JPH0325362Y2 - - Google Patents
Info
- Publication number
- JPH0325362Y2 JPH0325362Y2 JP1984189567U JP18956784U JPH0325362Y2 JP H0325362 Y2 JPH0325362 Y2 JP H0325362Y2 JP 1984189567 U JP1984189567 U JP 1984189567U JP 18956784 U JP18956784 U JP 18956784U JP H0325362 Y2 JPH0325362 Y2 JP H0325362Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- resistor
- printed
- insulating substrate
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、絶縁基板に形成される厚膜抵抗体に
関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a thick film resistor formed on an insulating substrate.
（従来技術）
従来の厚膜抵抗体は第５図及び第６図に示すよ
うに、絶縁基板ａの表面に被着された少くとも一
対の導電体膜b1，b2の一部に一端及び他端をそれ
ぞれ重ねて該導電体膜b1とb2の一部の間に抵抗体
膜ｃを被着して構成するのが一般である。(Prior Art) As shown in FIGS. 5 and 6, a conventional thick film resistor has one end attached to a part of at least a pair of conductor films b 1 and b 2 deposited on the surface of an insulating substrate a. Generally, the conductor films b 1 and b 2 are overlapped with each other, and a resistor film c is deposited between a portion of the conductor films b 1 and b 2 .
この導電体膜b1，b2及び抵抗体膜ｃはそれぞれ
Ag−Pd等から成るペースト及びRuO2等からな
るペーストを絶縁基板ａ上にスクリーン印刷をし
焼成することにより被着された。 The conductor films b 1 and b 2 and the resistor film c are each
A paste made of Ag-Pd or the like and a paste made of RuO 2 or the like were screen printed on the insulating substrate a and baked.
抵抗ペーストは種類が多く、それぞれ容器に公
称シート抵抗値が表示されている3Ω／〓〜
10MΩ／〓まで数多く市販されているから、その
中から取得しようとする抵抗値に応じて抵抗ペー
ストを選定し、抵抗体膜ｃの幅と長さの比を変え
て数種の抵抗値を得ていた。 There are many types of resistance paste, and each container has a nominal sheet resistance value of 3Ω/〓~
There are many resistor pastes on the market up to 10MΩ/〓, so select a resistor paste according to the resistance value you are trying to obtain, and obtain several resistance values by changing the ratio of the width and length of the resistor film c. was.
従来の厚膜抵抗体によれば、スクリーン印刷に
よつて形成される導電体膜b1とb2の間隔は導電体
膜間でシヨートが発生する恐れがあるので0.5mm
より狭くすることができない。例えば公称シート
抵抗値の1/10の抵抗値を最も小さな面積で取得す
るには、２つの導電体膜b1，b2に0.5mmの間隔で
少くとも５mm以上平行な部分を設けて、その間に
長さ0.5mm、幅５mmの抵抗体すなわち2.5mm2の面積
の抵抗体膜ｃを形成しなければならない。 According to conventional thick film resistors, the distance between the conductor films b1 and b2 formed by screen printing is 0.5 mm to avoid the risk of shortening between the conductor films.
It cannot be made narrower. For example, in order to obtain a resistance value that is 1/10 of the nominal sheet resistance value in the smallest area, two conductor films b 1 and b 2 should be provided with parallel parts of at least 5 mm or more with an interval of 0.5 mm. A resistor film c with a length of 0.5 mm and a width of 5 mm, that is, a resistor film c with an area of 2.5 mm 2 must be formed.
かくして、例えば厚膜集積回路において抵抗体
を形成した場合、抵抗体の占める面積が大きく、
厚膜集積回路の小型化の障害となつていた。 Thus, for example, when a resistor is formed in a thick film integrated circuit, the area occupied by the resistor is large;
This has been an obstacle to the miniaturization of thick film integrated circuits.
第３図及び第４図に示すものは、このような不
都合を解消する厚膜抵抗体として提案されたもの
である。 The ones shown in FIGS. 3 and 4 have been proposed as thick film resistors that solve these problems.
同図において、絶縁基板１の表面に被着された
第１の導電体膜２の一端の正方形部分の上に抵抗
体膜５が被着され、更に該抵抗体膜５の上面に正
方形部分の一部が載つて第２の導電体膜６が絶縁
基板１の表面に被着されている。 In the figure, a resistor film 5 is deposited on a square portion at one end of a first conductor film 2 deposited on the surface of an insulating substrate 1, and a square portion is further deposited on the upper surface of the resistor film 5. A second conductor film 6 is deposited on the surface of the insulating substrate 1 with a portion thereof placed thereon.
（考案が解決しようとする課題）
しかしながら、第３図及び第４図に示すもの
は、抵抗体膜５はスクリーン印刷により形成され
るが、その面積にばらつきが生ずるため、常に所
定の抵抗値が得られにくいという課題があつた。(Problem to be solved by the invention) However, in the case of the resistor film 5 shown in FIGS. 3 and 4, which is formed by screen printing, the area of the resistor film 5 varies, so that a predetermined resistance value is always maintained. The problem was that it was difficult to obtain.
本考案は、このような課題を解決することをそ
の目的とするものである。 The purpose of the present invention is to solve such problems.
（課題を解決するための手段）
本考案は、上記の目的を達成するために、絶縁
基板の面上に印刷形成された一方の導電体膜の一
部を覆つて孔が空いた絶縁体膜が印刷形成され、
該孔に抵抗体膜が印刷形成され、該絶縁基板の面
に印刷形成された他方の導電体膜の一部が該抵抗
体膜の上面の全部及び前記絶縁体膜の上面の少な
くとも一部に印刷形成されて成るものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides an insulating film having holes that covers a part of one conductive film printed on the surface of an insulating substrate. is printed and formed,
A resistor film is printed and formed in the hole, and a part of the other conductor film printed on the surface of the insulating substrate covers the entire upper surface of the resistor film and at least a part of the upper surface of the insulator film. It is formed by printing.
（作用）
本考案の上記構成によれば、印刷形成された抵
抗体膜の大きさは絶縁体膜の孔の大きさによつて
規制されるため、厚膜抵抗体としての抵抗値は常
に所定値となる。(Function) According to the above configuration of the present invention, the size of the printed resistor film is regulated by the size of the holes in the insulator film, so the resistance value as a thick film resistor is always kept at a predetermined value. value.
（実施例）
第１図及び第２図は本考案の一実施例を示す。
同図において、１は例えばアルミナ磁器から成る
絶縁基板で、該基板１の表面には、第１の導電体
膜２が１mmの幅で被着され、その一部の表面に
0.4mmφの孔３があいた1.5mm角のガラス膜４が被
着され、その孔３の部分に抵抗体膜５が被着さ
れ、このガラス膜４及び抵抗体５の上面を通つて
幅１mmの第２の導電体膜６が、第１の導電体膜２
と交差して被着されている。(Embodiment) FIGS. 1 and 2 show an embodiment of the present invention.
In the figure, reference numeral 1 denotes an insulating substrate made of, for example, alumina porcelain, and a first conductive film 2 with a width of 1 mm is deposited on the surface of the substrate 1, and a part of the surface is coated with a first conductive film 2 with a width of 1 mm.
A 1.5 mm square glass film 4 with a 0.4 mmφ hole 3 is deposited, a resistor film 5 is deposited on the hole 3, and a 1 mm wide film is passed through the top surface of this glass film 4 and the resistor 5. The second conductor film 6 is the first conductor film 2
It is attached in a manner that intersects with the
これ等の第１及び第２の導電体膜２，６と抵抗
体膜５はそれぞれAg−Pdペーストと10MΩ／〓
のRuO2抵抗ペーストを用い、またガラス膜４は
ガラスペーストを用い、いずれもスクリーン印刷
をし、それぞれ850℃で焼成することによつて作
製された。 These first and second conductor films 2 and 6 and resistor film 5 are each made of Ag-Pd paste and 10MΩ/〓
The glass film 4 was manufactured by using a RuO 2 resistive paste of 100.degree.
抵抗体膜５の抵抗値は23KΩ、抵抗体膜５の占
める面積は0.125mm2で、抵抗体膜５は第１及び第
２導電体膜２，６の幅内に形成された。 The resistance value of the resistor film 5 was 23 KΩ, the area occupied by the resistor film 5 was 0.125 mm 2 , and the resistor film 5 was formed within the width of the first and second conductor films 2 and 6.
この実施例では、第１の導電体膜２に孔３があ
いたガラス膜４を被着し、その孔３の部分に抵抗
体膜５を被着したが、第１の導電体膜２に先ず抵
抗体膜５を被着し、次いで、その回りの第１の導
電体膜４にガラス膜４を被着してもよく、その場
合、抵抗体膜５の周縁に一部重なるようにガラス
膜４を第１の導電体膜２に被着させ、該ガラス膜
４及び抵抗体５に第２の導電体膜６を被着させて
もよい。 In this example, a glass film 4 with holes 3 is attached to the first conductor film 2, and a resistor film 5 is attached to the hole 3. The resistor film 5 may be deposited, and then the glass film 4 may be deposited on the first conductor film 4 around it. 4 may be deposited on the first conductor film 2, and the second conductor film 6 may be deposited on the glass film 4 and the resistor 5.
比較例 １
第３図及び第４図において、絶縁基板１の表面
に被着された第１の導電体膜２の一端の1.5mm角
の正方形部分の上にシート抵抗5Ω／〓のRuO2抵
抗ペーストを２mm角の大きさに印刷し、850℃で
焼成して抵抗体膜５が被着され、更に、該抵抗体
膜５の上面に1.0mm角の正方形部分の一端が載つ
て第２の導電体膜６が絶縁基板１の表面に被着さ
れている。Comparative Example 1 In FIGS. 3 and 4, a RuO 2 resistor with a sheet resistance of 5 Ω/〓 is placed on a 1.5 mm square portion at one end of the first conductive film 2 adhered to the surface of the insulating substrate 1. The paste is printed in a size of 2 mm square and baked at 850°C to adhere the resistor film 5.Furthermore, one end of the 1.0 mm square portion is placed on the upper surface of the resistor film 5, and a second A conductive film 6 is deposited on the surface of the insulating substrate 1.
第１及び第２の導電体膜２，６はいずれも前記
実施例と同様にAg−Pd導電ペーストを用い850
℃で焼成して作製された。 Both the first and second conductor films 2 and 6 are made of Ag-Pd conductive paste with 850
It was produced by firing at ℃.
抵抗体膜５の抵抗値は0.08Ωで、抵抗値を得る
ための面積は1.0mm2であつた。 The resistance value of the resistor film 5 was 0.08Ω, and the area for obtaining the resistance value was 1.0 mm 2 .
比較例 ２
第５図及び第６図において、絶縁体ａの表面に
形成された第１及び第２の導電体膜b1，b2の各一
端に設けられた0.5mmの間隔の平行な直線部分に
この導電体膜b1とb2を橋絡するように幅５mmの抵
抗体膜ｃが形成されている。Comparative Example 2 In FIGS. 5 and 6, parallel straight lines with an interval of 0.5 mm are provided at one end of each of the first and second conductor films b 1 and b 2 formed on the surface of the insulator a. A resistor film c with a width of 5 mm is formed in a portion so as to bridge the conductor films b 1 and b 2 .
この抵抗体膜ｃは、シート抵抗5Ω／〓のRuO2
のペイントを用いて作製され、その抵抗値は
0.5Ωで、抵抗体部分の面積は2.5mm2であつた。 This resistor film c is made of RuO 2 with a sheet resistance of 5Ω/〓
The resistance value is
The resistance was 0.5Ω, and the area of the resistor portion was 2.5mm 2 .
比較例１の厚膜抵抗体の占有面積は比較例２よ
り小さかつた。 The area occupied by the thick film resistor in Comparative Example 1 was smaller than that in Comparative Example 2.
（考案の効果）
本考案によれば、印刷形成された抵抗体膜の大
きさは絶縁体膜の孔の大きさによつて規制される
ため、厚膜抵抗体の抵抗値は常に所定値となると
いう効果を有する。(Effects of the invention) According to the invention, the size of the printed resistor film is regulated by the size of the holes in the insulator film, so the resistance value of the thick film resistor is always at a predetermined value. It has the effect of becoming.
第１図は本考案の一実施例の平面図、第２図は
第１図のＡ−Ａ線截断面図、第３図はさきに提案
された厚膜抵抗体の平面図、第４図は第３図のＢ
−Ｂ線截断面図、第５図は従来の厚膜抵抗体の平
面図、第６図は第５図のＣ−Ｃ線截断面図を示
す。
１……絶縁基板、２……第１の導電体膜、３…
…孔、４……ガラス膜、５……抵抗体膜、６……
第２の導電体膜。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along the line A-A in Fig. 1, Fig. 3 is a plan view of the previously proposed thick film resistor, and Fig. 4 is B in Figure 3.
5 is a plan view of a conventional thick film resistor, and FIG. 6 is a sectional view taken along the line CC in FIG. 5. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... First conductor film, 3...
...hole, 4... glass film, 5... resistor film, 6...
Second conductor film.
Claims (1)
膜の一部を覆つて孔が空いた絶縁体膜が印刷形成
され、該孔に抵抗体膜が印刷形成され、該絶縁基
板の面に印刷形成された他方の導電体膜の一部が
該抵抗体膜の上面の全部及び前記絶縁体膜の上面
の少なくとも一部に印刷形成されて成る厚膜抵抗
体。 An insulating film with holes is printed on the surface of the insulating substrate to cover a part of one of the conductor films printed on the surface of the insulating substrate, a resistor film is printed on the hole, and a resistor film is printed on the surface of the insulating substrate. A thick film resistor in which a part of the other printed conductive film is printed on the entire upper surface of the resistor film and at least a part of the upper surface of the insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984189567U JPH0325362Y2 (en) | 1984-12-15 | 1984-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984189567U JPH0325362Y2 (en) | 1984-12-15 | 1984-12-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61104501U JPS61104501U (en) | 1986-07-03 |
| JPH0325362Y2 true JPH0325362Y2 (en) | 1991-06-03 |
Family
ID=30747015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984189567U Expired JPH0325362Y2 (en) | 1984-12-15 | 1984-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325362Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5987101U (en) * | 1982-12-03 | 1984-06-13 | 株式会社日立製作所 | Low resistance thick film element |
-
1984
- 1984-12-15 JP JP1984189567U patent/JPH0325362Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61104501U (en) | 1986-07-03 |
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