JPH0325015B2 - - Google Patents
Info
- Publication number
- JPH0325015B2 JPH0325015B2 JP59207371A JP20737184A JPH0325015B2 JP H0325015 B2 JPH0325015 B2 JP H0325015B2 JP 59207371 A JP59207371 A JP 59207371A JP 20737184 A JP20737184 A JP 20737184A JP H0325015 B2 JPH0325015 B2 JP H0325015B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- molding
- mold
- plate
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W74/01—
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59207371A JPS6184840A (ja) | 1984-10-03 | 1984-10-03 | 電子部品封止成形装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59207371A JPS6184840A (ja) | 1984-10-03 | 1984-10-03 | 電子部品封止成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6184840A JPS6184840A (ja) | 1986-04-30 |
| JPH0325015B2 true JPH0325015B2 (enExample) | 1991-04-04 |
Family
ID=16538614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59207371A Granted JPS6184840A (ja) | 1984-10-03 | 1984-10-03 | 電子部品封止成形装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6184840A (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5440584A (en) * | 1977-09-07 | 1979-03-30 | Hitachi Ltd | Temperature compensator circuit of hall element |
-
1984
- 1984-10-03 JP JP59207371A patent/JPS6184840A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6184840A (ja) | 1986-04-30 |
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