JPH03248550A - Metal plate heat sink - Google Patents
Metal plate heat sinkInfo
- Publication number
- JPH03248550A JPH03248550A JP4798390A JP4798390A JPH03248550A JP H03248550 A JPH03248550 A JP H03248550A JP 4798390 A JP4798390 A JP 4798390A JP 4798390 A JP4798390 A JP 4798390A JP H03248550 A JPH03248550 A JP H03248550A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- metal
- heat sink
- metal foil
- plate heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 65
- 239000011888 foil Substances 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体装置の放熱板に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a heat sink for a semiconductor device.
[従来の技術]
第4図は従来の放熱金属板の正面図、第5図は第4図の
放熱金属板の右側面図である。図中(1)は金寓板、(
2)は金属板(1)の珀側に貼合されたー脂による絶縁
層、(3)は絶縁層(2)上に貼合された金属箔である
。[Prior Art] FIG. 4 is a front view of a conventional heat-radiating metal plate, and FIG. 5 is a right side view of the heat-radiating metal plate of FIG. 4. (1) in the figure is a gold board, (
2) is an insulating layer made of resin pasted on the square side of the metal plate (1), and (3) is a metal foil pasted on the insulating layer (2).
次に動作について説明する。Next, the operation will be explained.
金属板(1)の金属箔(3)の反対側表面には通常放熱
のための、放熱フィンが取りつけられる。金属箔(3)
の中央部には半導体素子が既知の方法で接着される。通
常、金属箔(3)と金属板(1)の間には、実使用時に
電位が発生するため、絶縁層に)が十分な耐電圧を有す
ることが必要である。A radiation fin for heat radiation is usually attached to the surface of the metal plate (1) opposite to the metal foil (3). Metal foil (3)
A semiconductor element is bonded to the central portion of the substrate by a known method. Normally, a potential is generated between the metal foil (3) and the metal plate (1) during actual use, so it is necessary that the insulating layer (2) has a sufficient withstand voltage.
従来の放熱金属板は以上のように構成されているので、
金属板の中央部に、絞り加工によって正方形状のへこみ
を設けであるが、絞り加工の場合、正方形の4fV4の
部分の材料の変形が最も複雑で、変形量も大きい。その
ために絞り加工の過程に於て、金属板と金属層の間には
さまれた樹脂による絶縁層が過大の力及び変形を受け、
破壊される事が有るなどの問題点があった。Since the conventional heat dissipation metal plate is configured as described above,
A square-shaped recess is formed in the center of the metal plate by drawing, but in the case of drawing, the deformation of the material in the square 4fV4 portion is the most complicated and the amount of deformation is large. Therefore, during the drawing process, the resin insulation layer sandwiched between the metal plate and the metal layer is subjected to excessive force and deformation.
There were problems such as the possibility of destruction.
この発明は 上記のような問題点を解消するためKなさ
れたもので、放熱金属板を絞り加工する時K、加工応力
の最も大きくなる部位を改善し。This invention was made to solve the above-mentioned problems, and improves the area where the processing stress is greatest when drawing a heat dissipating metal plate.
信頼性の高い放熱金属板を得ることを目的とするう〔課
題を解決するための手段〕
通常、金属板を矩形あるいは正方形状に絞り加工する場
合矩形あるいは正方形の4隅の部分の変形が複雑で、応
力も大きい。したがって、金属板と金属箔を複数枚絶縁
層を介して貼り合せた積層板を同様に絞り加工する場合
、4隅に於て、金属板と金属箔の絶縁が破壊される。こ
の発明に係る放熱金属板は、上記の絶縁破壊を防ぐため
、変形応力の大きい部位の金属箔を除去するものである
。The purpose is to obtain a highly reliable heat dissipation metal plate. [Means for solving the problem] Normally, when drawing a metal plate into a rectangular or square shape, the deformation of the four corners of the rectangle or square is complicated. And the stress is also great. Therefore, when drawing a laminate made of a plurality of metal plates and metal foils bonded together via insulating layers, the insulation between the metal plates and the metal foils is broken at the four corners. In the heat dissipation metal plate according to the present invention, in order to prevent the above dielectric breakdown, the metal foil is removed from areas where deformation stress is large.
この発明における放熱金属板は加工時の変形、応力の大
きい部位での、金属板と金属箔の積層を避けることによ
り、絶縁の信頼度の高い放熱金属板を得られる。In the heat dissipating metal plate of the present invention, by avoiding deformation during processing and lamination of the metal plate and metal foil in areas where stress is large, a heat dissipating metal plate with high insulation reliability can be obtained.
〔実施例〕
以下、この発明の一実施例を図によって説明する。第1
図は放熱金属板の正面図、第2図は第1図の放熱金属板
の右側面図、第3図は第1図に示すA−Aにおける断面
図である。図において(1)〜(3)は第4図及び第5
図の従来例に示したものと同等であるので説明を省略す
る。(4)は金属箔(3)に設けた金属箔の穴である。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
2 is a right side view of the heat radiating metal plate of FIG. 1, and FIG. 3 is a sectional view taken along line A-A shown in FIG. 1. In the figure, (1) to (3) are shown in Figures 4 and 5.
Since this is the same as that shown in the conventional example in the figure, the explanation will be omitted. (4) is a metal foil hole provided in metal foil (3).
放熱金属板の中央部分に施される絞り加工により、正方
形状のへこみが設けられており、正方形状のへこみの4
隅の部分には、金属箔の穴(4)が設けられている。す
なわち、上記絞り加工部に金属N(3)が、干渉しない
よう、金属箔(3)を除去しである。Square-shaped depressions are created by drawing in the center of the heat-dissipating metal plate, and four of the square-shaped depressions
Metal foil holes (4) are provided in the corners. That is, the metal foil (3) is removed so that the metal N (3) does not interfere with the drawn portion.
次に動作について説明する。金属板(1)、絶縁層(2
)、金属箔(3)の貼合せた放熱金属板を絞り加工する
場合、最も力を受け、しかも変影響の大きい。Next, the operation will be explained. Metal plate (1), insulating layer (2
), when drawing the heat dissipating metal plate laminated with the metal foil (3), it receives the most force and has a large changing effect.
部位で、金属箔(3)が存在しないため、仮りに、樹脂
による絶縁層C)がその箇所で破壊されたとしても、放
熱金属板の機能を損うことはない。Since the metal foil (3) is not present at that location, even if the resin insulating layer C) is destroyed at that location, the function of the heat dissipation metal plate will not be impaired.
なお、上記実施例では金属箔の穴(4)を絞り加工前に
設けた場合について説明したが、金属箔の穴(4)は絞
り加工後、化学的な手段で設けてもよい。In addition, in the above embodiment, a case has been described in which the holes (4) in the metal foil are provided before the drawing process, but the holes (4) in the metal foil may be provided by chemical means after the drawing process.
以上のようにこの発明によれば、信頼性の高い放熱金属
板が得られる。As described above, according to the present invention, a highly reliable heat dissipating metal plate can be obtained.
第1図はこの発明の一実施例による放熱金属板の正面図
、第2図は第1図の放熱金属板の右側面図、第3図は第
1図に示すA−Aにおける断面図、第4図は従来の放熱
金属板を示す正面図、第5図は第4図の放熱金属板の右
側面図である。
図において、(1)は金属板、(2)は絶縁層、(3)
は金属箔、(4)は金属箔の穴である。
なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a front view of a heat dissipation metal plate according to an embodiment of the present invention, FIG. 2 is a right side view of the heat dissipation metal plate of FIG. 1, and FIG. 3 is a cross-sectional view taken along line A-A shown in FIG. FIG. 4 is a front view of a conventional heat dissipating metal plate, and FIG. 5 is a right side view of the heat dissipating metal plate of FIG. In the figure, (1) is a metal plate, (2) is an insulating layer, and (3)
is a metal foil, and (4) is a hole in the metal foil. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
絶縁層と金属箔を交互に貼り合せた層を少なくとも1つ
貼り合せた放熱の金属板の中央部付近を、矩形状又は正
方形状に絞り加工を施し、へこみを設けた放熱金属板に
おいて、上 記絞り加工を施す部分の矩形又は正方形の4隅の部分の
金属箔を除去した事を特徴とする放熱金属板。[Claims] A metal plate with good thermal conductivity and at least one layer of an insulating layer made of resin and a metal foil laminated alternately on one side of the metal plate for heat dissipation. , a heat dissipating metal plate that has been drawn into a rectangular or square shape and provided with a recess, characterized in that the metal foil at the four corners of the rectangle or square where the drawing process is applied has been removed. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4798390A JP2697229B2 (en) | 1990-02-27 | 1990-02-27 | Heat dissipation metal plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4798390A JP2697229B2 (en) | 1990-02-27 | 1990-02-27 | Heat dissipation metal plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03248550A true JPH03248550A (en) | 1991-11-06 |
JP2697229B2 JP2697229B2 (en) | 1998-01-14 |
Family
ID=12790551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4798390A Expired - Fee Related JP2697229B2 (en) | 1990-02-27 | 1990-02-27 | Heat dissipation metal plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2697229B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8446727B2 (en) | 2008-05-08 | 2013-05-21 | Toyota Jidosha Kabushiki Kaisha | Electronic component |
-
1990
- 1990-02-27 JP JP4798390A patent/JP2697229B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8446727B2 (en) | 2008-05-08 | 2013-05-21 | Toyota Jidosha Kabushiki Kaisha | Electronic component |
Also Published As
Publication number | Publication date |
---|---|
JP2697229B2 (en) | 1998-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
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LAPS | Cancellation because of no payment of annual fees |