JPH03254139A - Cleaning jig for tweezers - Google Patents

Abstract

PURPOSE:To enable removal of an inorganic matter without touching a wafer attracting member by providing a boxed member having a path of cleaning liquid and pure water at a side part, a guide for positioning the wafer attracting member and a keep member to press the wafer attracting member. CONSTITUTION:A device is provided with a boxed member 11 having a path of cleaning liquid and pure water at a side part, a guide 13 which is provided to an inner side of the boxed member 11 and positions a wafer attracting member 16 and a keep member 17 which is attached to the boxed member to open and close freely and presses the wafer attracting member 16. The wafer attracting member 16 is placed against a region A of the boxed member 11 with a pincette end attached to the wafer attracting member 16 with the keep member 17 open. If the pincette is pulled upward with the keep member 17 closed, the wafer attracting member 16 alone is left in the region A. In the state, for example, the member 16 is immersed in cleaning liquid such as hydrofluoric acid, the cleaning liquid is made to flow, and the member 16 is washed with pure water. Thereby, it is possible to clean the wafer attracting member 16 with chemicals without touching and to remove an inorganic matter as well as an organic matter.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning jig for tweezers, and more particularly to a jig for cleaning a wafer suction member that is detachably attached to the tip of a tweezers that grips a semiconductor wafer. .

[Prior Art and Problems] Conventionally, as tweezers for adsorbing semiconductor wafers, there are known tweezers having structures shown in FIGS. 4 and 5, for example. Here, FIG. 4 is a back view, and FIG. 5 is a side view.

1 in the figure is a cylindrical handling part made of Teflon and having an outer diameter R of 12 mm, for example. This handling section 1 is provided with a switch button 2 for adsorbing and demounting a wafer. Here, the switch button 2 is configured such that when pressed, a circuit opens and a wafer is attracted, and when it is released, the circuit closes and a wafer is attached or detached. One end of the handling section 1 is connected to a vacuum pump (not shown). A suction pipe 3, which is a stainless steel pipe covered with a Teflon tube, is connected to the other end of the handling section 1. This suction pipe 3 is generally held at an angle of 15 to 20 degrees (
θ) degree of inclination. A removable Teflon wafer suction member 4 is attached to the tip of the suction pipe 3. Note that the portion where this suction member 4 is attached to the suction vibrator 3 is tubular. The wafer suction surface sr: of the suction member 4 has suction holes 5 for suctioning the wafer by vacuum. The shape of the adsorption member 4 is, for example, a thickness (T) of 5 mm and a length (L) of 20 II m.
It is. Note that the adsorption surface of the chip 4 may have a structure in which a large number of pores 6 are opened as shown in FIG.

By the way, when the suction member is a quartz bottle set, there are problems such as brittleness, poor management, and the risk of damaging the wafer if the nodling method is incorrect. The manufactured ones are used.

However, according to the bin set shown in FIGS. 4 and 5,
The suction jig is made of Teflon, but the pipes that make up the suction vibrator are made of stainless steel, so the only way to clean the bottle set was to wipe it with an organic solvent such as alcohol. Therefore, only organic matter could be extracted, and inorganic matter could not be extracted.

The present invention was made in view of the above circumstances, and an object of the present invention is to provide a cleaning jig for a bottle set that can remove not only organic substances but also inorganic substances by cleaning the wafer adsorption member with chemicals without directly touching it. do.

[Means for Solving the Problems] The present invention provides a jig for cleaning a flat wafer suction member that is detachably attached to the tip of a bottle set for suctioning semiconductor wafers, in which a cleaning liquid or pure water is provided at least on the side. a box-shaped member having a passage; a guide provided on the inner surface of the second box-shaped member for positioning the wafer suction member;
The cleaning jig for a bottle set is characterized in that it includes a pressing member that is attached to the box-shaped member so as to be openable and closable and that presses down the wafer suction member.

In the present invention, as the etching solution, for example, NaO
Examples include H+H20 liquid, NH3+H20 liquid, HF+HNO9 relative, and the like.

In the present invention, the etching rate with the etching solution depends on the crystal orientation of the wafer, conductivity type, doped impurity element, lattice defects, and surface structure of the crystal, and is appropriately selected and determined.

[Operation] According to the present invention, not only organic substances but also inorganic substances can be removed by cleaning the wafer adsorption member with chemicals without directly touching it.

[Embodiment] Hereinafter, a cleaning jig for a bottle set according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. Here, FIG. 1 is a plan view of the cleaning jig, FIG. 2 is a sectional view taken along the line XX in FIG. 1, and FIG. 3 is a front view of FIG. 2.

Reference numeral 11 in the figure is a box-like member made of Teflon and whose side and bottom parts are configured in a lattice shape with a plurality of square members 12 to facilitate the passage of cleaning liquid and pure water.

A guide 13 for positioning the semiconductor wafer is provided on the inner surface of the box-shaped member 11. This guide 13 consists of a pair of protrusions 14 and 15 provided on the square member 12.
It is made up of. The distance between these protrusions (L)
is slightly larger than the thickness (T) of the wafer suction member 16, specifically, for example, 7IIIM. The reason why the distance is made larger than the width W of the suction member is to improve cleaning efficiency.

Further, for the same reason, the height (H) of the protrusion is, for example, 2 mm, which is a level that does not protrude from the area A surrounded by the pair of protrusions 14 and 15 when the wafer adsorption member I6 is set in the box-shaped member II. It is good if the height is about the same.

A plate-shaped presser member 17 that opens and closes in the direction of arrow Y in the form of a hinge is attached to the upper part of the box-shaped member IT at one end of the box-shaped member. This holding member 17 has an opening 18 having a width (W') slightly shorter than the width (W) of the wafer suction member 16 along the longitudinal direction. A handle 19 is provided at the upper end of the presser member 17, and a notch 20 is provided at the lower part of the handle 19 to engage the square member 12 when the presser member 17 is closed.

The cleaning jig having such a configuration is used in the following manner.

(1) Setting the wafer suction member - With the holding member 17 open and the wafer suction member 16 attached to the tip of the bottle set, set the protrusion 14 of the box-shaped member 11.
．． Set it up against area A surrounded by 15. Next, the presser member 17 is closed. At this time, the button 20 provided at the lower part of the handle 19 of the presser member 17 is hooked onto the square member 12 of the box-shaped member 11. Next, pull the tweezers to the top in this state. At this time, since the shoulder portion of the wafer suction member 16 is pressed by the presser member 17, the main body portion of the tweezers is pulled up, leaving only the wafer suction member 16 in the area A as shown in FIG.

(2) Cleaning: With the wafer suction member 16 set in the box-shaped member 11 in this manner, it is immersed in a cleaning liquid such as hydrofluoric acid or hydrofluoronitric acid, and the cleaning liquid is allowed to flow. Subsequently, the wafer adsorption member 16 is washed with pure water. Note that during cleaning, ultrasonic waves may be used to enhance the cleaning effect.

(3) Drying: After cleaning, the wafer adsorption member 16 is dried using an N2 flow, a desiccator, or the like. Next, the wafer suction member 16 is taken out from the box-shaped member 11 in the reverse procedure of (1) above.

As described above, the tweezers suction jig according to the above embodiment has a Teflon box-like shape with a plurality of square members 12 arranged in a lattice shape on the sides and bottom to facilitate the passage of cleaning liquid and pure water. 1, a guide 13 for wafer positioning consisting of a pair of protrusions 14 and 15 provided on the inner surface of the box-like member 11, and a plate-shaped presser attached to the top of the box-like member 11 that can be opened and closed. member 17 and this pressing member 1
Bocch 20 provided at the bottom of the handle I9 at the top end of 7
The wafer suction member 16 has the advantage that not only organic substances but also inorganic substances can be removed by cleaning with chemicals without directly touching the wafer adsorption member 16.

In the above embodiment, a case has been described in which the side portions and bottom portions of the box-like member are configured in a lattice shape, but the present invention is not limited to this, as long as at least the side portions are configured in a lattice shape.

Further, the box-shaped member may not be composed of a square member as in the above embodiment, but may be a box-shaped member composed of four plate members each having a large number of holes.

In the above embodiment, a case has been described in which the guide is composed of a pair of protrusions, but the guide is not limited to this. For example, a concave portion having a width slightly larger than the thickness of the wafer suction member may be provided in the corner portion +4 constituting the box-like member, and this may be used as a guide.

[Effects of the Invention] As detailed above, according to the present invention, it is possible to provide a cleaning jig for tweezers that can remove not only organic substances but also inorganic substances by cleaning the wafer adsorption member with chemicals without directly touching it.

[Brief explanation of drawings]

1 is a plan view of a tweezers cleaning jig according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line X-X in FIG. 1, and FIG. 3 is a front view of FIG. Figure 4 is the back view of the tweezers.
5 is a front view of FIG. 4, and FIG. 6 is a plan view showing another example of the wafer suction member of the tweezers shown in FIG. 4. 11... Box-shaped member, 12... Horn-shaped member, 13...
Guide, 14, 15...Protrusion, 16...Wafer suction member, 17...Pressure member, 18...Opening, 20...
・Bocce.

Claims (1)

[Claims] A jig for cleaning a flat wafer suction member that is detachably attached to the tip of tweezers for suctioning a semiconductor wafer, the box-like member having a passage for cleaning liquid or pure water at least on the side, and the box-like member. A tweezers cleaning jig comprising: a guide provided on the inner surface of the box-shaped member for positioning the wafer suction member; and a presser member attached to the box-shaped member so as to be openable and closable and press the wafer suction member.