JPH0323630B2 - - Google Patents
Info
- Publication number
- JPH0323630B2 JPH0323630B2 JP58028569A JP2856983A JPH0323630B2 JP H0323630 B2 JPH0323630 B2 JP H0323630B2 JP 58028569 A JP58028569 A JP 58028569A JP 2856983 A JP2856983 A JP 2856983A JP H0323630 B2 JPH0323630 B2 JP H0323630B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- resistance
- silicon
- difficult
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58028569A JPS59157282A (ja) | 1983-02-24 | 1983-02-24 | 高シリコンニクロム系スパツタリング用タ−ゲツト |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58028569A JPS59157282A (ja) | 1983-02-24 | 1983-02-24 | 高シリコンニクロム系スパツタリング用タ−ゲツト |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59157282A JPS59157282A (ja) | 1984-09-06 |
JPH0323630B2 true JPH0323630B2 (enrdf_load_stackoverflow) | 1991-03-29 |
Family
ID=12252251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58028569A Granted JPS59157282A (ja) | 1983-02-24 | 1983-02-24 | 高シリコンニクロム系スパツタリング用タ−ゲツト |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59157282A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5709938A (en) * | 1991-11-29 | 1998-01-20 | Ppg Industries, Inc. | Cathode targets of silicon and transition metal |
US6793781B2 (en) | 1991-11-29 | 2004-09-21 | Ppg Industries Ohio, Inc. | Cathode targets of silicon and transition metal |
JP3458871B2 (ja) * | 1995-03-31 | 2003-10-20 | 日立金属株式会社 | クロムタ−ゲットおよびその製造方法 |
CN114015921A (zh) * | 2021-11-04 | 2022-02-08 | 温州市铜仁新材料研究院 | 高阻电阻磁控溅射靶材及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5822379A (ja) * | 1981-07-30 | 1983-02-09 | Tama Denki Kogyo Kk | スパツタリング用タ−ゲツト |
-
1983
- 1983-02-24 JP JP58028569A patent/JPS59157282A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59157282A (ja) | 1984-09-06 |
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