JPH0325442A - Pellicle frame - Google Patents

Abstract

PURPOSE:To shorten the time for penetration of a soln. and to decrease the remaining on the tacky adhesive film of a photomask after peeling by constituting the pellicle frame of holes for injecting a release soln. from the outside surface and a groove which can bring the soln. into direct contact with the tacky adhesive film. CONSTITUTION:The adhesive surface side of the pellicle frame 1 to the photomask is formed with the groove 2 at the center of the end face at the depth of 1/3 the frame width and 1/2 the frame height and is provided with the holes 3 communicating with the groove 2 at several pieces each on respective sides from the outside surface of the pellicle frame 1. An aq. surfactant soln. is injected as the release soln. and the holes 3 or the frame is immersed together with a photomask in the aq. soln. Since plural pieces of the holes are bored, air ventilation is easily executed and the release soln. is filled in the groove 3. Since the tacky adhesive film 4 comes into direct contact with the release soln. accumulated in the groove 3, the time for the penetration of the release soln. into the tacky adhesive film 4 increases. The time for the penetration of the soln. is shortened in this way and since the soln. comes into direct contact with the tacky adhesive film 4, the remaining of the tacky adhesive film 4 of the photomask after the peeling is lessened.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a vellicle frame dedicated to a protective film (hereinafter referred to as a pellicle film) for preventing dust adhesion during pattern baking of photomasks used in the manufacture of semiconductor devices. .

BACKGROUND OF THE INVENTION When manufacturing semiconductor devices, in order to expose a predetermined device structure or pattern on a semiconductor substrate, the pattern is enlarged 1 to 10 times and formed on a glass substrate on which a metal such as chromium (Cr) is vapor-deposited. A photomask is used. Since the dust attached to the photomask is directly transferred onto the semiconductor substrate, it becomes a major factor in reducing the yield of semiconductor devices. In recent years, in order to prevent dust from adhering to the photomask pattern surface,
A photomask protective film, a so-called pellicle, which is an ultra-thin film pasted onto a metal frame, has come into use.

FIG. 3 shows a sectional view of a photomask equipped with the above-mentioned velicle. An ultra-thin film such as nitrocellulose (so-called pellicle film) is applied to the pellicle frame 1 made of metal.
A photomask 6 having a mask pattern 7 with a pellicle pasted thereon formed of Cr etc. and a pellicle frame 1.
It is adhered with an adhesive film 4 attached to the end face of the. When the dust 8 attached to the vericle film 5 is transferred to the semiconductor substrate (so-called wafer) 1o via the lens 9, the imaging area 11 of the dust 8 is sufficiently far away from the imaging surface on the wafer 10. It is not transcribed because it is

Problems to be Solved by the Invention However, in the conventional structure described above, when the pellicle is to be peeled off due to damage or deterioration of the pellicle film, the photomask with the pellicle is immersed in an organic solvent or surfactant that dissolves the adhesive film 4. Since force was applied to part a after the solution had penetrated from parts a and b, it took time for the solution to penetrate into the casing, and the problem was that an adhesive film was left behind on the photomask. had.

The present invention solves the above-mentioned conventional problems, and aims to provide a pellicle frame that can shorten the penetration time of a stripping solution.

Means for Solving the Problems In order to achieve this object, the pellicle frame of the present invention is comprised of a hole through which a stripping solution is injected into the outer surface and a groove that allows the solution to come into direct contact with the adhesive film.

Function: This structure increases the area of the adhesive film that comes into direct contact with the peeling solution, shortens solution penetration time, and allows the solution to directly contact the adhesive film, reducing the amount of adhesive film remaining on the photomask after peeling.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

The button in FIG. 1 and the button in FIG. 2 show an embodiment of the velicle frame of the present invention.

As shown in the figure, a frame made of metal (gold frame) 1
A groove 2 is formed at the center of the end face on the side of the adhesive surface to which the photomask is bonded, and has a depth of 1/3 the width of the frame and 1/2 the height of the frame. The outer surface of the pellicle frame has several holes 3 on each side that communicate with the grooves 2. An adhesive film 4 such as a double-sided tape having the width of the frame is attached to the end face of the velicle frame on the adhesive side. On the opposite end surface, a pellicle film 6 made of nitrocellulose IS or the like is pasted to fill the entire frame.

The process of peeling off the vellicle with the vellicle frame constructed as described above will be explained.

An aqueous surfactant solution is injected into the housing hole 3 as a stripping solution, or the entire photomask is immersed in the aqueous solution. Since there are a plurality of holes, air is easily vented and the groove 3 is filled with a stripping solution. Since the adhesive film 4 is in direct contact with the stripping solution accumulated in the groove 3, the time for the stripping solution to permeate into the adhesive film 4 is shortened.

In the case of this embodiment, the conventional stripping solution immersion time, which was 30 minutes or more, is reduced to 1/2 or less. If the adhesive surface of the photomask is an Or film, the adhesion is strong and cannot be peeled off by dipping in a solution for about 30 minutes, and even if force is applied to remove it, most of the adhesive remains on the photomask side and cannot be removed. However, in the case of the present invention, the immersion time of about 30 minutes is enough to remove the photomask, and there is little adhesive film remaining on the mask side. It does not cause any damage to the υ and greatly helps improve work efficiency.

Effects of the Invention As is clear from the above explanation, according to the present invention, the solution penetration time can be shortened, and since the solution comes into direct contact with the adhesive film, it is possible to reduce the amount of the adhesive film remaining on the photomask after peeling.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a perique/re frame according to an embodiment of the present invention, Fig. 2 is a sectional view of a frame with the frame, and Fig. 3 is a perique/re frame with a conventional perique I frame. FIG. 1... Pellicle frame, 2... Peeling M
Solution groove, 3...Peeling solution inlet, 4...
...Adhesive film, 5...Bellicle film, 6...
・Photomask, 7... Mouth... Mask pattern, 8...
... Garbage, 9 ... Lens, 1o ...
・Wafer, 11... Imaging of dust.

Claims (1)

[Claims] A pellicle frame characterized by having an adhesive film peeling solution injection groove and a peeling solution injection hole that communicates with the groove from the outer surface on the side that is bonded to the photomask.