JPH03238896A - Rotary head type electronic component mounting apparatus - Google Patents

Abstract

PURPOSE:To effectively mount a large-sized electronic component on a board by providing an electronic component placing unit on another table of a table moving device, and providing a sub transfer head for transferring the component contained in a tray to a position where a plurality of nozzles of the placing unit are landed. CONSTITUTION:A large-sized electronic component contained in a tray 3 is taken up by a sub transfer head 33, transferred to a lacing unit 91, the component transferred to the unit 91 is taken up by a rotary head transfer head 64, and transferred to be placed on a board. In this case, a plurality of nozzles 68a-68d of the head 64 are landed on the upper surface of the component P, the nozzles 68a-68d suck the component to take it up. Thus, the component provided on the tray 3 can effectively be taken up, and transferred to be placed on the board 66.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a rotary head type electronic component mounting apparatus,
Specifically, the present invention relates to an apparatus for advantageously transferring and mounting large electronic components such as QFPs housed in a tray onto a board.

(Prior art) As an electronic component mounting device, a table provided in a table moving device is moved back and forth, and electronic components of a parts feeder such as a tape unit placed on the table are mounted on a rotary head. A rotary head type electronic component mounting apparatus is known in which the electronic component mounting device is picked up by a transfer head and transferred and mounted on a board positioned in a positioning section by index rotation of the rotary head (for example, Japanese Patent Application Laid-Open No. 60-28298 (Japanese Unexamined Patent Publication No. 140499/1982).

The tape unit extracts the tape containing the electronic components from the supply reel, and uses the transfer head to pick up the electronic components stored in the pockets of this tape.
It is designed to be transferred and mounted on the board. The transfer hend is generally equipped with a plurality of nozzles, and one of these nozzles is selected depending on the type of electronic component.
Nozzles are selected, and electronic components are picked up and transferred and mounted on a board using the selected nozzle.

By the way, small electronic components such as capacitor chips and resistor chips can be encapsulated in this type of tape, but large electronic components such as QFP require intermediate processing such as inspection and drying. It is stored in a tray without being enclosed in tape. Therefore, conventionally, electronic components encapsulated in a tape are mounted on a board using the rotary head type electronic component mounting apparatus described above, and electronic components such as QFPO are disclosed in, for example, JP-A-62-259731 and JP-A-62-4.
The electronic component mounting apparatus was separately mounted on a board using a single-head type electronic component mounting apparatus as shown in Japanese Patent No. 2597.

(Problem to be Solved by the Invention) As described above, in the conventional means, it is necessary to prepare two types of electronic component mounting equipment, a rotary head type and a single head type, depending on the type of electronic component, and use both devices properly. As a result, operating and managing the equipment was troublesome, and equipment costs increased accordingly.

Therefore, not only small electronic components installed in a parts feeder such as a tape unit, but also large electronic components stored in a tray are mounted on a board using a rotary head type electronic component mounting device. However, in that case, the following technical issues will arise. In other words, some electronic components such as QFPs have dimensions of 50m x 50m or more, and such large electronic components can be processed using a number of nozzles, similar to small electronic components such as capacitor chips and resistor chips. If you try to pick up the substrate by adsorbing it, the nozzle's vacuum suction power is insufficient, so it is easy to make a tick up error, or even if you are able to tick up, the rotary head rotates as an index and while it is being transferred to the substrate. In this case, the problem arises that it tends to fall from the nozzle.

Therefore, the present invention provides a rotary head type electronic component that can advantageously mount not only small electronic components mounted on a parts feeder such as a tape unit, but also large electronic components mounted on a tray, on a board. The purpose is to provide mounting equipment.

(Means for Solving the Problems) For this purpose, the present invention provides a table moving device with a table separate from a table on which a parts feeder such as a tape unit is placed, and electronic components are placed on this table. In addition, a sub-transfer head is provided to transfer the large electronic components stored in the tray to the position where the plurality of nozzles of the mounting section land.

(Function) In the above configuration, the large electronic component stored in the tray is picked up by the sub-transfer head and transferred to the mounting section. Further, the electronic components transferred to the mounting section are picked up by a transfer head of a rotary head, and transferred and mounted on the board. In this case, the plurality of nozzles of the transfer head land on the upper surface of the electronic component, and these plurality of nozzles attract and tick up the electronic component.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view of a rotary head type electronic component mounting apparatus, in which 61 is a mounting apparatus main body, and a table moving device 62 is provided on the side thereof. The main body 61 includes a rotary head 63 that index-rotates in the direction of arrow N.

Reference numeral 64 denotes a transfer head disposed in parallel along the circumferential direction of the rotary hood 63, which picks up the electronic components of the table moving device 62 and transfers and mounts them onto the board 66 positioned at the positioning section 65. A conveyor 67 carries the substrate 66 into the positioning section 65 and carries it out from there.

The transfer head 64 has a plurality of nozzles 68a.

68b, 68c, and 68d, and by driving the motor M to rotate the transfer head 64 in the θ direction,
The most suitable nozzle for the electronic component to be ticked up is selected from among the plurality of nozzles 68a to 68d. Further, the vacuum suction force of each nozzle 68a to 68d is set to a strength that can satisfactorily suction small electronic components.

Reference numeral 69 denotes an observation device, during which the transfer head 64 transfers the electronic components to the substrate 66.
The electronic component sucked to the lower end of d is observed from below, and its positional shift is detected.

A table 70 is placed on the table moving device 62, and a large number of tape units 71 as parts feeders are placed on this table 70. 72 is a feed screw provided on the table moving device W62. A nut 7 screwed onto the feed screw 72 is provided on the lower surface of the table 70.
When the motor 74 is driven, the table 70 reciprocates in the lateral direction X along the feed screw 72 and stops a desired tape unit 71 at the pick-up position a.

Further, the transfer head 64 picks up the electronic component, and transfers and mounts the electronic component onto the board 66 by rotating the rotary rod 63 indexingly in the N direction. This tape unit 71 has a capacitor chip, a resistor chip, etc.
It is equipped with relatively small electronic components.

In FIG. 1, reference numeral 80 denotes a second table provided in the table moving device 62, on which a plurality of tube feeders 81 as parts feeders are placed. This tube feeder 81 is equipped with an electronic component having leads in two directions, such as an SOP, and is equipped with the above-mentioned table 7.
0, by reciprocating the table 80 in the lateral direction , transferred and mounted on the board 66.

1 and 2, 90 is a third table provided in the table moving device 62 separately from the table 70, and this table 90 is equipped with an electronic component supply device 100 for supplying electronic components. are integrally provided. This electronic component supply device 100 is coupled to the table 90 and reciprocates in the lateral force direction X on the table moving device 62 integrally with the table 90.

A table-shaped storage section 91 is provided at the front of the table 90, and as will be described in detail later, the electronic components P transferred to the pockets 92 of this mounting section 91 are transferred to the transfer head 64. The sample is ticked up by a plurality of nozzles 68a to 68d, and transferred and mounted on the substrate 66. Note that the shape and structure of the placement section 91 and the number of pockets 92 formed in the storage section 91 as means for positioning electronic components are arbitrary, but when a plurality of pockets 92 are formed as in this embodiment, each The shape and dimensions of the pockets 92 may be changed so that different types of electronic components P may be stored in each pocket 92. Next, with reference to FIGS. 2 and 3, this electronic component supply device 1
The detailed structure of 00 will be explained.

This electronic component supply device 100 includes a tray supply device 101
shouted from the tray pull-out device 102. First, the tray supply device 101 will be explained. 1 is a box-shaped magazine in which a plurality of trays 3 attached to a base material 2 are stored in stacks. In this tray 3, for example, a QFP
A large electronic component P having leads in four directions, such as the one shown in FIG. 10.11 is a lower frame and an upper frame, and the magazine l is arranged within this frame 10.11.

Ml is a motor mounted on the upper frame 11, 13 is driven by this motor M1, and a timing pulley 14.1
This is a tie-shortening belt that rotates along 5.16. Timing pulleys 15 and 16 are located on both sides of the upper frame 11, and feed screws 17 and 18 driven by the timing pulleys are vertically provided along both side walls of the frame 11. Feed nuts 19 and 20 are screwed onto the feed pins 17 and 18, and a bracket 21 is screwed onto the feed pins 1-19 and 20.
．． 22 are integrally provided.

Two shafts 23 and 24 are installed horizontally on the upper surface of the magazine 1, and both ends of the shafts are connected to the plackets 21 and 22.
is supported by Therefore, when the motor Ml rotates forward and backward, the feed clutch 17°18 rotates, and the feed clutch 19.
The magazine 1 is raised and lowered by the movement of the magazine 20 along the feeders 17 and 18.

Reference numeral 30.31 denotes an arm extending toward the table 90, and the base material 2 with the tray 3 mounted thereon is pulled out by the tray pull-out device 102 from the plate-shaped supporting member 7 provided between the arm portions 30.31. pulled upwards. This arm portion 30° 31 is coupled to the table 90.

32 is a cover plate whose rack is passed to the arm part 30.31;
3 is a sub-transfer head. As shown in FIG. 3, the base end of the sub-transfer head 33 is attached to a slider 34, and this slider 34 slides in the X direction on a rail 35 installed inside the cover plate 32. It is attached freely. 33a is a nozzle that sucks the electronic component P.

FIG. 4 shows the drive system of the sub-transfer head 33 provided below the support member 7, and 37 and 38 are sliders attached to both ends of the rail 35. The slider 37.38 is mounted so as to be slidable in the Y direction along a guide rod 39.40 disposed inside the arm portion 30.31. MX is the X direction drive motor, 4
2 is the X-axis drum, MY is the Y-direction drive motor, 43 is Y
Each of the drums 42 and 43 is wound with an X-direction wire 44 and a Y-direction wire 45, respectively.

The X-direction wire 44 is connected to the slider 34 and the slider 37.
It is tuned to a bearing 46 provided in 38 etc.
As the motor MX rotates forward and backward, the slider 34 to which the sub-transfer head 33 is attached slides in the X direction along the rail 35. Further, the Y direction wire 45 is tuned to a bearing 49 provided at a corner of the frame 47, 48, etc., and when the motor MY rotates forward or backward, the slider 37
．． 38 moves in the Y direction along rods 39.40, and the sub transfer head 33 connected to this slider 37.38 also moves in the same direction. That is, motors MX, MY, slider 34, rail 35, sliders 37, 38, rod 39.
40, winding drums 42, 43, wires 44, 45, bearings 46, 49, etc. constitute an XY direction moving device for the sub transfer head 33.

In FIGS. 2 and 3, 50 is the front wall 2 of the base material 2.
This is an engaging/disengaging element that engages and disengages from a. This locking/detachment element 50 has a pin 5
An extender 53, which is rotatably supported by the cylinder 1 and extends downward from the extender 53, is attached to a rod 54a of the cylinder 54. Moreover, the locking/detachable element 50 is made of a spring material 55.
Direction of separation from the front wall 2a (clockwise in Fig. 3)
is energized by The cylinder 54 operates and the rod 54
When a protrudes, the locking element 50 rotates counterclockwise against the spring force of the spring member 55 and engages with the front wall 2a. Further, when the cylinder 54 stops operating, the locking element 50 is moved by the spring material 5.
It rotates upward by the spring force of 5 and separates from the front wall 2a. That is, the cylinder 54, the spring material 55, and the like constitute a locking/unhooking device for the locking/unhooking element 50.

In FIG. 3, 56 is a belt located below the support member 7 and is tied to the boot IJ57, M2 is a drive motor,
58 is a mover attached to the belt 56. The cylinder 54 is attached to this mover 58,
Driven by the motor M2, the locking element 50 moves in the Y direction, pulling the base material 2 on which the tray 3 is attached.

That is, the belt 56, pulley 57, mover 58, motor M2, etc. constitute a loading/unloading device that pulls out the tray 3 stored in the magazine 1 toward the loading section 91 of the table 90 and stores it in the magazine l. There is. Note that the specific configuration of the electronic component supply device is not limited to this embodiment, and any device may be used as long as it can transfer the electronic components stored in the tray to the loading section using the sub-transfer head. Therefore, for example, if the tray feeding device is installed separately from the table and behind the side edge of the table moving device, and the table is retracted to this side edge, the electronic components of the tray of the tray feeding device can be removed. It is also possible to transfer the image to the mounting section of the table using a sub-transfer head.

This device has the above-mentioned configuration, and then the overall operation will be explained.

First, when electronic components on the table 70 are to be mounted on the board 66, the table 70 is positioned behind the main body 61, and the tables 80 and 90 are retracted to the right, as shown in FIG.

In this state, drive the motor 74 to reciprocate the table 70 in the lateral direction
is stopped at the pick-up position a, the electronic component is picked up by the transfer door 64, and the electronic component is transferred and mounted on the board 66 by index rotation of the rotary head 63 in the N direction. In this case, as shown in FIG. 5, a plurality of nozzles 68a to 68d of the transfer head 64
Among them, any one selected nozzle (for example, nozzle 68a as shown) lands on the center OA of the electronic component P and ticks up the electronic component P. This nozzle selection is performed by driving the motor M to rotate the transfer head 64 in the θ direction, as described above.

Next, when mounting the electronic components of the tube feeder 81 on the table 80 onto the board 66, the table 70 is retracted to the left and the table 80 is moved behind the main body 61. Therefore, the table 80 is reciprocated in the lateral direction X, the desired tube feeder 81 is stopped at the pick-up position a, and the electronic component is transferred and mounted on the board 66 by being ticked up by the transfer head 64.

Next, when mounting the electronic components on the tray 3 on the board 66, the tables 70 and 80 are retracted to the left, and the table 90 is positioned behind the main body 61. Therefore, the table 90 is reciprocated in the lateral direction Mount.

In this case, as shown in FIG.
68d lands on the top surface of the electronic component P and ticks up. Therefore, the pocket 92 into which the electronic component P is transferred is
A plurality of nozzles 68a to 68d are provided at positions where they land on the upper surface of the electronic component P. By using a plurality of nozzles 68a to 68d in this way, it is possible to reliably pick up a large electronic component P and transfer it to the board 66. In this case, all the nozzles 68a to 68d emit electronic components P.
There is no need to adsorb the two nozzles 68a as shown in FIG.

68b may be used for suction.In short, the large electronic component P may be suctioned by a plurality of nozzles. Of course, also in this case, the pocket 92 is formed at the position where the two nozzles 68a, 68b land. L is a lead of the electronic component P.

By the way, the mounting accuracy required for the capacitor chips and resistor chips mounted on the tape unit 71 is generally low. Therefore, by observing the positional deviation in the XYθ directions using the observation device 69 and rotating the transfer head 64 by driving the motor M, it is possible to correct the positional deviation in the θ direction so as to satisfy the required mounting accuracy. can.

Further, the positional deviation in the XY force directions is corrected by moving the substrate 66 in the xy force directions.

On the other hand, electronic components P such as QFPs, which have a large number of ultra-fine glue leads L, require extremely high mounting accuracy because the leads L must be correctly bonded to the ultra-fine electrodes formed on the board. . However, since there is a limit to the resolution of the motor M, it is difficult to satisfy such high mounting accuracy depending on the correction means for rotating the transfer head 64 in the θ direction.

Therefore, next, a means for performing precise correction in the θ direction will be explained.

In FIG. 8, the board 66 has leads L of the electronic component P.
An extremely thin electrode portion 94 is formed on which the object lands. Further, the positioning section 65 is configured by stacking an X table 65a, a Y table 65b, and a θ chief fluro 5c.

MX and MY are an X motor and a Y motor, respectively. The θ table 65C is connected to the Y table 6 with the pin 95 at the corner as the center.
It is rotatably mounted on 5b.

Mθ is a motor, and a feed screw 96 driven by this motor Mθ is screwed into a nut body 97 disposed on the Y table 65b, and its tip 96a is connected to a corner of the θ table 65c. It is engaged with the elongated hole 98 of.

Therefore, when the motor Mθ is driven and the feed screw 96 advances or retreats in its length direction, the θ table 65C horizontally rotates in the θ direction about the pin 95.

In this way, by horizontally rotating the board 66 without rotating the transfer head 64 that picks up the electronic component P, the positional shift in the θ direction can be precisely corrected. Note that the positional deviation in the XY direction is due to motor MX.

The correction is made by driving MY and moving the substrate 66 in the XY directions. Further, separate from the observation device 69, an optical means capable of precisely detecting the positional deviation of the lead L is provided,
The positional deviation detected by this optical means may be corrected as described above. Note that as such high-precision optical means, for example, a laser device, a linear image camera, etc. are known.

When the above operations are completed, the table 90 is retracted to the right, the table 70 or the table 80 is again moved behind the main body 61, and these electronic components are similarly transferred and mounted on the board 66. Further, while the table 90 is retracted to the right, the sub transfer head 33 replenishes the electronic components P on the tray 3 into the pockets 92 of the mounting section 91. In general, the amount of consumption of electronic components installed in the tube feeder 81 and the tray 3 is considerably smaller than the amount of consumption of electronic components installed in the tape unit 7) 71. Therefore, the two tables 80 and 90 are integrated, the tube feeder 81 and the electronic component supply device 100 are loaded on the same table, and while the two tables 81 and 100 are integrally moved back and forth on the table moving device 62, .1
00 electronic components may be transferred and mounted on the board 66. Further, only one electronic component P may be placed on the placing portion 91. In this case, the transfer head 64
Therefore, every time the electronic component P on the table 90 stopped behind the main body 61 is picked up, the sub transfer head 3
3, the electronic component P on the tray 3 is moved to the tick-up position a.
You only need to supply one at a time. Also, in this case, electronic component P
Since the table 90 is stationary when the electronic component P is placed on the placement portion 91, there is no need to form a means for positioning the electronic component P such as the pocket 92.

In this way, according to the present device, not only the electronic components installed in the parts feeders such as the tape unit 71 and the tube feeder 81, but also the electronic components of the tray 3 are transferred to the board 66.
It can be transported and loaded. In particular, the table 90, which consumes less electronic parts, is separated from the table 70, which consumes more electronic parts, and they are moved back and forth separately.
Work efficiency can be improved.

When the type of electronic component P mounted on the board 66 changes,
When the electronic component P in the tray 3 is out of stock, the tray 3 is replaced as follows. That is, first, the engaging/detachable element 5
0 tows the base material 2 and moves toward the magazine L side, and stores the tray 3 that has been in use in the magazine 1, and the locking element 50 rotates upward and separates from the front wall 2a. .

Next, the magazine 1 is moved up and down by driving the motor M1, and stops at a position where the tray 3 containing the desired electronic components P is opposed to the locking element 50. Then, the cylinder 54 is actuated, and the locking element 50 engages with the front wall 2a of the base material 2.
Next, by driving the motor M2, the base material 2 is pulled by the latch 50 and pulled out onto the support material 7, and then the sub-transfer head 33 moves the electronic components P on the tray 3 onto the mounting section 91. It will be transferred.

(Effects of the Invention) As explained above, according to the present invention, not only electronic components such as capacitor chips and resistor knobs installed in a parts feeder but also large electronic components such as a QFP installed in a tray can be used. Components can also be reliably picked up and transferred and mounted on the board.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, in which Fig. 1 is a plan view of a rotary head type electronic component mounting apparatus, Fig. 2 is a perspective view of a table moving device, and Fig. 3 is a side view of an electronic component supply device. 4 is a perspective view of the drive mechanism of the sub-transfer head,
5, 6, and 7 are plan views during pick-up, and FIG. 8 is a perspective view of the positioning section. 3. Tray 33...Sub transfer head 62...Table moving device 63...Rotary head 64...Transfer head 65...Positioning section 66...Substrate 70...Table 71 ...Parts feeder 90...Table 91...Place section 100...Electronic component supply device 101...Tray supply device P...Electronic component

Claims (1)

[Claims] A rotary head equipped with a transfer head having a plurality of nozzles and a table moving device are provided, and the table provided on the table moving device is reciprocated in the lateral direction. The electronic component of the parts feeder placed on the parts feeder is stopped at the take-up position, the electronic component is sucked to a nozzle selected from the plurality of nozzles and taken up, and the index rotation of the rotary head is performed. In a rotary head type electronic component mounting apparatus that transfers and mounts electronic components on a board positioned in a positioning section, the table moving device is provided with a table separate from the table, and the electronic components are mounted on this table. A rotary head type characterized by having a placing part and a sub-transfer head for transferring large electronic components stored in a tray to the position where multiple nozzles of this placing part land. Electronic component mounting equipment.