JPH0326625Y2 - - Google Patents
Info
- Publication number
- JPH0326625Y2 JPH0326625Y2 JP1989028065U JP2806589U JPH0326625Y2 JP H0326625 Y2 JPH0326625 Y2 JP H0326625Y2 JP 1989028065 U JP1989028065 U JP 1989028065U JP 2806589 U JP2806589 U JP 2806589U JP H0326625 Y2 JPH0326625 Y2 JP H0326625Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- receiver
- insertion pin
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 26
- 230000037431 insertion Effects 0.000 claims description 26
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989028065U JPH0326625Y2 (US07902200-20110308-C00004.png) | 1989-03-14 | 1989-03-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989028065U JPH0326625Y2 (US07902200-20110308-C00004.png) | 1989-03-14 | 1989-03-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02119367U JPH02119367U (US07902200-20110308-C00004.png) | 1990-09-26 |
JPH0326625Y2 true JPH0326625Y2 (US07902200-20110308-C00004.png) | 1991-06-10 |
Family
ID=31251111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989028065U Expired JPH0326625Y2 (US07902200-20110308-C00004.png) | 1989-03-14 | 1989-03-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0326625Y2 (US07902200-20110308-C00004.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019153553A (ja) * | 2018-03-06 | 2019-09-12 | Fdk株式会社 | 電子回路モジュール及び電子回路モジュールの製造方法 |
-
1989
- 1989-03-14 JP JP1989028065U patent/JPH0326625Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH02119367U (US07902200-20110308-C00004.png) | 1990-09-26 |
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