JPH03262149A - Lsi package - Google Patents

Abstract

PURPOSE:To enable the function of an LSI to fulfill sufficiently by a method wherein a package is provided with a groove for packaging a chip-shaped capacitor and connecting terminals for connecting electrically with the terminals of the capacitor are provided on the inner side of this groove. CONSTITUTION:A connecting terminal 5 and a connecting terminal 6, which are provided in the interior of a groove 7 prepared in a package 1, are respectively connected to terminals of a capacitor by soldering or the like and the capacitor 2 is functioned as a by-pass capacitor. At this time, a connecting terminal 3 and a connecting terminal 4 are respectively wired to a power supply and an earthing conductor. Thereby, it becomes possible that the by-pass capacitor is packaged in the package itself of an element and a disturbance, such as the fluctuation of the power supply or the like, is limited to the minimum and the operation of an LSI can be sufficiently fulfilled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a package for an LSI element, and particularly to a structure in which a capacitor is mounted on the element itself.

[Conventional technology]

Conventionally, when a circuit is constructed by combining semiconductors such as ICs and LSIs, bypass capacitors have been mounted in close proximity at the same time to stabilize the power supply, but the mounting locations are limited. For some reason, such as the absence of an LSI element, there have been cases where the LSI element is located far away, and the LSI function cannot be fully demonstrated.

[Problem to be solved by the invention]

The above-mentioned conventional method of mounting capacitors in LSI packages had the disadvantage that there was a limit to how close they could be because the LSI element and bypass capacitor were separated. The capacitor-mounted LSI package of the invention has a hole for mounting the capacitor and a connection terminal for electrically connecting with the terminal of the capacitor inside the groove.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a front view of one embodiment of the present invention.

The package 1 is the LSI element itself. Capacitor 2 is shown mounted in package 1.

FIG. 2 is a side view of this embodiment, and FIG. 3 is a top view of this embodiment. FIG. 4 is an exploded perspective view of a portion of the present invention.

Connection terminals 5 and 6 provided inside the capacitor 7 prepared in the package 1 are connected by soldering, etc., and the capacitor 2 functions as a bypass capacitor. At this time, the connection terminal 3 and the connection terminal 4 are wired to a power supply line and a ground line, respectively.

〔Effect of the invention〕

As explained above, the present invention has the effect that by mounting a bypass capacitor in the element package itself, it is possible to limit disturbances such as power supply fluctuations to a minimum, and the operation of the LSI can be fully demonstrated. .

1...Package, 2...Capacitor, 3...Connection terminal, 4...Connection terminal, 5...Connection terminal, 6...Connection terminal, 7...Groove.

Claims (1)

[Claims] An LSI package characterized by having a groove for mounting a chip-shaped capacitor, and having connection terminals for electrically connecting with terminals of the capacitor inside the groove.