JPH032654U - - Google Patents
Info
- Publication number
- JPH032654U JPH032654U JP1989063392U JP6339289U JPH032654U JP H032654 U JPH032654 U JP H032654U JP 1989063392 U JP1989063392 U JP 1989063392U JP 6339289 U JP6339289 U JP 6339289U JP H032654 U JPH032654 U JP H032654U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- end surface
- heat sink
- excluding
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063392U JPH032654U (enExample) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989063392U JPH032654U (enExample) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032654U true JPH032654U (enExample) | 1991-01-11 |
Family
ID=31593397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989063392U Pending JPH032654U (enExample) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032654U (enExample) |
-
1989
- 1989-05-30 JP JP1989063392U patent/JPH032654U/ja active Pending