JPH03243795A - Production of silicon steel sheet having fine appearance of coating film - Google Patents
Production of silicon steel sheet having fine appearance of coating filmInfo
- Publication number
- JPH03243795A JPH03243795A JP3740090A JP3740090A JPH03243795A JP H03243795 A JPH03243795 A JP H03243795A JP 3740090 A JP3740090 A JP 3740090A JP 3740090 A JP3740090 A JP 3740090A JP H03243795 A JPH03243795 A JP H03243795A
- Authority
- JP
- Japan
- Prior art keywords
- silicon steel
- steel sheet
- sio2
- coating film
- grain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000976 Electrical steel Inorganic materials 0.000 title claims abstract description 19
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 238000000576 coating method Methods 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000137 annealing Methods 0.000 claims abstract description 20
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 229910052742 iron Inorganic materials 0.000 claims abstract description 3
- 229910052718 tin Inorganic materials 0.000 claims abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 59
- 229910052681 coesite Inorganic materials 0.000 abstract description 31
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 31
- 229910052682 stishovite Inorganic materials 0.000 abstract description 31
- 229910052905 tridymite Inorganic materials 0.000 abstract description 31
- 239000000377 silicon dioxide Substances 0.000 abstract description 28
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 28
- 229910021645 metal ion Inorganic materials 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 11
- 239000004115 Sodium Silicate Substances 0.000 abstract description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052911 sodium silicate Inorganic materials 0.000 abstract description 6
- 238000004070 electrodeposition Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 description 2
- 101100342332 Mus musculus Klf16 gene Proteins 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Manufacturing Of Steel Electrode Plates (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
C産業上の利用分野j
本発明は被膜外観にすぐれた珪素鋼板の製造方法に関し
、さらに詳しくは方向性珪素鋼板の製造工程中の中間焼
鈍前の圧延板に微量のSiO2を付着させることにより
、中間焼鈍において形成させるM g 2 S i 0
4を強化する方法に係り、特にSiO2の電着方法にお
いて好適な濃度及び溶液中に含まれるべきイオンに関す
るものである。[Detailed Description of the Invention] C. Industrial Field of Application j The present invention relates to a method for manufacturing a silicon steel sheet with an excellent coating appearance, and more specifically, it relates to a method for manufacturing a silicon steel sheet with an excellent coating appearance, and more specifically, it relates to a process for manufacturing a grain-oriented silicon steel sheet in which a trace amount of M g 2 Si 0 formed in intermediate annealing by depositing SiO2
The present invention relates to a method for reinforcing SiO2, and in particular to a suitable concentration and ions to be included in a solution in a SiO2 electrodeposition method.
〔従来の技術]
方向性珪素鋼板の製造工程中の中間焼鈍前の圧延板に微
量のSiO2を電着させることにより、中間焼鈍におい
て形成させるMg2SiO4を強化する方法が知られて
おり、中間焼鈍前に珪酸ソーダ中でクリーニング処理を
することが知られている。[Prior Art] A method is known in which the Mg2SiO4 formed in the intermediate annealing is strengthened by electrodepositing a small amount of SiO2 on the rolled sheet before the intermediate annealing during the manufacturing process of grain-oriented silicon steel sheets. It is known to carry out cleaning treatment in sodium silicate.
〔発明が解決しようとする課題J
この珪酸ソーダ中でクリーニング処理をする場合には、
液中に金属イオンが含まれないためS i 02は電着
しない欠点がある。また、SiO2の電着量は電流密度
よりむしろSiO2濃度からの寄与lis大きいため、
溶液の濃度制御を行わなければSiO2電着量制御をす
ることができない。[Problem to be solved by the invention J When performing cleaning treatment in this sodium silicate,
Since the liquid does not contain metal ions, S i 02 has the disadvantage of not being electrodeposited. In addition, since the amount of SiO2 electrodeposited has a larger contribution from the SiO2 concentration than the current density,
The amount of SiO2 electrodeposited cannot be controlled unless the concentration of the solution is controlled.
本発明は珪酸ソーダ液中に金属イオンを投入し、かつ珪
酸ソーダ濃度を適切な値に保持することにより珪素鋼板
にSiO2の適切な膜厚を電看させる方法を提供するこ
とを目的とする。An object of the present invention is to provide a method for forming an appropriate film thickness of SiO2 on a silicon steel plate by introducing metal ions into a sodium silicate solution and maintaining the sodium silicate concentration at an appropriate value.
〔課題を解決するための手段]
本発明は、上記課題を達成するため次の技術手段を講じ
たものである。すなわち、方向性珪素鋼の製造工程中の
中間焼鈍前に、圧延板にSiO2を電着させるに当り、
適切なS i 02a度を有するS i02供給#溶液
中に、Fe、Cu、Aff、Sn、Se、Ni、Cr、
Mn、Tiから選はれた少なくとも一種以上の金属イオ
ンを投入して0.1−10g/ffのイオンをSiO2
供給f!A溶浦中に含有させ、この溶液中にて0.01
〜2g/rn’のSiO2を圧延板に電着させることを
特徴とする。このような技術手段により金属イオンが圧
延板に密着する時SiO2をそれらのイオンの中に埋め
込ませて電着するので中間焼鈍工程において強固なM
g 2 S i O4を形成し、被膜外観に優れた珪素
鋼板を製造することができる。[Means for Solving the Problems] The present invention takes the following technical means to achieve the above problems. That is, when electrodepositing SiO2 on a rolled plate before intermediate annealing during the manufacturing process of grain-oriented silicon steel,
Fe, Cu, Aff, Sn, Se, Ni, Cr,
At least one kind of metal ion selected from Mn and Ti is added to SiO2 at a rate of 0.1-10g/ff.
Supply f! 0.01 in this solution.
It is characterized in that ~2 g/rn' of SiO2 is electrodeposited on the rolled plate. By such technical means, when the metal ions are brought into close contact with the rolled plate, SiO2 is embedded in those ions and electrodeposited, resulting in a strong M during the intermediate annealing process.
g 2 Si O4 can be formed, and a silicon steel plate with excellent coating appearance can be manufactured.
C作用]
SiO2そのものは電荷をもっていないため、電解槽中
で電解処理しても電着反応は起こらなぃ。しかし、Si
O2は電解槽中にて静電的引力によって電気泳動によっ
て付着する。この吸着力は非常に弱いため、このままで
あれば容易に剥離してしまう。そこで、電解槽中に金属
イオンを投入しておけばその金属イオンが吸着SiO2
の上に電析するためSiO2は珪素鋼板表面にしっかり
と電着される。C action] Since SiO2 itself has no electric charge, no electrodeposition reaction occurs even if it is electrolytically treated in an electrolytic bath. However, Si
O2 is deposited electrophoretically in the electrolytic cell due to electrostatic attraction. This adsorption force is very weak, so if left as it is, it will easily peel off. Therefore, if metal ions are introduced into the electrolytic tank, the metal ions will be absorbed into the SiO2
SiO2 is deposited firmly on the surface of the silicon steel sheet.
5iO2fi度は、2〜lO%が好ましく、高い方が電
着効率がよいが10%を越えると飽和する。The degree of 5iO2fi is preferably 2 to 10%, and the higher the degree, the better the electrodeposition efficiency, but it becomes saturated when it exceeds 10%.
金属イオンの含有量は、O,1g/I2未満では金属イ
オン投入効果が不十分であり、10g/βを越えて含有
させても効果が飽和してしまうので、0、1 g/ff
−10g/βとした。If the metal ion content is less than 1 g/I2, the metal ion injection effect will be insufficient, and if it is contained in more than 10 g/β, the effect will be saturated, so 0.1 g/ff
−10 g/β.
圧延板に対するSiO2の電着量は0.01g/d未満
では中間焼鈍、仕上焼鈍後の被覆の形成が困難で欠落が
認められ、2g/dを越えると点状の皮膜欠陥か発生す
る。0.01〜2 g/rn”では欠陥のない外観の優
れたSiO2鋼板を得ることができる。If the amount of SiO2 electrodeposited on the rolled sheet is less than 0.01 g/d, it will be difficult to form a coating after intermediate annealing and final annealing, and defects will be observed, and if it exceeds 2 g/d, point-like coating defects will occur. At 0.01 to 2 g/rn'', a defect-free SiO2 steel plate with excellent appearance can be obtained.
【実施例]
3%Si鋼をCu’十を添加したオルト珪酸ソーダ中に
て電解処理した後、中間焼鈍、仕上焼鈍、平坦化焼鈍を
行った。[Example] After electrolytically treating 3% Si steel in sodium orthosilicate to which Cu'0 was added, intermediate annealing, final annealing, and flattening annealing were performed.
電解処理条件は次の通りである。The electrolytic treatment conditions are as follows.
オルト珪酸ソーダの濃度=2%、4%、6%、8%、1
0%の5水準。Concentration of sodium orthosilicate = 2%, 4%, 6%, 8%, 1
5 levels of 0%.
Cu’+の濃度、投入なし、0.1g/ff、5g/β
、log/β、12g/βの5水準。Concentration of Cu'+, no input, 0.1g/ff, 5g/β
, log/β, and 12g/β.
電流密度・2A/d耐、5A/drrf’、IOA/d
rrl’の3水準
これらの各条件で行った電解処理圧延板について、Si
O2の付着量を蛍光x1j!にて測定した。Current density/2A/d resistance, 5A/drrf', IOA/d
Three levels of rrl' Regarding the electrolytically treated rolled sheet under each of these conditions, Si
The amount of O2 attached is fluorescent x1j! Measured at
実験結果を第1図〜第5図に示す。The experimental results are shown in FIGS. 1 to 5.
第1図はCu2+を5 g712投入した場合のS i
02の濃度と電流密度と、S i 02付着量の関係
を示す、第1図より、S i 02の付着量は電流密度
の増加と共に増加するがそれよりもSiO2i1度によ
る影響の方が大きいことがわかる。Figure 1 shows Si when 5 g712 of Cu2+ is added.
From Figure 1, which shows the relationship between the concentration of Si02, current density, and amount of Si02 deposited, the amount of Si02 deposited increases as the current density increases, but the influence of SiO2i1 degree is greater than that. I understand.
第2図はCu’+の投入なしの場合を示すもので、すべ
てSiO2の電着は認められなかった。FIG. 2 shows the case where Cu'+ was not added, and no electrodeposition of SiO2 was observed in all cases.
第3図はCu2+を濃度10g/β投入した場合を示す
もので、第1図と同様な傾向を示している。FIG. 3 shows the case where Cu2+ was added at a concentration of 10 g/β, and shows the same tendency as FIG. 1.
第4図はCu2+を濃度0.1g/ffとなるように投
入したもので第1図と同様の傾向を示している。FIG. 4 shows the same tendency as FIG. 1 when Cu2+ was added at a concentration of 0.1 g/ff.
第5図はCu’十を12g/βとなるように投入した場
合を示し、第3図とほぼ同じ成績を示し、SiO2の電
着量はCu2+の濃度をlog/尼より増加しても効果
か向上しない。Figure 5 shows the case where Cu'+ was added at 12 g/β, and the results are almost the same as in Figure 3, and the amount of electrodeposition of SiO2 is effective even if the concentration of Cu2+ is increased by more than log/N. Or it doesn't improve.
また、Cu’十をFe、AI2.Sn、Se。In addition, Cu'10 is Fe, AI2. Sn, Se.
Ni、Cr、Mn、Tiのイオンと代替した場合ら同様
の結果を示した。Similar results were obtained when Ni, Cr, Mn, and Ti ions were substituted.
次に、以上の電着処理した圧延板のS i 02付着量
がOg/ば、0.005g/n1”、O,O1g/rn
”、 0.05 g/rri”、O,1g/rfl”、
0.5 g / rn”、2 g/m’、 5 g/r
r?、 10 g/m”のものを、それぞれ中間焼鈍
、仕上げ焼鈍を行い、その被膜外観を検査した。Next, the S i 02 adhesion amount of the rolled plate subjected to the above electrodeposition treatment is Og/ba, 0.005g/n1", O, O1g/rn
", 0.05 g/rri", O, 1 g/rfl",
0.5 g/rn", 2 g/m', 5 g/r
r? , 10 g/m'' were subjected to intermediate annealing and final annealing, respectively, and the appearance of the coating was inspected.
SiO2付着量がOg/m″、0.005 g/m”の
ものははげており被膜が形成されにくくなっており、S
iO2付着量が5g/rn″以上の6のは被膜は形成さ
れていたが点状被膜欠陥が発生していた。また0、01
g/rn″〜2g/rr1″の間の6のは欠陥のない被
膜となっていた。Those with a SiO2 adhesion amount of Og/m'' and 0.005 g/m'' are peeled off, making it difficult to form a film, and S
For samples 6 with an iO2 adhesion amount of 5 g/rn'' or more, a film was formed, but point-like film defects occurred.Also, 0, 01
6 between g/rn'' and 2 g/rr1'' resulted in a coating without defects.
〔発明の効果1
本発明によれば、方向性珪素鋼板の製造工程中の中間焼
鈍前に、SiO2供給源溶液中に金属イオンを投入する
ことによりSiO2の電着が可能となり、このSiO2
の付着量を制御することにより、中間焼鈍、仕上焼鈍後
の珪素鋼板の良好な被膜を得ることができる。[Effect of the invention 1 According to the present invention, electrodeposition of SiO2 is made possible by introducing metal ions into the SiO2 source solution before intermediate annealing during the manufacturing process of grain-oriented silicon steel sheets, and this SiO2
By controlling the adhesion amount, it is possible to obtain a good coating on the silicon steel plate after intermediate annealing and final annealing.
第1図〜第5図は、金属イオンCu’十を投入量が異な
る場合におけるSiO2の濃度と電流密度とSiO2の
付着量の関係を示すグラフである。FIGS. 1 to 5 are graphs showing the relationship between the concentration of SiO2, the current density, and the amount of deposited SiO2 when the amounts of metal ions Cu'10 are different.
Claims (1)
板にSiO_2を電着させるに当り、SiO_2供給源
溶液中にFe、Cu、Al、Sn、Se、Ni、Cr、
Mn、Tiから選ばれた少なくとも一種以上のイオンを
0.1〜10g/l含有させ、該溶液中にて0.01〜
2g/m^2のSiO_2を圧延板に電着させることを
特徴とする被膜外観に優れた珪素鋼板の製造方法。1 In electrodepositing SiO_2 on the rolled plate before intermediate annealing during the manufacturing process of grain-oriented silicon steel sheet, Fe, Cu, Al, Sn, Se, Ni, Cr,
0.1 to 10 g/l of at least one ion selected from Mn and Ti is contained in the solution.
A method for producing a silicon steel sheet with an excellent coating appearance, characterized by electrodepositing 2 g/m^2 of SiO_2 on a rolled sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2037400A JP2709172B2 (en) | 1990-02-20 | 1990-02-20 | Manufacturing method of silicon steel sheet with excellent coating appearance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2037400A JP2709172B2 (en) | 1990-02-20 | 1990-02-20 | Manufacturing method of silicon steel sheet with excellent coating appearance |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03243795A true JPH03243795A (en) | 1991-10-30 |
JP2709172B2 JP2709172B2 (en) | 1998-02-04 |
Family
ID=12496480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2037400A Expired - Fee Related JP2709172B2 (en) | 1990-02-20 | 1990-02-20 | Manufacturing method of silicon steel sheet with excellent coating appearance |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2709172B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999019538A1 (en) * | 1997-10-14 | 1999-04-22 | Nippon Steel Corporation | Method of forming an insulating film on a magnetic steel sheet |
JP2016216779A (en) * | 2015-05-20 | 2016-12-22 | Jfeスチール株式会社 | Grain oriented magnetic steel sheet and production method therefor |
WO2021261515A1 (en) * | 2020-06-24 | 2021-12-30 | 日本製鉄株式会社 | Method for producing electromagnetic steel sheet |
KR20230107900A (en) * | 2021-03-31 | 2023-07-18 | 닛폰세이테츠 가부시키가이샤 | Non-oriented electrical steel sheet and manufacturing method of non-oriented electrical steel sheet |
EP4174192A4 (en) * | 2020-06-24 | 2024-07-03 | Nippon Steel Corp | Production method for grain-oriented electrical steel sheet |
EP4174194A4 (en) * | 2020-06-24 | 2024-07-03 | Nippon Steel Corp | Production method for grain-oriented electrical steel sheet |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5846547A (en) * | 1981-09-11 | 1983-03-18 | Matsushita Electronics Corp | Manufacture of internal magnetic shield for color picture tube |
JPH01209133A (en) * | 1988-02-18 | 1989-08-22 | Nippon Steel Corp | Highly corrosion-resistant double-layer composite plated steel pate |
JPH01246398A (en) * | 1988-03-28 | 1989-10-02 | Sumitomo Metal Ind Ltd | Production of composite dispersive particles and composite plating method |
-
1990
- 1990-02-20 JP JP2037400A patent/JP2709172B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5846547A (en) * | 1981-09-11 | 1983-03-18 | Matsushita Electronics Corp | Manufacture of internal magnetic shield for color picture tube |
JPH01209133A (en) * | 1988-02-18 | 1989-08-22 | Nippon Steel Corp | Highly corrosion-resistant double-layer composite plated steel pate |
JPH01246398A (en) * | 1988-03-28 | 1989-10-02 | Sumitomo Metal Ind Ltd | Production of composite dispersive particles and composite plating method |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999019538A1 (en) * | 1997-10-14 | 1999-04-22 | Nippon Steel Corporation | Method of forming an insulating film on a magnetic steel sheet |
US6322688B1 (en) | 1997-10-14 | 2001-11-27 | Nippon Steel Corporation | Method of forming an insulating film on a magnetic steel sheet |
JP2016216779A (en) * | 2015-05-20 | 2016-12-22 | Jfeスチール株式会社 | Grain oriented magnetic steel sheet and production method therefor |
WO2021261515A1 (en) * | 2020-06-24 | 2021-12-30 | 日本製鉄株式会社 | Method for producing electromagnetic steel sheet |
EP4174192A4 (en) * | 2020-06-24 | 2024-07-03 | Nippon Steel Corp | Production method for grain-oriented electrical steel sheet |
EP4174193A4 (en) * | 2020-06-24 | 2024-07-03 | Nippon Steel Corp | Method for producing electromagnetic steel sheet |
EP4174194A4 (en) * | 2020-06-24 | 2024-07-03 | Nippon Steel Corp | Production method for grain-oriented electrical steel sheet |
KR20230107900A (en) * | 2021-03-31 | 2023-07-18 | 닛폰세이테츠 가부시키가이샤 | Non-oriented electrical steel sheet and manufacturing method of non-oriented electrical steel sheet |
Also Published As
Publication number | Publication date |
---|---|
JP2709172B2 (en) | 1998-02-04 |
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