JPH0325234U - - Google Patents
Info
- Publication number
- JPH0325234U JPH0325234U JP8600589U JP8600589U JPH0325234U JP H0325234 U JPH0325234 U JP H0325234U JP 8600589 U JP8600589 U JP 8600589U JP 8600589 U JP8600589 U JP 8600589U JP H0325234 U JPH0325234 U JP H0325234U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- rotating brush
- brush
- retracted position
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005201 scrubbing Methods 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 3
- 239000000428 dust Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cleaning In General (AREA)
- Brushes (AREA)
Description
第1図は本考案にかかる一実施例のブラシスク
ラブ装置の概略斜視図、第2図は同実施例の平面
図、第3図は第2図中のA−A線断面図、第4図
は従来のブラシスクラブ装置の概念図である。
1……ブラシスクラブ装置、2……半導体ウエ
ーハ、3……吸着台、4……回転ブラシ、10…
…超音波洗浄手段。
Fig. 1 is a schematic perspective view of a brush scrubbing device according to an embodiment of the present invention, Fig. 2 is a plan view of the same embodiment, Fig. 3 is a sectional view taken along line A-A in Fig. 2, and Fig. 4 is a conceptual diagram of a conventional brush scrubbing device. DESCRIPTION OF SYMBOLS 1... Brush scrubbing device, 2... Semiconductor wafer, 3... Suction table, 4... Rotating brush, 10...
...Ultrasonic cleaning means.
Claims (1)
台と、上記半導体ウエーハの表面に純水を噴射さ
せるノズルと、上記半導体ウエーハを擦る回転ブ
ラシとを備え、上記回転ブラシを半導体ウエーハ
上の洗浄位置とそれとは離隔した退避位置との間
で移動可能に構成し、上記洗浄位置で上記半導体
ウエーハの表面をブラシスクラブする装置におい
て、 上記回転ブラシの退避位置に、回転ブラシに付
着したゴミを除去する超音波洗浄手段を配設した
ことを特徴とするブラシスクラブ装置。[Claims for Utility Model Registration] A suction table that vacuum suctions and rotates a semiconductor wafer, a nozzle that sprays pure water onto the surface of the semiconductor wafer, and a rotating brush that rubs the semiconductor wafer, the rotating brush comprising: In an apparatus configured to be movable between a cleaning position on a semiconductor wafer and a retracted position separated from the cleaning position, the apparatus scrubs the surface of the semiconductor wafer with a brush at the cleaning position, wherein the rotating brush is placed in the retracted position and the rotating brush is moved to the retracted position. A brush scrubbing device characterized by being equipped with ultrasonic cleaning means for removing attached dust.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8600589U JPH0325234U (en) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8600589U JPH0325234U (en) | 1989-07-21 | 1989-07-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0325234U true JPH0325234U (en) | 1991-03-15 |
Family
ID=31635413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8600589U Pending JPH0325234U (en) | 1989-07-21 | 1989-07-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0325234U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003058955A (en) * | 2001-08-20 | 2003-02-28 | Dainippon Printing Co Ltd | Point service system linked with cash out function |
-
1989
- 1989-07-21 JP JP8600589U patent/JPH0325234U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003058955A (en) * | 2001-08-20 | 2003-02-28 | Dainippon Printing Co Ltd | Point service system linked with cash out function |