JPH03248446A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable removal of a foreign material in a package and to prevent troubles such as short-circuiting by exposing an adhesive side of a material having an adhesive surface and by providing it to a cavity side of a cap of the package. CONSTITUTION:A package is DIP type and a cavity side of a cap 5 is provided with an adhesive double-coated film 8 which is provided with an adhesive layer is provided closely on both sides of a film base material as an adhesive member. The adhesive double-coated film 8 faces a cavity space and its surface is adhesive; therefore, if the package is made upside down after sealed, a foreign material entered inside the package drops on the adhesive double-coated film 8 and fixed. After the treatment, the foreign material 7 never come into contact with a bonding wire 4, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a semiconductor device, and particularly to a semiconductor device having a hermetically sealed type package.

[Prior Art 1] In a conventional hermetically sealed package semiconductor device, as shown in the cross-sectional view of FIG. 2, the cap 5 has a raised peripheral edge and a recessed central portion, which serves as a cavity surface. After welding the semiconductor chip 3 to the base 2 of the package, lead connections are made with bonding wires 4, and then the cap 5 is
Sealing is achieved by soldering the base 2 to the sealing glass 6.

[Problems to be Solved by the Invention] In this type of semiconductor device, conductive foreign matter such as silicon debris from the chip or the mounting material layer often gets mixed in during the sealing process. These foreign objects, shown as conductive foreign objects 7 in FIG. 2, move within the cavity of the package when the semiconductor device is subjected to vibrations and shocks during the manufacturing process, including various tests, and move between the bonding wires.・When electricity is applied between stitches, problems such as electrical shorts may occur.

An object of the present invention is to provide a semiconductor device that can remove conductive foreign matter even if it is contained in a hermetically sealed package as described above.

[Means for Solving the Problems] In the semiconductor device of the present invention, a member having an adhesive surface is provided on the cavity surface of the cap of the package with the adhesive surface exposed.

C Effect J A member with an adhesive surface fixes a conductive foreign object in the package (hereinafter simply referred to as foreign object) when it comes into contact with the adhesive surface. Therefore, for example, if the package is turned over so that the cap is on the lower side after sealing, foreign objects come into contact with the adhesive member and are fixed.

[Embodiment j Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of the embodiment, showing the package in an overturned state. The package is of the DIP type, and the cavity surface of the cap 5 is coated with a double-sided adhesive film 8, which is an adhesive layer provided on both sides of a film base material.
are placed in close contact with each other. Since the double-sided adhesive film 8 has a sticky surface facing the cavity space, when the package is turned over after sealing, all foreign matter 7 that has entered the package will fall onto the double-sided adhesive film 8 and be fixed. be done. After this treatment, the foreign matter 7 does not come into contact with the bonding wire 4 or the like at all. Furthermore, instead of inverting the package after sealing, the sealing process may be performed in the vertical relationship shown in FIG.

[Advantageous Effects of the Invention 1] As explained above, the present invention is manufactured by providing an adhesive member on the cavity surface of a package cap and allowing foreign matter to adhere to the adhesive surface during or after sealing,
If necessary, by applying special vibrations and shocks,
This makes it possible to fix foreign objects to the adhesive surface.

Thereby, it is possible to obtain a semiconductor device that is free from failures such as short circuits due to foreign matter in the package.

[Brief explanation of drawings]

FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 2...Base, 3...Semiconductor chip, 4
...Bonding wire, 5...-Cap, 7-...(Conductive) foreign matter,
8...-Double-sided adhesive film.

Claims (1)

[Claims] 1. A semiconductor device having a hermetically sealed package, characterized in that a member having an adhesive surface is provided on a cavity surface of a cap of the package with the adhesive surface exposed.