, methanol 75
Kraft paper was immersed in the solution containing No. 09, and the same method as in Example 1 was carried out to obtain a 1.6-thick laminate. Comparative Example 2 Varnish DIE: ]000p, water 750. Kraft paper was immersed in a solution containing 750 g of methanol, and a 1.6 mm thick copper-clad laminate was obtained in the same manner as in the examples. The properties of these feed laminates are shown in Table 1. Table 1 (→Punch diameter 0.8+nJ21, 1.6rtan pitch As is clear from Table 1, according to the present invention, the base material is pretreated with a solution containing phenolic resin initial condensate I and PVA and dried. One of the advantages of this method is that it can reduce the interlayer adhesion during the punching process of laminates and reduce the punching humidity by 1 m, making it possible to handle high-density punching patterns, and its industrial value is extremely great. Yes. Patent applicant 9-1
Claims (1)
化度70〜80%のポリビニルアルコールを添+JII
L、た混合物で処理し、次いで前記処理基材に熱硬化
性樹脂を含浸乾燥して得た積層材料を積層成形すること
を特徴とする積層板の製造法。 2 フェノール樹脂初期結合動力t、フェノール−小ル
ムアルデヒド樹脂初期縮合物またはアルキルフェノール
−ホルムアルデヒドm lli 初期縮合物であること
を特徴とする特許請求の範囲第1項記載の銅張り積層板
の製造法。[Claims] 1. The base material for the laminate is prepared by adding polyvinyl alcohol with a degree of saponification of 70 to 80% to a phenol resin initial condensate + JII
1. A method for producing a laminate, which comprises treating the substrate with a mixture of L. and then impregnating the treated substrate with a thermosetting resin and drying it to form a laminate material. 2. The method for producing a copper-clad laminate according to claim 1, characterized in that the initial bonding power t of phenol resin is a phenol-small luminaldehyde resin initial condensate or an alkylphenol-formaldehyde initial condensate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13464683A JPS6026036A (en) | 1983-07-22 | 1983-07-22 | Production of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13464683A JPS6026036A (en) | 1983-07-22 | 1983-07-22 | Production of laminated sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6026036A true JPS6026036A (en) | 1985-02-08 |
JPH0126374B2 JPH0126374B2 (en) | 1989-05-23 |
Family
ID=15133231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13464683A Granted JPS6026036A (en) | 1983-07-22 | 1983-07-22 | Production of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6026036A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0457731A (en) * | 1990-06-13 | 1992-02-25 | Matsushita Electric Ind Co Ltd | Device for attaching label |
CN107297793A (en) * | 2017-08-30 | 2017-10-27 | 含山县茂盛胶合板厂 | A kind of preparation method of high-intensity packing case glued board |
-
1983
- 1983-07-22 JP JP13464683A patent/JPS6026036A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0457731A (en) * | 1990-06-13 | 1992-02-25 | Matsushita Electric Ind Co Ltd | Device for attaching label |
CN107297793A (en) * | 2017-08-30 | 2017-10-27 | 含山县茂盛胶合板厂 | A kind of preparation method of high-intensity packing case glued board |
Also Published As
Publication number | Publication date |
---|---|
JPH0126374B2 (en) | 1989-05-23 |
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