JPH03244180A - Metallic base laminate - Google Patents
Metallic base laminateInfo
- Publication number
- JPH03244180A JPH03244180A JP4169990A JP4169990A JPH03244180A JP H03244180 A JPH03244180 A JP H03244180A JP 4169990 A JP4169990 A JP 4169990A JP 4169990 A JP4169990 A JP 4169990A JP H03244180 A JPH03244180 A JP H03244180A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal
- filler
- foil
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 150000004703 alkoxides Chemical class 0.000 claims abstract description 11
- 239000011888 foil Substances 0.000 claims abstract description 11
- 239000010953 base metal Substances 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims description 13
- 230000006866 deterioration Effects 0.000 abstract description 2
- 229910052809 inorganic oxide Inorganic materials 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000004191 hydrophobic interaction chromatography Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- -1 Silicon alkoxide Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、金属ベース積層板に関するものである。さ
らに詳しくは、この発明は、ＨＩＣ用基板として有用な
、耐電圧性能が良好で、しかも放熱性に優れた金属ベー
ス積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to metal-based laminates. More specifically, the present invention relates to a metal-based laminate useful as a substrate for HIC, which has good withstand voltage performance and excellent heat dissipation.
（従来の技術）
従来より、交流耐電圧性を有するＨＩＣ用の金属ベース
積層基板の検討が進められてきており、すでにこれまで
にも、たとえば、フィラー含有樹脂による被覆基板やア
ルマイト皮膜等を形成させた絶縁板を用いた基板、ある
いは、セラミック板と金属板とを接着させた基板１、溶
射等によって絶縁体を金属板上に形成した基板などが提
案されてきている。(Prior art) Studies have been progressing on metal-based laminated substrates for HICs that have AC withstand voltage properties, and have already been developed, for example, by forming coated substrates with filler-containing resins, alumite films, etc. Substrates using an insulating plate, a substrate 1 in which a ceramic plate and a metal plate are bonded together, and a substrate in which an insulator is formed on a metal plate by thermal spraying or the like have been proposed.
（発明か解決しようとする課題）
しかしながら、これらの提案に見ることのできる工夫や
改善にもかかわらず、いずれの場合にも、耐交流電圧−
性能を維持したままで、同時に充分な熱放散性を有する
基板は実現されてきていない。(Problem to be solved by the invention) However, despite the devices and improvements that can be seen in these proposals, in any case, the withstand AC voltage -
A substrate that maintains performance and at the same time has sufficient heat dissipation properties has not been realized.
また、アルマルト皮膜形成の絶縁板を使用する基板、セ
ラミック板と金属板との接着基板、そして溶射絶縁層を
形成した基板については、製造コストが大きなものとな
って実用的なものではない。Further, substrates using an insulating plate formed with an alumalte film, a bonded substrate of a ceramic plate and a metal plate, and a substrate formed with a thermally sprayed insulating layer have high manufacturing costs and are not practical.
さらに、従来のいずれの基板でも、銀箔を使用しないと
大電流用途には用いることができないという欠点があっ
た。Furthermore, any of the conventional substrates has the disadvantage that they cannot be used for large current applications unless silver foil is used.
この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来のＨＩ Ｃ用金属基板の欠点を解消し、耐電
圧性能を維持しつつ、しかも良好な熱放散性をも有する
、新しいＨＩＣ用金属ベース積層板を提供することを目
的としている。This invention was made in view of the above-mentioned circumstances, and provides a new material that eliminates the drawbacks of conventional metal substrates for HIC, maintains voltage resistance performance, and also has good heat dissipation properties. The object is to provide a metal-based laminate for HIC.
（課題を解決するための手段）
この発明は、上記の課題を解決するものとして、ベース
金属に、金属アルコキシドの硬化物層とフィラー含有樹
脂層とからなる複層絶縁層を介して金属箔を配設−水化
してなることを特徴とする金属ベース積層板を提供する
。(Means for Solving the Problems) The present invention solves the above problems by applying metal foil to a base metal via a multilayer insulating layer consisting of a cured layer of metal alkoxide and a filler-containing resin layer. Disposition - Provides a metal-based laminate characterized in that it is hydrated.
この発明の金属ベース積層板においては、上記の金属ア
ルコキシドの硬化物層とフィラー含有樹脂層との各々１
以上の層の組合せからなる複層構造を有することを特徴
としており、その構造として、たとえば、第１図および
第２図に示したものを例示することができる。In the metal-based laminate of the present invention, each of the above-mentioned cured metal alkoxide layer and filler-containing resin layer is
It is characterized by having a multilayer structure consisting of a combination of the above layers, and examples of the structure include those shown in FIGS. 1 and 2.
いずれの場合もベース金属（１）の上には、金属アルコ
キシドの硬化物層としての無機質層（２）を形成し、次
いで、フィラー含有樹脂層（３）を配設している。また
、第１図の例のように、このフィラー含有樹脂層（３）
の上に金属箔を直接配設してもよいし、あるいは第２図
に示した例のように、さらに無機質層（２）を積層した
後に金属箔（４）を配設するようにしてもよい。もちろ
ん、さらにこの無機質層（２）とフィラー含有樹脂層（
３）とを多層としてもよい。In either case, an inorganic layer (2) as a cured layer of metal alkoxide is formed on the base metal (1), and then a filler-containing resin layer (3) is provided. Moreover, as in the example of FIG. 1, this filler-containing resin layer (3)
The metal foil may be placed directly on top, or the metal foil (4) may be placed after further laminating the inorganic layer (2) as in the example shown in Figure 2. good. Of course, this inorganic layer (2) and filler-containing resin layer (
3) may be multilayered.
ベース金属（１）としては、これまでに使用されてきて
いるアルミニウム、銅、鉄、ステンレス、電磁鋼板等の
適宜なものを使用することができる。As the base metal (1), suitable metals such as aluminum, copper, iron, stainless steel, electromagnetic steel sheets, etc. that have been used up to now can be used.
また、金属アルコキシドの硬化物層からなる無機質層（
２）の形成には、主成分としてアルミナアルコキシド、
シリコンアルコキシド等を使用することができ、また、
そのｆ也の無機アルコキシドを用いることもできる。こ
の無機質層く２）の厚みは、一般的には１０〜１００μ
ｍ程度とするのが好ましい。In addition, an inorganic layer consisting of a cured layer of metal alkoxide (
In the formation of 2), the main components are alumina alkoxide,
Silicon alkoxide etc. can be used, and
Inorganic alkoxides thereof can also be used. The thickness of this inorganic layer 2) is generally 10 to 100 μm.
It is preferable to set it to about m.
フィラー含有樹脂層（３）には、Ａｊ２０！、５ｉ０２
、ＭｇＯ，ＢＮ等の無機質フィラーを２０〜５０重量
％程度含有させた耐熱性樹脂、たとえはエポキシ樹脂、
ポリイミド樹脂、フェノール樹脂などを使用することが
でき、その厚みは、一般的には、２０〜１００μｍとす
るのか好ましい。The filler-containing resin layer (3) contains Aj20! ,5i02
, a heat-resistant resin containing about 20 to 50% by weight of an inorganic filler such as MgO, BN, etc., such as an epoxy resin,
Polyimide resin, phenol resin, etc. can be used, and the thickness thereof is generally preferably 20 to 100 μm.
このフィラー含有樹脂層（３）は、Ｂステージ化して、
金属箔（４）と一体成形することかできる。This filler-containing resin layer (3) is B-staged,
It can be integrally molded with the metal foil (4).
最外層に配置する金属油（４）については、電流値に合
わせて最適厚みで使用することができ、たとえば、銅箔
を２５０μｍ程度の厚膜とすることによって、シリコン
チップ−次ヒートシンクの替りとすることもできる。The metal oil (4) placed on the outermost layer can be used at the optimum thickness depending on the current value. For example, by making the copper foil a thick film of about 250 μm, it can be used as a substitute for a silicon chip heat sink. You can also.
ベース金属（１）、無機質層（２）、フィラー含有樹脂
層（３）および金属箔（４）とからなるこの発明の積層
板は、これまでに知られている加熱加圧圧締による成形
法によって一体化することができる。たとえば圧力２０
〜８０ｋｇ／己、温度１２０〜１７０℃程度の条件が採
用される。The laminate of the present invention, which consists of a base metal (1), an inorganic layer (2), a filler-containing resin layer (3), and a metal foil (4), is produced by a conventionally known molding method by heating and pressing. Can be integrated. For example, pressure 20
Conditions of ~80 kg/self and a temperature of about 120 to 170°C are adopted.
ベース金属（１）の片面、または両面に積層成形するこ
とかできる。It can be laminated onto one or both sides of the base metal (1).
（作 用）
この発明においては、絶縁層として、金属アルコキシド
の硬化物層からなる無機質層とフィラー含有樹脂層との
複層構造を採用することにより、特に、無機酸化物層が
存在することにより、熱放散性か極めて良好となり、ま
た、この酸化物硬化物層は緻密で耐電圧特性に優れ、熱
による劣化が抑制されるため、長期的信頼性を高めるこ
とができる。(Function) In this invention, by adopting a multilayer structure of an inorganic layer consisting of a hardened metal alkoxide layer and a filler-containing resin layer as the insulating layer, in particular, the presence of the inorganic oxide layer The heat dissipation properties are extremely good, and the cured oxide layer is dense and has excellent withstand voltage characteristics, and deterioration due to heat is suppressed, so long-term reliability can be improved.
（実施例）
ベース金属としてアルミニウムを使用し、このアルミニ
ウム板の上に、アルミナアルコキシドおよびシリコンア
ルコキシドによる硬化物層を厚み４０μｍで配設した。(Example) Aluminum was used as the base metal, and a cured material layer of alumina alkoxide and silicon alkoxide was provided on the aluminum plate to a thickness of 40 μm.
また、Ａｊ２０ｘをフィラーとして４０重量％含有する
エポキシ樹脂層を厚み４０μｍとなるように配設し、最
外層に、第１図と同様にして金属箔の銅箔を厚み１００
μｍとして配設した。In addition, an epoxy resin layer containing 40% by weight of Aj20x as a filler was disposed to a thickness of 40 μm, and a copper foil of metal foil was placed as the outermost layer to a thickness of 100 μm in the same manner as in FIG.
It was arranged as μm.
得られた金属ベース積層板について、現行品と比較しつ
つ、放熱性および交流耐電圧特性を評価した。その結果
を示したものが次の表１である。The resulting metal base laminate was evaluated for heat dissipation and AC withstand voltage characteristics while comparing with current products. The results are shown in Table 1 below.
この表１からも明らかなように、この発明の積層板の場
合には、放熱性、交流耐電圧特性に優れていることがわ
かる。As is clear from Table 1, it can be seen that the laminate of the present invention has excellent heat dissipation properties and AC withstand voltage characteristics.
なお、この積層板は、絶縁層を完全硬化させた後に、ア
ディティブで銅回路形成することができる。Note that in this laminate, a copper circuit can be formed additively after the insulating layer is completely cured.
（発明の効果）
この発明により、以上詳しく説明した通り、耐電圧性能
を維持しつつ、放熱性を高めたＨＩＣ用金属基板が実現
される。(Effects of the Invention) As described in detail above, the present invention provides a metal substrate for HIC that maintains voltage resistance performance and improves heat dissipation.
第１図および第２図は、この発明の構成例を示した断面
図である。
■・・・ベ − ス 金 属
２・・・無 機 質 層
３・・・フィラー含有樹脂層
４・・・金 属 箔FIG. 1 and FIG. 2 are cross-sectional views showing a configuration example of the present invention. ■...Base metal 2...Inorganic layer 3...Filler-containing resin layer 4...Metal foil
Claims (1)
ィラー含有樹脂層とからなる複層絶縁層を介して金属箔
を配設一体化してなることを特徴とする金属ベース積層
板。(1) A metal base laminate comprising a base metal and a metal foil integrated therein via a multilayer insulating layer consisting of a cured metal alkoxide layer and a filler-containing resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4169990A JPH03244180A (en) | 1990-02-22 | 1990-02-22 | Metallic base laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4169990A JPH03244180A (en) | 1990-02-22 | 1990-02-22 | Metallic base laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03244180A true JPH03244180A (en) | 1991-10-30 |
Family
ID=12615667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4169990A Pending JPH03244180A (en) | 1990-02-22 | 1990-02-22 | Metallic base laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03244180A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5527604A (en) * | 1993-08-06 | 1996-06-18 | Mitsubishi Denki Kabushiki Kaisha | Metal base board and electronic equipment using the same |
-
1990
- 1990-02-22 JP JP4169990A patent/JPH03244180A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5527604A (en) * | 1993-08-06 | 1996-06-18 | Mitsubishi Denki Kabushiki Kaisha | Metal base board and electronic equipment using the same |
| US5578367A (en) * | 1993-08-06 | 1996-11-26 | Mitsubishi Denki Kabushiki Kaisha | Metal base board and electronic equipment using the same |
| US5670241A (en) * | 1993-08-06 | 1997-09-23 | Mitsubishi Denki Kabushiki Kaisha | Metal base board and electronic equipment using the same |
| US5820972A (en) * | 1993-08-06 | 1998-10-13 | Mitsubishi Denki Kabushiki Kaisha | Metal base board and electronic equipment using the same |
| US5834101A (en) * | 1993-08-06 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Metal base board and electronic equipment using the same |
| DE4427994C2 (en) * | 1993-08-06 | 2000-10-26 | Mitsubishi Electric Corp | Metal core substrate, especially for use in electronic circuits |
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