JPH0324264A - Sputtering device - Google Patents

Abstract

PURPOSE:To allow the monitoring of the state of a target in a main reaction chamber of the load lock system sputtering device by providing a camera for monitoring on a pallet to M sent from a load lock chamber to the main reaction chamber. CONSTITUTION:The load lock chamber 2 is provided before the main reaction chamber 1 to execute a sputtering treatment and the pallet 3 for mounting samples is set in the load lock chamber 2. The inside of the load lock chamber is then roughly evacuated to a low vacuum state and the sputtering is executed by transferring the pallet 3 into the main reaction chamber 1. The camera 5 for monitoring which has the same size and same shape as the size and shape of the sample and can be remotely operated is mounted to one of the samples mounting parts 4 of the pallet 3 at this time. The degree of consumption and crack of the target are monitored without releasing the super-vacuum state in the main reaction chamber 1 in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a sputtering apparatus, and particularly to a sputtering apparatus using a load lock method.

[Prior Art] Conventionally, as shown in FIG. 3, a load-lock type sputtering apparatus includes a main reaction chamber 1 for performing sputtering processing, and a load-lock chamber 2 provided upstream of the main reaction chamber 1. After setting the pallet containing the sample in the load lock chamber 2, the load lock chamber 2 is evacuated to a low vacuum state using the mechanical pump 8, and the pallet is sent into the main reaction chamber l. The structure allows sputtering to be performed cleanly and in a short time without breaking the ultra-high vacuum state.

[Problems to be Solved by the Invention] In the conventional load-lock type sputtering apparatus described above, the main reaction chamber must always be maintained in an ultra-high vacuum state, making it impossible for operators to visually observe the inside of the main reaction chamber. However, it is not possible to monitor the condition of the target in the main reaction chamber, making it difficult to discover the degree of wear and tear on the target, resulting in damage to the equipment and contamination of the sputtered film. There is a drawback.

An object of the present invention is to provide a sputtering apparatus that solves the above problems.

[Difference 1 between the invention and the prior art The present invention differs from the above-described conventional sputtering apparatus in that the interior of the main reaction chamber is monitored using a monitor camera.

[Means for Solving the Problems] In order to achieve the above object, a sputtering apparatus according to the present invention includes a load lock chamber equipped with a main reaction chamber in which sputtering is performed and a load lock chamber provided upstream of the main reaction chamber. In a lock-type sputtering apparatus, a pallet that is fed into the main reaction chamber through a load lock chamber is equipped with a monitor camera to monitor the inside of the main reaction chamber.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

(Example 1) FIG. 1(a) is a drawing showing a pallet according to Example I of the present invention, and FIG. 2 is an external view showing a load-lock type sputtering apparatus.

As shown in Fig. 2, the load-lock type sputtering apparatus has two main reaction chambers 1 and 1, in which sputtering is performed.
A pallet is set in the load-lock chamber 2, and the load-lock chamber 2 is roughly drawn to a low vacuum state, and then the pallet is placed in an ultra-high vacuum in the main reaction chamber 1. It has a structure in which it is transferred into the main reaction chamber 1 and processed without releasing the vacuum state.

In FIG. 1(a), the present invention utilizes a sample mounting pallet 3 sent into the main reaction chamber l, and attaches it to one of the sample mounting parts 4 of the sample mounting pallet 3 with the same size and size as the sample. It is equipped with a remotely controllable monitoring camera 5 having the same shape.

When monitoring the condition of the target in the main reaction chamber 1 in the sputtering device, the sample mounting pallet 3
A monitor camera 5 having the same shape and dimensions as the sample is attached to the sample attachment part 4 of the
After roughing the load lock chamber 2 to create a low vacuum state, the pallet 3 is transferred to the main reaction chamber 1, and the condition of the target in the main reaction chamber 1 is remotely controlled using the monitoring camera 5. Take a photo. Thereby, the state of the target in the main reaction chamber 1 can be monitored without breaking the ultra-high vacuum state.

(Embodiment 2) FIG. 1(b) is a structural diagram showing a monitor pallet according to Embodiment 2 of the present invention.

In the previous embodiment, the camera 5 was mounted using a sample mounting pallet, but this embodiment is equipped with a dedicated monitor pallet 7 for mounting the camera, and a monitor camera movement guide crossed on the pallet 7. 6 is attached, and the monitor camera 5 is moved along the guide 6.

When monitoring the condition of the target in the sputtering equipment, set the monitor pallet 7 in the load lock chamber 2, perform rough evacuation to create a low vacuum state, then move the monitor pallet 7 to the main reaction chamber l, and use the remote control to A monitor camera 5 is moved along a monitor camera movement guide 6 to photograph the state of the target inside the main reaction chamber 1.

According to this embodiment, since the monitoring camera 5 moves on the pallet 7, there is an advantage that the target state can be monitored more accurately.

〔Effect of the invention〕

As explained above, the present invention has the effect that by attaching a camera that monitors the inside of the main reaction chamber to the pallet, it is possible to check the condition of the target without breaking the ultra-high vacuum state inside the main reaction chamber. As a result, the degree of wear and tear of the target can be monitored and the target can be used efficiently.

[Brief explanation of the drawing]

FIG. 1(a) is a structural diagram showing a sample mounting pallet used in Example 1 of the present invention, FIG. 1(b) is a structural diagram showing a monitor pallet used in Example 2 of the present invention, and FIG. FIG. 2 is an external view showing a load-lock type sputtering apparatus of the present invention, and FIG. 3 is a block diagram showing a conventional load-lock type sputtering apparatus. l...Main reaction chamber 2...Load lock chamber 3
...Sample mounting pallet 4...Sample mounting part 5...Monitor camera 6...Monitor camera moving guide 7...Monitor pallet

Claims (1)

[Claims] (1) In a load-lock sputtering device equipped with a main reaction chamber for sputtering and a load-lock chamber provided upstream of the main reaction chamber, the main reaction A sputtering device characterized by being equipped with a monitor camera to monitor the room.