JPH0324243A - Copper alloy for led lead frame - Google Patents
Copper alloy for led lead frameInfo
- Publication number
- JPH0324243A JPH0324243A JP1158892A JP15889289A JPH0324243A JP H0324243 A JPH0324243 A JP H0324243A JP 1158892 A JP1158892 A JP 1158892A JP 15889289 A JP15889289 A JP 15889289A JP H0324243 A JPH0324243 A JP H0324243A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- led
- led lead
- copper alloy
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 12
- 229910052718 tin Inorganic materials 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract 3
- 239000010949 copper Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 13
- 239000000956 alloy Substances 0.000 abstract description 13
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005464 sample preparation method Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はＬＥＤ （発光ダーオード）リードフレーム用
銅合金に関する．
〔従来の技術］
ＬＥＤは、例えば、第１図に示すように、リードフレー
ム１のステム２ａに、半導体チップ３をダイボンディン
グし、次いで、ワイヤ４によりワイヤボンディングした
後、樹脂５により樹脂モールドディングして作成される
．
ところで、従来、ＬＥＤリードフレーム用材料には、主
として純鉄（ｓｐｃｃ）が使用されている．これは、安
価であることおよび強度、伸び特性のバランスが良いこ
と等によるものである．しかし、ｓｐｃｃでは、直接は
んだ付けすることは困難であるため、前処理（Ｃｕ，Ｎ
ｉ等の下地めっき処理）が必要となり、その結果コスト
アップにつながっている。しかも、ｓｐｃｃは、熱伝導
率が６． １ ２ｃａｌ／（ｃｍ−ｓｅｃ−’ｅ）
（導電率＝１７％ＩＡＣＳ）と高いため、ＬＥＤ組立
て工程時ないし使用時のはんだ付け作業中に熱影響を受
け、ＬＥＤの発光色が濁るという本質的な問題があるこ
とがわかった．
そこで、ＬＥＤの発光色の濁りが防止し得る導電率を調
べたところ、Ｏ． ｌｃａｌ／（ｃＩＩ−ｓｅｃ ｔ
）（導電率１０％ＩＡＣＳ）以下であることが判明した
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a copper alloy for LED (light emitting diode) lead frames. [Prior Art] For example, as shown in FIG. 1, an LED is manufactured by die bonding a semiconductor chip 3 to a stem 2a of a lead frame 1, then wire bonding with a wire 4, and then resin molding with a resin 5. It is created by By the way, conventionally, pure iron (SPCC) has been mainly used as a material for LED lead frames. This is due to its low cost and good balance between strength and elongation properties. However, in SPCC, it is difficult to solder directly, so pre-treatment (Cu, N
Undercoat plating treatment such as i) is required, resulting in an increase in costs. Moreover, SPCC has a thermal conductivity of 6. 1 2cal/(cm-sec-'e)
It was found that because of its high conductivity (conductivity = 17% IACS), it was affected by heat during the LED assembly process or during the soldering work during use, causing the inherent problem that the LED light color became cloudy. Therefore, we investigated the conductivity that can prevent the color of LED light from becoming cloudy, and found that O. lcal/(cII-sec t
) (electrical conductivity 10% IACS) or less.
この問題に対応できる材料としては、４２アロイが挙げ
られるが、高価である。42 alloy is a material that can solve this problem, but it is expensive.
したがって、熱伝導率が０ ． １ ｃａｌ／（ｃｍ
・ｓｅｃ・℃）（導電率１０％ＩＡＣＳ）以下であり、
はんだ付け性およびはんだの密着性が良好であり、しか
も安価なＬＥＤリードフレーム用銅合金は現在のところ
開発されていない。Therefore, the thermal conductivity is 0. 1 cal/(cm
・sec・℃) (conductivity 10% IACS) or less,
A copper alloy for LED lead frames that has good solderability and solder adhesion and is inexpensive has not yet been developed.
［発明が解決しようとする課題］
本発明は、上記に説明したような従来技術に鑑みなされ
たものであり、本発明者の鋭意研究の結果、はんだ付け
性およびはんだの密着性が良好であり、熱伝導率が０
． １ ｃａｌ／（ｃｔｓ−ｓｅｃ・’ｃ） （導
電率１０％Ｉ ＡＣＳ）以下の安価なＬＥＤリードフレ
ーム用銅合金を提供することを目的とする．［課題を解
決するための手段］
本発明に係るＬＥＤリードフレーム用銅合金は、Ｎｉ：
０．５〜３．０ｗｔ％、Ｓｉ：１．０〜３．０ｗｔ％、
Ｚｎ ： ０．０ ５ 〜５．０ｗｔ％、Ｐ ： ０．
０ １ 〜０．０ ５ｗｔ％、Ｓｎ：０，５〜３．０ｗ
ｔ％を含有し、残部がＣｕおよび不可避不純物からなる
ことを特徴とするものである．
本発明に係るＬＥＤリードフレーム用銅合金について以
下詳細に説明する。[Problems to be Solved by the Invention] The present invention has been made in view of the prior art as explained above, and as a result of intensive research by the inventor, it has been found that the solderability and solder adhesion are good. , thermal conductivity is 0
．． The purpose is to provide an inexpensive copper alloy for LED lead frames with a conductivity of 1 cal/(cts-sec・'c) (conductivity 10% I ACS) or less. [Means for Solving the Problems] The copper alloy for LED lead frames according to the present invention includes Ni:
0.5 to 3.0 wt%, Si: 1.0 to 3.0 wt%,
Zn: 0.05 to 5.0wt%, P: 0.
0 1 ~ 0.0 5wt%, Sn: 0.5 ~ 3.0w
t%, with the remainder consisting of Cu and unavoidable impurities. The copper alloy for LED lead frames according to the present invention will be described in detail below.
（含有成分の限定理由）
Ｎｉは強度および伸び特性を向上させ、導電率を低下さ
せるための必頭の元素であり、０．５ｗｔ％未溝ではこ
の効果は少なく、また、３．０ｗｔ％を越えて含有され
ると、上記効果が飽和され高価となる。よってＮｉ含有
量は０．５〜３．０ｗｔ％とする。(Reasons for limiting the content) Ni is an essential element for improving strength and elongation properties and reducing electrical conductivity. If the content exceeds this amount, the above effects will be saturated and the price will increase. Therefore, the Ni content is set to 0.5 to 3.0 wt%.
ＳｔはＣｕ中に固溶して導電率を極端に下げる効果を有
し、ｆ．０ｗｔ％未満ではその効果は少なく、また、３
．０ｗｔ％を越えて含有ざれると熱間加工性が悪化する
．
よってＳｉ含有量は１．０〜３．ｏｗｔ％とする．
Ｚｎは錫めっき、錫合金めっきおよびはんだの耐熱剥離
性を著しく改善する元素であり、含有量がＯ．Ｏ”５ｗ
ｔ％未満ではこの効果は少なく、５．０ｗｔ％を越えて
含有されるとはんだ付け性が悪化する．よってＺｎ含有
量は０．０５〜５．０ｗｔ％とする．
ＰはＳｔを多量に含有する銅合金において内部酸化を抑
制する効果を有する元素である．すなわち、酸化雰囲気
で酸素をＰ２ ｏｓの形で固定し、内部酸化を抑制する
のである．含有量が０．０１ｗｔ％未満ではその効果は
少な＜０．０５ｗｔ％を越えて含有されると熱間加工性
が劣化する．よってＰ含有量は０．０１〜０．０５ｗｔ
％とする。St dissolves in Cu and has the effect of extremely lowering the electrical conductivity; f. If it is less than 0 wt%, the effect is small, and 3
．． If the content exceeds 0 wt%, hot workability deteriorates. Therefore, the Si content is 1.0 to 3. It is assumed to be owt%. Zn is an element that significantly improves the heat peeling properties of tin plating, tin alloy plating, and solder. O”5w
If the content is less than t%, this effect is small, and if the content exceeds 5.0wt%, solderability deteriorates. Therefore, the Zn content is set to 0.05 to 5.0 wt%. P is an element that has the effect of suppressing internal oxidation in copper alloys containing a large amount of St. In other words, it fixes oxygen in the form of P2 os in an oxidizing atmosphere and suppresses internal oxidation. If the content is less than 0.01 wt%, the effect is small; if the content exceeds <0.05 wt%, hot workability deteriorates. Therefore, the P content is 0.01 to 0.05wt
%.
Ｓｎは強度および伸び特性を向上させ、また、繰返し曲
げ性の向上に寄与する元素であり、０．５ｗｔ％未満で
はこの効果は少ない。まｋ３．０ｗｔ％を越えて含有さ
れると熱間加工性が悪化する．よってＳｎ含有量は０．
５〜３．０ｗｔ％とする．
なお、上記成分以外にＡｇ，Ａ互，Ｉｎ，Ｆｅ，Ｍｎ，
Ｂ，Ｂｅ，Ｍｇ，Ｃｒ，Ｚｒ，Ｔｉを１種あるいは２種
以上を総量で１．０ｗｔ％まで含有しても、上記したＬ
ＥＤリードフレーム用銅合金の特性は問題なく維持でき
るので、上記元素含有量は許容される．
［実施例］
本発明に係るＬＥＤリードフレーム用銅合金をその実施
例によって詳説する．
第１表
第１表に示すＮｏｔ〜Ｎｏ９の含有成分および含有割合
の銅合金をクリブトル炉において、大気中で木炭被覆下
に溶解後鋳造して厚さ５０ｍｍ、幅８０ｍｍ、長さ１８
０ｍｍの鋳塊とした．この鋳塊の表裏面を面削し、８８
０℃の温度で厚さ１０ｍｍまで熱間圧延を行い、水中急
冷した。Sn is an element that improves strength and elongation characteristics, and also contributes to improving repeat bendability, and this effect is small if it is less than 0.5 wt%. If the content exceeds 3.0 wt%, hot workability deteriorates. Therefore, the Sn content is 0.
The content should be 5 to 3.0 wt%. In addition to the above components, Ag, A, In, Fe, Mn,
Even if one or more of B, Be, Mg, Cr, Zr, and Ti are contained up to a total amount of 1.0 wt%, the above-mentioned L
The above elemental content is permissible because the properties of the copper alloy for ED lead frames can be maintained without any problems. [Example] The copper alloy for LED lead frames according to the present invention will be explained in detail with reference to Examples. Table 1 Copper alloys having the contents and proportions of Not to No. 9 shown in Table 1 were melted and cast under charcoal coating in the air in a Kributol furnace to form a product with a thickness of 50 mm, width of 80 mm, and length of 18 mm.
The ingot was made into a 0mm ingot. The front and back surfaces of this ingot were milled, and
Hot rolling was performed at a temperature of 0° C. to a thickness of 10 mm, followed by quenching in water.
ここで、比較合金Ｎｏ５は、ｓｉ含有量が３．０ｗｔ％
を越えており、熱間割れが発生したため、以後の試料調
整から除外した．
また、比較合金ＮｏＩＯはＳｎの偏析が激しく熱間割れ
が発生したため以後の試料調整から除外した．
次に、酸洗により酸化スケールを除去した後、冷間圧延
を行い、厚さ０．５７ｍｍに仕上げ、ソルトバス中で７
５０℃の温度で２０秒間加熱し、水中急冷した．ざらに
酸洗・研磨により酸化スケールを除去した．ここで比較
合金Ｎｏ８は内部酸化が激しく以後の試料調整を断念し
た．次いで、このような板材を冷間圧延により０．４０
ｍｍの厚さに仕上げ、以下に示す試験を実施した。Here, comparative alloy No. 5 has a Si content of 3.0 wt%.
was exceeded and hot cracking occurred, so it was excluded from further sample preparation. In addition, the comparative alloy NoIO was excluded from subsequent sample preparations because of severe Sn segregation and hot cracking. Next, after removing the oxidized scale by pickling, cold rolling was performed to a thickness of 0.57 mm, and the product was placed in a salt bath for 7 days.
It was heated at a temperature of 50°C for 20 seconds and rapidly cooled in water. Oxidized scale was removed by rough pickling and polishing. Comparative alloy No. 8 was severely oxidized internally, and further sample preparation was abandoned. Next, such a plate material is cold rolled to a 0.40
It was finished to a thickness of mm, and the following tests were conducted.
（１）引張試験においては、圧延方向に平行に切り出し
たＪＩＳ１３号Ｂ試験片を使用した。(1) In the tensile test, a JIS No. 13 B test piece cut out parallel to the rolling direction was used.
（２）硬度は、マイクロスビッカース硬度計により荷重
５００ｇｆの条件で測定した．
（３）導電率は幅が１０ｍｍ，長さが３００ｍｍの試験
片を使用し、ダブルブリッジ法により測定した．
（４）繰り返し曲げ性の試験においては、プレスで打ち
抜いた０．５ｍｍ幅のリードを試験片とし、その一端に
４５０ｇの錘りを吊して一方向往復で曲げＲ−０で９０
＠曲げを行った。そして、往復を１回と数えて、破断ま
での回数を数え、この回数を１０個の試験片について平
均化して破断までの繰り返し曲げ回数を求めた．なお、
曲げ軸は圧延方向に平行とした．
（５）はんだ付け性は弱活性フラックスを使用して、温
度が２３０℃のはんだ浴（Ｓｎ６０−Ｐｂ４０合金）で
試料をはんだ付けした。(2) Hardness was measured using a Micros Vickers hardness meter under a load of 500 gf. (3) Electrical conductivity was measured by the double bridge method using a test piece with a width of 10 mm and a length of 300 mm. (4) In the repeated bendability test, a 0.5 mm wide lead punched out with a press was used as a test piece, a 450 g weight was hung from one end of the lead, and the test piece was bent back and forth in one direction at an R-0 of 90.
@Bending was performed. Then, each round trip was counted as one, the number of times until breakage was counted, and this number of times was averaged for 10 test pieces to determine the number of repeated bending times until breakage. In addition,
The bending axis was parallel to the rolling direction. (5) Solderability: Samples were soldered using a weakly activated flux in a solder bath (Sn60-Pb40 alloy) at a temperature of 230°C.
（６）はんだの密着試験は上記試料を１５０℃の温度に
１ ０００時間加熱し、この加熱期間中２５０時間毎に
９０゜曲げ試験を実施して試料に対するはんだの密着性
、つまり剥離の有無を調査した。(6) For the solder adhesion test, the above sample was heated to 150°C for 1000 hours, and a 90° bending test was performed every 250 hours during this heating period to check the adhesion of the solder to the sample, that is, the presence or absence of peeling. investigated.
以上の試験結果を第２表に示す．
なお、その他の比較合金として、市販のＳＰＣＣ（純鉄
）および４２アロイを使用した．第２表
第２表から明らかなように、本発明合金Ｎｏｔ〜Ｎｏ３
は、強度、伸び特性が良好であり、導電率は１０％ＩＡ
ＣＳ以下であり、ＬＥＤ素子の組立て工程中でも熱影響
を受けることもなく、しかも、９０゜繰返し曲げ性、は
んだ付け性およびはんだの密着性が良好であり，ＬＥＤ
リードフレーム材として信頼性の高いことが分る。The above test results are shown in Table 2. As other comparative alloys, commercially available SPCC (pure iron) and 42 alloy were used. As is clear from Table 2, the alloys of the present invention No.
has good strength and elongation properties, and has an electrical conductivity of 10% IA.
CS or less, it is not affected by heat during the LED element assembly process, and has good 90° repeat bendability, solderability, and solder adhesion.
It can be seen that it is highly reliable as a lead frame material.
これに対して比較合金Ｎｏ４，６．９は、導電率が１０
％ＩＡＣＳを越えており、組立て工程中での熱影響を受
け信頼性に問題があった。On the other hand, comparative alloy No. 4, 6.9 has a conductivity of 10
%IACS, and there was a problem with reliability due to heat effects during the assembly process.
比較合金Ｎｏ７は、Ｚｎの含有量が０．０５ｗｔ％未満
であり、はんだの密着性に問題がある。Comparative alloy No. 7 has a Zn content of less than 0.05 wt% and has a problem in solder adhesion.
比較合金のｓｐｃｃは、はんだ付け性、導電率の面で信
頼性に劣っている。Comparative alloy SPCC is inferior in reliability in terms of solderability and electrical conductivity.
比較合金４２アロイは、特性的には問題ないがコストア
ップになる．
［発明の効果］
以上説明したように本発明に係るＬＥＤリードフレーム
用銅合金は上記の構成を有しているものであり、強度、
伸び特性が良好であり９０’ｌｌ返し曲げ性、はんだ付
け性およびはんだの密着性も優れている．しかも、導電
率が１０％Ｉ ＡＣＳ以下でＬＥＤの組立て工程中の熱
影響を受け難く、ＬＥＤの信頼性向上に多大に寄与する
ものである。Comparative Alloy 42 has no problems in terms of properties, but costs increase. [Effects of the Invention] As explained above, the copper alloy for LED lead frames according to the present invention has the above structure, and has high strength and
It has good elongation properties, 90'll bendability, solderability, and solder adhesion. Moreover, since the conductivity is 10% IACS or less, it is less susceptible to heat effects during the LED assembly process, and greatly contributes to improving the reliability of LEDs.
第１図は、ＬＥＤリードフレームを示す正面図である． FIG. 1 is a front view of the LED lead frame.
Claims (1)
ｔ％、Ｚｎ：０．０５〜５．０ｗｔ％、Ｐ：０．０１〜
０．０５ｗｔ％、Ｓｎ：０．５〜３．０ｗｔ％を含有し
、残部がＣｕおよび不可避不純物からなることを特徴と
するＬＥＤリードフレーム用銅合金Ni: 0.5-3.0wt%, Si: 1.0-3.0w
t%, Zn: 0.05-5.0wt%, P: 0.01-
A copper alloy for LED lead frames, characterized by containing 0.05 wt%, Sn: 0.5 to 3.0 wt%, and the remainder consisting of Cu and inevitable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1158892A JPH0324243A (en) | 1989-06-21 | 1989-06-21 | Copper alloy for led lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1158892A JPH0324243A (en) | 1989-06-21 | 1989-06-21 | Copper alloy for led lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0324243A true JPH0324243A (en) | 1991-02-01 |
Family
ID=15681661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1158892A Pending JPH0324243A (en) | 1989-06-21 | 1989-06-21 | Copper alloy for led lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0324243A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007070651A (en) * | 2005-09-02 | 2007-03-22 | Hitachi Cable Ltd | Copper alloy material and its manufacturing method |
-
1989
- 1989-06-21 JP JP1158892A patent/JPH0324243A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007070651A (en) * | 2005-09-02 | 2007-03-22 | Hitachi Cable Ltd | Copper alloy material and its manufacturing method |
| JP4501818B2 (en) * | 2005-09-02 | 2010-07-14 | 日立電線株式会社 | Copper alloy material and method for producing the same |
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