JPH0325403Y2 - - Google Patents
Info
- Publication number
- JPH0325403Y2 JPH0325403Y2 JP3599586U JP3599586U JPH0325403Y2 JP H0325403 Y2 JPH0325403 Y2 JP H0325403Y2 JP 3599586 U JP3599586 U JP 3599586U JP 3599586 U JP3599586 U JP 3599586U JP H0325403 Y2 JPH0325403 Y2 JP H0325403Y2
- Authority
- JP
- Japan
- Prior art keywords
- clamp
- hole
- fixed
- leaf springs
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000694 effects Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
Landscapes
- Die Bonding (AREA)
- Jigs For Machine Tools (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3599586U JPH0325403Y2 (US20080094685A1-20080424-C00004.png) | 1986-03-12 | 1986-03-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3599586U JPH0325403Y2 (US20080094685A1-20080424-C00004.png) | 1986-03-12 | 1986-03-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62147341U JPS62147341U (US20080094685A1-20080424-C00004.png) | 1987-09-17 |
JPH0325403Y2 true JPH0325403Y2 (US20080094685A1-20080424-C00004.png) | 1991-06-03 |
Family
ID=30845994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3599586U Expired JPH0325403Y2 (US20080094685A1-20080424-C00004.png) | 1986-03-12 | 1986-03-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0325403Y2 (US20080094685A1-20080424-C00004.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011054992A (ja) * | 2010-11-12 | 2011-03-17 | Seiko Instruments Inc | ワイヤボンダ装置およびその使用方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5742175U (US20080094685A1-20080424-C00004.png) * | 1980-08-14 | 1982-03-08 |
-
1986
- 1986-03-12 JP JP3599586U patent/JPH0325403Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5742175U (US20080094685A1-20080424-C00004.png) * | 1980-08-14 | 1982-03-08 |
Also Published As
Publication number | Publication date |
---|---|
JPS62147341U (US20080094685A1-20080424-C00004.png) | 1987-09-17 |