JPH0324768B2 - - Google Patents
Info
- Publication number
- JPH0324768B2 JPH0324768B2 JP15095383A JP15095383A JPH0324768B2 JP H0324768 B2 JPH0324768 B2 JP H0324768B2 JP 15095383 A JP15095383 A JP 15095383A JP 15095383 A JP15095383 A JP 15095383A JP H0324768 B2 JPH0324768 B2 JP H0324768B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- coating layer
- clean
- film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 47
- 239000011247 coating layer Substances 0.000 claims description 38
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 14
- 238000011109 contamination Methods 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 10
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- 230000002265 prevention Effects 0.000 claims description 7
- 239000001569 carbon dioxide Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000000859 sublimation Methods 0.000 claims description 3
- 230000008022 sublimation Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 239000000356 contaminant Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15095383A JPS6043833A (ja) | 1983-08-20 | 1983-08-20 | 表面汚染防止法並にその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15095383A JPS6043833A (ja) | 1983-08-20 | 1983-08-20 | 表面汚染防止法並にその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6043833A JPS6043833A (ja) | 1985-03-08 |
| JPH0324768B2 true JPH0324768B2 (fr) | 1991-04-04 |
Family
ID=15508032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15095383A Granted JPS6043833A (ja) | 1983-08-20 | 1983-08-20 | 表面汚染防止法並にその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6043833A (fr) |
-
1983
- 1983-08-20 JP JP15095383A patent/JPS6043833A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6043833A (ja) | 1985-03-08 |
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