JPH0323483U - - Google Patents
Info
- Publication number
- JPH0323483U JPH0323483U JP1989082596U JP8259689U JPH0323483U JP H0323483 U JPH0323483 U JP H0323483U JP 1989082596 U JP1989082596 U JP 1989082596U JP 8259689 U JP8259689 U JP 8259689U JP H0323483 U JPH0323483 U JP H0323483U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- memory lsi
- common electrode
- joined
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 18
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989082596U JPH0323483U (me) | 1989-07-13 | 1989-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989082596U JPH0323483U (me) | 1989-07-13 | 1989-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323483U true JPH0323483U (me) | 1991-03-12 |
Family
ID=31629556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989082596U Pending JPH0323483U (me) | 1989-07-13 | 1989-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323483U (me) |
-
1989
- 1989-07-13 JP JP1989082596U patent/JPH0323483U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0323483U (me) | ||
| JPH02139784U (me) | ||
| JPH061428Y2 (ja) | Ｉｃカ−ド | |
| JPH0323482U (me) | ||
| JPS62109974U (me) | ||
| JPS6416658U (me) | ||
| JPS60169849U (ja) | 集積回路の実装構造 | |
| JPS63187370U (me) | ||
| JPH01125541U (me) | ||
| JPS62134254U (me) | ||
| JPH0180937U (me) | ||
| JPS6228474U (me) | ||
| JPH02140867U (me) | ||
| JPS6265277U (me) | ||
| JPS619870U (ja) | プリント配線の接続構造 | |
| JPS63131145U (me) | ||
| JPS6124899U (ja) | メモリ増設装置 | |
| JPS6138954U (ja) | 半導体装置 | |
| JPH028977U (me) | ||
| JPH0341937U (me) | ||
| JPS6298271U (me) | ||
| JPS59107139U (ja) | 回路基板のｉｃチップ実装構造 | |
| JPS60181069U (ja) | 基板結合用ハイブリツドｉｃ | |
| JPS60176539U (ja) | 積層電子部品 | |
| JPS6287456U (me) |