JPH0324794A - Mounting of electronic component and apparatus therefor - Google Patents

Abstract

PURPOSE:To simplify the structure of an apparatus and to shorten a mounting tact (processing cycle) time by mounting a chip component at a position directly removed from a tape on a printed board as it is. CONSTITUTION:A cover tape 9 and a bottom tape 10 adhered to a carrier tape 8 are simultaneously peeled, and a suction nozzle 60 is moved down to a position directly above the tape 8 through a hole 80 of an upper guide for guiding the tape 8 to a position where the tape 8 is fed at one pitch. According ly, a chip component in the component hole of the tape 8 can be immediately sucked. Then, the component can be moved down while it remains sucked to the nozzle 60 through the hole 81 of a lower guide for guiding the tape 8, thereby specifying the position of the chip to the nozzle 60. Further, the nozzle 60 protrudes downward to mount the component at a predetermined position on a lower printed board 300. Thus, since a chip component supply unit is not moved, the structure of a facility can be simplified, and a mounting tact time can be largely shortened.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electronic component mounting method and device for mounting electronic components (chip components) on a printed circuit board, and in particular, the present invention relates to an electronic component mounting method and device for mounting electronic components (chip components) on a printed circuit board, and in particular, enables flexible use of the device and speeds up mounting. This paper relates to a method and device for mounting electronic components suitable for significantly improving performance. [Prior art] A conventional electronic component mounting device is disclosed in, for example, Japanese Patent Application Laid-open No. 55-11.
The one described in Publication No. 8698 has been proposed. 11th
The figure is an external view illustrating this conventional electronic component mounting device.
Figure 12 is an external view of the chip component supply section in Figure 11. This device is as shown in FIG.
A linear cantering table 3 for selectively moving a plurality of chip component supply sections l that supply taped chip components 5 from a and lb to a position corresponding to the chip component mounting section 2 is installed horizontally. In this method, the component mounting section 2 attaches the chip component on the tape, moves it above the printed circuit board 4, and places the chip component at a position on the printed circuit board 4 predefined by NG. As shown in FIG. 12, the chip component supply section 1 used in this device peels off only the cover tape 6 affixed to the carrier tape, winds it onto a reel 7, and stores the tape in the recess of the carrier tape from above. This is a method to extract the chip parts that are removed. [Problem to be solved by the invention] In the above-mentioned prior art, the chip component supply section is arranged on a linear table, so in order to move any chip component supply section to the position of the chip component mounting section, it is necessary to move the table. Since the distance is approximately twice the length of the table, increasing the number of chip component supply sections inevitably increases the table length and requires a larger installation area compared to the width of the device body. Furthermore, if the next chip component supply section to be selected is located far away from the chip component supply section installed on the rightmost side, the amount of movement of the table will be large and the time required for movement will increase, reducing takt time. There was a problem of losing. In addition, a means for mounting the chip component and moving it above the printed circuit board on which the chip component is to be mounted is required, and in addition to this means, the chip component is moved to a predetermined position of the circuit printed on the printed circuit board. In order to mount a printed circuit board, an XY table is required to place the printed circuit board and determine the XYPL mark using NC. This requires a mechanism to share the operations, which complicates the configuration of the device.In addition, since multiple operations are combined to complete the installation of a single chip component, the takt time inevitably increases, resulting in a time-consuming process. There was a problem that an efficient device could not be realized.

An object of the present invention is to solve the above-mentioned problems of the prior art and provide an extremely simple and highly flexible electronic component mounting method and device for mounting chip components on a printed circuit board while being directly attached from a tape. be.

[Means to solve the problem]

In order to achieve the above object, the electronic component mounting method and device according to the present invention simultaneously peels off the cover tape and bottom tape of the tape for supplying chip components, and removes the component from the carrier tape at a position where the carrier tape is fed one pitch. A suction nozzle is placed directly above the chip component exposed in the hole to immediately suck the chip component, and then the chip is passed through a hole approximately the size of the chip component provided in the lower guide of the guide that guides the tape from above and below. Adjust the position of the component relative to the nozzle, then rotate the nozzle by a desired angle to determine the posture of the chip component to be mounted on the printed circuit board, and determine the lateral direction (X coordinate) position of the printed circuit board using an X table using NG. Furthermore, the vertical (Y JE 41) position is determined by the mounting position of the device on the printed circuit board. [Operation] The electronic component mounting method and device described above simultaneously peel off the cover tape and bottom tape affixed to the carrier tape of the tape for supplying chip components, and then remove the carrier tape at a position where the carrier tape has been fed by l bit. Since the suction nozzle is lowered through the hole in the upper guide that guides the tape to just above the carrier tape, it is possible to immediately suction the chip components in the component holes of the carrier tape, and then remove the carrier tape. The position of the chip relative to the nozzle is regulated by lowering the chip component while it is adsorbed to the nozzle through the hole in the lower guide, and by further protruding the nozzle downward, the printed circuit board placed on the lower X table is fixed in place. The chip component can be placed in the desired position, and if necessary, the nozzle can be rotated by a motor at the desired angle while the chip component attracted to the nozzle passes through the hole in the lower guide and reaches the top surface of the printed circuit board. However, the chip component can be adjusted to a predetermined posture and mounted on the printed circuit board. Also, the electronic component mounting device described above is mounted on a printed circuit board on which a plurality of different chip components are mounted on the Y/'I!
Arrange only multiple items corresponding to the target, and successively reject the X table.
It is also possible to mount the chip components onto the printed circuit board in a short takt time by sequentially mounting predetermined chip components from the corresponding electronic component mounting device while indexing the electronic component mounting device.

〔Example〕

An embodiment of the present invention will be explained below with reference to FIGS. 1 to 10. The first drawing is a front view of an apparatus showing an embodiment of the electronic component mounting method and apparatus according to the present invention. Figure 2 is a back view of Figure 1. FIG. 3 is a side view of FIG. 1. FIG. 4 is a detailed view of the ratchet feed mechanism of FIG. 2. Figure 1O is a configuration diagram of the parts supply tape shown in Figure 1. In the electronic component mounting apparatus 100 according to the present invention shown in FIG. 1, a guide plate 13 fixed on a stand 12 fixed to a base 1l is slidable in the left-right direction in FIG. 1 by a dovetail l4 as shown in FIG. It can be fixed. There is a stand 15 above the dovetail l4, and a tape reel 16 is rotatably attached to one end of the stand l5. From the tape reel 16, as shown in FIG. 10, the chip component 200 (FIG. 5) is stored in the component 68a of the carrier tape 8, and the carrier tape 8, cover tape 9, and bottom tape 10 are welded together. The supply tape 17 is connected to the upper rear guide l8
and is guided by the lower rear guide 19 to the left of the electronic component mounting apparatus 100 in FIG. The tape 17 has sprocket holes 8b drilled at equal intervals with high accuracy as shown in FIG. A sprocket hole 8b of the tape 17 is engaged with a sprocket wheel 22 fixed to the end of a shaft 21 rotatably supported by a bearing 20.

In addition, the tape 17 is guided by the upper front guide 23 and lower front guide 24 before and after the sprocket wheel 22, and when the sprocket wheel 22 has been wrapped approximately 1/2 way, the tape 17 is attached to the tape force vine unit 25 that is fixed to the stand 15. enter. On the other hand, the ends of the upper rear guide l8 and lower rear guide 19 and the ends of the upper front guide 23 and lower front guide 24 are fixed to the stand 15 at approximately the same point with a gap of approximately 1++a. ．． At the end of this upper rear guide 18, the cover tape 9 of the component supply tape 17 shown in FIG.
It is rotatably supported by the roller 26 and wound around the roller 26. On the opposite side (back side) of the shaft 27 that supports the reel 26 with respect to the stand 15, pulleys 2g and 29 shown in FIG. 2 are fixed. A belt 30 is hung on this pulley 28, and the pulley 28. On the same side as 29, a pulley 31 on which a belt 30 is hung is fixed together with a ratchet wheel 32 shown in FIG. This ratchet wheel 32 has a feed pawl 33.
The torsion spring 3 is attached to the feed lever 34 which is rotatably supported on the stand l5 by a shaft 37 and a torsion spring 38.
5, the ratchet wheel 32 is supported by a shaft 36 so as to be biased toward the pawl. The shaft 4 is attached to the other end of the feed lever 34.
Rod 43 of air cylinder 42 with 0 and joint 4l
is attached, and the other end of this air cylinder 42 is connected to a shaft 43.
It is rotatably supported by a bracket 44 protruding from the stand 15. Therefore, when the air cylinder 42 operates, the feed lever 34 rotates by overcoming the force of the torsion spring 38, and the feed pawl 33 advances the ratchet wheel 32 by one pitch. At the other blade portion of one ratchet wheel 32, a fixed pawl 45 is biased by a torsion spring 46 and rotatably supported by a stand 15 by a shaft 47. On the other hand, the bottom tape 10 of the component supply table 17 is peeled off from the carrier tape 8 from the end of the lower rear guide 19 and pulled out to the rear, and the reel 5 is fixed to a shaft 50 rotatably provided on a stand 15.
It is designed to be wound up in 1. A pulley 52 shown in FIG. 2 is fixed to the opposite side (back side) of this shaft 50 via the stand l5, and a belt 53 is engaged with this pulley 52 between it and the above-mentioned pulley 29. There is. Therefore, when the air cylinder 42 is operated, the ratchet wheel 32 is rotated by one pitch by the feed pawl 33, and at the same time, the pulley 28 is rotated by the pulley 3l and the belt 30, and the reel coaxially with this pulley 28 is rotated by the pulley 3l and the belt 30. The above-mentioned cover tape 9 is wound onto the reel 26 by the rotation of 26. In the same way, the pulley 52 is rotated by the pulley 29 and the belt 53, and the bottom tape 10 of the parts supply tape 17 is wound onto the reel 50 by the rotation of the reel 50 coaxial with the pulley 52. ing. On one of the upper front guides 23, a carrier tape 8 containing a chip component 200 (FIG. 5) is fed by the sprocket wheel 22 by one pitch by the ratchet wheel 32 in FIG. There is a hole 80 drilled slightly larger than the chip component 200 at the position of the component 68a of the carrier tape 8, and directly above the hole 80, the nozzle 6o is mounted on a slide bearing 61 so that it can slide vertically and freely rotate. Approved at Block 62. The nozzle 60 has a hole drilled all the way to the top, and a pipe 63 connected to a vacuum pump (not shown) is attached to the top of the nozzle 60. Further, a shaft 66 of a motor 65 is connected to the top of the nozzle 60 via a coupling 64, and this motor 65 is connected to a control device (
(not shown) to rotate the nozzle 60 in the θ direction. This motor 65 is fixed on a slide base 67, and this slide base 67 is guided by guides 68a and 68b, and further engages with a rod 71 of a cylinder 70 via a joint par 69 fixed to the slide base 67. do.

Further, the cylinder 70 engages with a rod 74 of a cylinder 73 having a longer stroke than the cylinder 70 via a joint 72. As a result, when only the cylinder 70 moves forward, the nozzle 60 descends within the upper front guide 23 to the upper surface of the carrier tape 8, and when the cylinder 73 further descends, the nozzle 60 is attached to the X table 83 on the base II. It descends to near the top surface of the printed circuit board 300. Here, at the position of the lower front guide 24 corresponding to the hole 680 drilled in the upper front guide 23, there is a hole 8l whose upper part has a tapered shape and whose lower part is about 0.05 + m larger than the outer diameter of the chip component 200. It is drilled. 5 to 8 are explanatory diagrams of the operation of the apparatus shown in FIG. 1. A method of mounting the chip components shown in FIGS. 1 to 4 will be explained with reference to FIGS. 5 to 8. First, FIG. 5 shows a state in which no driving force is applied to the ratchet wheel 32 yet.

Next, the cylinder 70 is actuated to lower the nozzle 60 to the upper surface of the carrier tape 8. At this time, the nozzle 60 is connected to a vacuum pump, and the nozzle 60 is connected to the chip component 2.
If it is 00, it is in a state where it can be attracted to the tip of the nozzle 60. Then the cylinder 42 operates and the ratchet wheel 3
2 rotates by 1 pitch, and thereby the sprocket wheel 22 also rotates by 1 pitch. As a result, as shown in FIG. 6, the component supply tape 17 is fed by the epitome, and the cover tape 9 is peeled off at the tip of the upper rear guide l8 and reeled to the reel 26.
Similarly, the lower rear guide 19
The bottom tape 10 is peeled off at the tip and wound onto the reel 51. As a result, the chip component 200 in the component 68a of the carrier tape 8 is no longer supported by the upper and lower tapes, but the carrier tape 8 is supported by the upper and lower front guides 23. 2
4, the chip component 200 moves in the upper and lower front guides 23.4. 24 to prevent it from falling.
When the feeding of the tape l7 is completed in this way, the upper and lower front guides 23. 24 holes 80. The chip component 200 at position 81 is immediately attracted and held by the nozzle 60. Then the cylinder 73 operates and the nozzle 60
is further lowered as shown in FIG. 7, and the position of the chip component 200 is adjusted symmetrically to the center of the nozzle 60 through the hole 81 in the lower front part 24. If it is necessary to change the mounting posture of the chip component 200 in the θ direction several times in this state, the motor 6
Since the attitude of the chip component 200 was changed by rotating the nozzle 60 by rotating the cylinder 73
The chip component 200 is mounted at a predetermined position on the printed circuit board 300 as shown in FIG. In the above embodiment, the cover tape 9 and the bottom tape 1 made of resin material of the tape l7 for supplying chip components shown in FIG.
0 to the upper and lower guides 18 that guide the tape l7 in FIG.
It is also possible to construct a structure in which a portion such as 19 is heated to shrink and peel off.

It is also possible to construct the cover tape 9 and bottom tape 10 of the tape 17 for supplying chip components shown in FIG. 10 from a resin that shrinks and further sublimates when heated.

Furthermore, the thicknesses of the cover tape 9 and bottom tape 10 of the tape 17 for supplying chip components shown in FIG. 10 are partially reduced to match the contour of the component 68a that accommodates the chip component 200 of the carrier tape 8, so that they can be easily removed. Then, the cover tape 9 is first suctioned and torn off in the middle of the upper and lower guides 18, 19 that guide the tape 17 shown in FIG. 60, and then feed it to the hole 8 of the lower guide 24.
1 and another nozzle to remove the bottom tape 10 by suction and breaking it, the chip component 200 can be placed in a predetermined position on the printed circuit board 300 by passing through 681 of the lower guide 24. It is also possible to configure the X table 83 that supports the printed circuit board 300 on which the chip component 200 shown in FIG. 1 is to be mounted to have an xO function.

FIG. 9 is an external view showing an embodiment of the mounting system of the electronic component mounting apparatus 100 shown in FIG. In the electronic component mounting system shown in FIG. 9, the nozzles of the electronic component device 100 shown in FIG. The electronic component mounting devices ii 100 are arranged with 60 positions coincident with each other, and the chip components 100 can be sequentially mounted onto the printed circuit board 300 from the corresponding electronic component mounting device lOO while sequentially indexing the X table 83 by NG. can.

〔Effect of the invention〕

According to the present invention, since the chip component supply section does not move,
The configuration of the equipment can be greatly simplified, such as eliminating the need for a moving table, and the size of the equipment can be minimized. Furthermore, since the chip components can be mounted directly from the chip component supply section onto the printed circuit board below, the mounting takt time can be significantly shortened. Furthermore, since the chip component supply section is arranged in advance in accordance with the Y coordinate of a predetermined position on the printed circuit board to be mounted, an XY table for moving the printed circuit board is not necessary, and only the X table is required. Furthermore, since the number of movements of each part until the chip components are mounted on the printed circuit board is greatly reduced, the takt time is minimized and the most efficient production is possible.

[Brief explanation of drawings]

FIG. 1 is a front view of the device showing an embodiment of the electronic component mounting method and device according to the present invention, FIG. 2 is a back view of FIG. 1, FIG. 3 is a side view of FIG. 1, and FIG. Figure 2 is a detailed view of the ratchet feeding mechanism, Figures 5 to 8 are explanatory diagrams of the operation of the device in Figure 1, Figure 9 is an external view showing an embodiment of the mounting system in Figure 1, and Figure 10. 1 is a configuration diagram of the component supply tape shown in FIG. 1, FIG. 11 is an external view illustrating a conventional electronic component mounting apparatus, and FIG. 12 is an external view of the chip component supply section shown in FIG. 11. 8...Carrier tape, 8a...Parts hole, 9...
Cover tape, 10... Bottom tape, 16... Tape reel, l7... Tape, l8... Upper rear guide, 19... Lower rear guide, 22... Sprocket wheel, 23... Upper front guide, 24... Lower front guide, 25... Tape force vine unit, 26...
Reel, 32... Ratchet wheel, 5l... Reel, 60... Nozzle. 80. 81...hole, 8
3...X table, 100...electronic component mounting device,
200...Chip parts, 300...Printed circuit board.

Claims (8)

[Claims] 1. Peel off the cover tape and bottom tape of the tape supplying the chip components from the carrier tape having holes for storing the chip components simultaneously or sequentially from the cover tape to the bottom tape, and then peel off the top and bottom tapes from the carrier tape that guides the carrier tape up and down. A nozzle for sucking chip components is lowered from the hole in the upper guide directly above the carrier tape through the hole through which the chip component passes through the guide. The chip component is sent directly below the nozzle to be attracted to the nozzle, and then in the process of protruding the nozzle from the hole in the lower guide, the position of the chip component relative to the nozzle is adjusted by the periphery of the hole in the lower guide, and then the nozzle is lowered. An electronic component mounting method in which chip components are placed in a predetermined position on a printed circuit board directly below. 2. Peel off the cover tape and bottom tape of the tape supplying the chip components from the carrier tape having holes for storing the chip components simultaneously or sequentially from the cover tape to the bottom tape, and then peel off the top and bottom tapes from the carrier tape that guides the carrier tape up and down. A nozzle for sucking chip components is lowered from the hole in the upper guide directly above the carrier tape through the hole through which the chip component passes through the guide. The chip component is sent directly below the nozzle to be attracted to the nozzle, and then, in the process of protruding the nozzle from the hole in the lower guide, the position of the chip component relative to the nozzle is regulated by the periphery of the hole in the lower guide, and then the nozzle is An electronic component mounting device configured to lower the chip component and place the chip component at a predetermined position on the printed circuit board directly below. 3. Claim 2: The cover tape and the bottom tape made of a resin material are heated by a part of a guide that guides the tapes upward and downward, thereby shrinking and peeling them from the carrier tape.
The electronic component mounting device described. 4. 4. The electronic component mounting apparatus according to claim 2, wherein the cover tape and bottom tape of the tape for supplying chip components are made of a resin that shrinks and further sublimates when heated. 5. The thickness of the cover tape and the bottom tape of the tape for supplying the chip components is partially reduced to match the contour of the hole in the carrier tape for storing the chip components, so that they can be easily removed.
The cover tape is first broken and removed by suction in the middle of the guide that guides the tape up and down, then the part of the carrier tape that accommodates the chip components is sent to the bottom of the nozzle, and then it is passed through the hole in the lower guide with another nozzle. 3. The electronic component mounting apparatus according to claim 2, wherein after the bottom tape is torn and removed by suction, the chip component is passed through a hole in the lower guide and placed at a predetermined position on the printed circuit board. 6. The electronic component according to claim 2, wherein the nozzle for sucking the chip component is configured to take a desired rotational position according to a command so that the chip component can be mounted at a desired angle within a plane on the printed circuit board. Mounting device. 7. 6. The electronic component mounting apparatus according to claim 2, wherein the table supporting the printed circuit board on which the chip component is placed has an Xθ function. 8. 1 at the Y coordinate position of the position where each chip component is to be mounted on the top of the X table on which the printed circuit board is placed.
An electronic component mounting device comprising at least one electronic component mounting device according to claim 2, claim 3, or claim 5, wherein the nozzle positions of the electronic component mounting device are aligned.