JPH0323965U - - Google Patents
Info
- Publication number
- JPH0323965U JPH0323965U JP8269089U JP8269089U JPH0323965U JP H0323965 U JPH0323965 U JP H0323965U JP 8269089 U JP8269089 U JP 8269089U JP 8269089 U JP8269089 U JP 8269089U JP H0323965 U JPH0323965 U JP H0323965U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- component
- mount component
- mounting pad
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8269089U JPH0323965U (US08188275-20120529-C00054.png) | 1989-07-15 | 1989-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8269089U JPH0323965U (US08188275-20120529-C00054.png) | 1989-07-15 | 1989-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323965U true JPH0323965U (US08188275-20120529-C00054.png) | 1991-03-12 |
Family
ID=31629725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8269089U Pending JPH0323965U (US08188275-20120529-C00054.png) | 1989-07-15 | 1989-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323965U (US08188275-20120529-C00054.png) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130362A (ja) * | 1994-10-31 | 1996-05-21 | Horiba Ltd | プリント基板 |
| JPH10200246A (ja) * | 1997-01-14 | 1998-07-31 | Nissan Motor Co Ltd | 配線回路基板 |
| JP2001057467A (ja) * | 1999-08-18 | 2001-02-27 | Sony Corp | プリント配線基板 |
| JP2002374060A (ja) * | 2001-06-15 | 2002-12-26 | Mitsubishi Electric Corp | 電子回路板 |
| JP2004228364A (ja) * | 2003-01-23 | 2004-08-12 | Toyota Industries Corp | 表面実装用電子部品の表面実装構造 |
| JP2005167287A (ja) * | 2005-03-11 | 2005-06-23 | Horiba Ltd | プリント基板 |
| JP2017084902A (ja) * | 2015-10-26 | 2017-05-18 | パナソニックＩｐマネジメント株式会社 | 実装基板及び電子装置 |
| JP2018006483A (ja) * | 2016-06-29 | 2018-01-11 | パナソニックＩｐマネジメント株式会社 | 実装基板、ｌｅｄモジュール及びそれを備える照明器具 |
-
1989
- 1989-07-15 JP JP8269089U patent/JPH0323965U/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130362A (ja) * | 1994-10-31 | 1996-05-21 | Horiba Ltd | プリント基板 |
| JPH10200246A (ja) * | 1997-01-14 | 1998-07-31 | Nissan Motor Co Ltd | 配線回路基板 |
| JP2001057467A (ja) * | 1999-08-18 | 2001-02-27 | Sony Corp | プリント配線基板 |
| JP2002374060A (ja) * | 2001-06-15 | 2002-12-26 | Mitsubishi Electric Corp | 電子回路板 |
| JP2004228364A (ja) * | 2003-01-23 | 2004-08-12 | Toyota Industries Corp | 表面実装用電子部品の表面実装構造 |
| JP2005167287A (ja) * | 2005-03-11 | 2005-06-23 | Horiba Ltd | プリント基板 |
| JP2017084902A (ja) * | 2015-10-26 | 2017-05-18 | パナソニックＩｐマネジメント株式会社 | 実装基板及び電子装置 |
| JP2018006483A (ja) * | 2016-06-29 | 2018-01-11 | パナソニックＩｐマネジメント株式会社 | 実装基板、ｌｅｄモジュール及びそれを備える照明器具 |
