JPH0180937U - - Google Patents
Info
- Publication number
- JPH0180937U JPH0180937U JP1987177430U JP17743087U JPH0180937U JP H0180937 U JPH0180937 U JP H0180937U JP 1987177430 U JP1987177430 U JP 1987177430U JP 17743087 U JP17743087 U JP 17743087U JP H0180937 U JPH0180937 U JP H0180937U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- ground
- bonding pads
- ground terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 6
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17743087U JPH0726841Y2 (ja) | 1987-11-19 | 1987-11-19 | 半導体集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17743087U JPH0726841Y2 (ja) | 1987-11-19 | 1987-11-19 | 半導体集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0180937U true JPH0180937U (me) | 1989-05-30 |
| JPH0726841Y2 JPH0726841Y2 (ja) | 1995-06-14 |
Family
ID=31469094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17743087U Expired - Lifetime JPH0726841Y2 (ja) | 1987-11-19 | 1987-11-19 | 半導体集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726841Y2 (me) |
-
1987
- 1987-11-19 JP JP17743087U patent/JPH0726841Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0726841Y2 (ja) | 1995-06-14 |