JPH03229836A - Corrosion-resistant copper alloy tube - Google Patents
Corrosion-resistant copper alloy tubeInfo
- Publication number
- JPH03229836A JPH03229836A JP2266290A JP2266290A JPH03229836A JP H03229836 A JPH03229836 A JP H03229836A JP 2266290 A JP2266290 A JP 2266290A JP 2266290 A JP2266290 A JP 2266290A JP H03229836 A JPH03229836 A JP H03229836A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- alloy tube
- oxygen
- contg
- atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 18
- 230000007797 corrosion Effects 0.000 title claims description 9
- 238000005260 corrosion Methods 0.000 title claims description 9
- 239000010949 copper Substances 0.000 claims abstract description 41
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 17
- 239000001301 oxygen Substances 0.000 claims abstract description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000003647 oxidation Effects 0.000 claims abstract description 9
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 20
- 238000010828 elution Methods 0.000 abstract description 13
- 150000002500 ions Chemical class 0.000 abstract description 10
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 5
- 238000005219 brazing Methods 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910000532 Deoxidized steel Inorganic materials 0.000 description 1
- 208000007256 Nevus Diseases 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical class [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、耐食性銅合金管に係り、より詳細には、例え
ば給水・給湯用配管材等として優れた耐Cuイオン溶出
性を有する耐食性銅合金管に関するものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a corrosion-resistant copper alloy pipe, and more specifically, the present invention relates to a corrosion-resistant copper alloy pipe that has excellent resistance to Cu ion elution and is used as a piping material for water supply/hot water supply, etc. This relates to alloy tubes.
[従来の技術]
給水・給湯用等の配管材料としては耐食性及び施工性の
優れた脱酸銅が汎用されている。しかしながら脱酸銅に
しても十分に要求特性を満たしているとは言えず、水質
によっては徐々にCuイオンが溶出し青水発生の問題が
生ずることがある。[Prior Art] Deoxidized copper, which has excellent corrosion resistance and workability, is widely used as a piping material for water supply, hot water supply, etc. However, even with deoxidized copper, it cannot be said that it fully satisfies the required properties, and depending on the water quality, Cu ions may be gradually eluted, causing the problem of blue water generation.
即ち、配管からのCuイオン溶出が多くなって水道水の
水質基準値(Cu・1.0ppm)を越えると、Cuイ
オンにより洗濯物等が青く着色するといった問題が生じ
てくる。一方、使用期間が経過するにつれて表面に酸化
皮膜が形成され、Cuイオンの溶出が無くなることが知
られている。しかしながら給水・給湯用管の内面にその
ような酸化皮膜が形成されるまでには1〜2年といった
長期間を要し、その間のCuイオンの溶出の問題は回避
できない。That is, when the amount of Cu ions eluted from the pipes increases and exceeds the water quality standard value for tap water (Cu 1.0 ppm), a problem arises in that laundry etc. are colored blue by the Cu ions. On the other hand, it is known that as the period of use passes, an oxide film is formed on the surface and Cu ions no longer elute. However, it takes a long period of time, such as 1 to 2 years, for such an oxide film to be formed on the inner surface of the water/hot water supply pipe, and the problem of Cu ion elution during that time cannot be avoided.
かかる問題を解決した技術として、A℃:001〜1,
5%(重量%:以下同じ)、 Sn:0.03〜2.
5%(但しSn+AIl≧01%)を含み、P、Mg、
B、Mn及びSiの1種または2種以上を総量で0.0
05〜0.5%、酸素含有量か1100pp以下に規制
され、残部かCu及び不可避的不純物からなる銅合金の
内面に、厚さ0.01〜10μmのシリケート皮膜を形
成してなる耐食性銅合金管か提供されている(特公昭6
2−34821号公報)。As a technology that solved this problem, A℃: 001~1,
5% (weight %: same below), Sn: 0.03-2.
Contains 5% (however, Sn+AIl≧01%), P, Mg,
One or more of B, Mn and Si in a total amount of 0.0
A corrosion-resistant copper alloy formed by forming a silicate film with a thickness of 0.01 to 10 μm on the inner surface of a copper alloy whose oxygen content is regulated to 0.05 to 0.5% and regulated to 1100 pp or less, and the remainder is Cu and inevitable impurities. pipes are provided (Tokuko Sho 6)
2-34821).
しかし、上記公報記載技術においては、シリケート皮膜
を形成しており、シリケート皮膜を形成するためにコロ
イタルシリカ等の薬品を要する。However, in the technique described in the above publication, a silicate film is formed, and a chemical such as coroital silica is required to form the silicate film.
[発明か解決しようとする課題]
本発明は、こうした状況のもとて、使用期間の長短を問
わすCuイオンの溶出を安定して確実に低減することか
でき、薬品を使用しない耐食性銅合金管を提供すること
を目的とする。[Problem to be solved by the invention] Under these circumstances, the present invention provides a corrosion-resistant copper alloy that can stably and reliably reduce the elution of Cu ions, regardless of the length of use, and does not require the use of chemicals. The purpose is to provide pipes.
[課題を解決するための手段]
本発明の耐食性銅合金管は、AJ2:0.1〜2.5%
(重量% 以下同じ)、Sn:0.01〜25%(但し
Sn≧Afl/10)を必須的に含み、P、Mg、B、
Mn及びSiの1種または2種以上を総量で0.001
〜0.5%含み、残部かCu及び不可避的不純物からな
る銅合金管であって、酸素を1ppm以上含んだ酸素含
有=囲気中で150℃以上で酸化処理することにより形
成された0、01〜IDI!7mの酸化皮膜を表面に有
することを特徴とする。[Means for Solving the Problems] The corrosion-resistant copper alloy tube of the present invention has AJ2: 0.1 to 2.5%.
(same below as weight%), Sn: 0.01 to 25% (however, Sn≧Afl/10), P, Mg, B,
One or more of Mn and Si in a total amount of 0.001
A copper alloy tube containing ~0.5% and the balance consisting of Cu and unavoidable impurities, containing 1 ppm or more of oxygen = 0,01 formed by oxidation treatment at 150°C or higher in an ambient atmosphere ~IDI! It is characterized by having a 7m long oxide film on its surface.
[作用コ
以下、上記の要件を規定した理由を詳細に説明しつつ、
本発明の作用を明確にして行く。[Operations] Below, we will explain in detail the reasons for stipulating the above requirements, and
The function of the present invention will be clarified.
水中で鋼管内面に形成される酸化皮膜は、Cu20.C
uOてあり、これらの皮膜か万遍なく形成されている限
り通常の使用条件ではCuイオン溶出量か基準値以上に
なることはほとんど生じない。The oxide film formed on the inner surface of the steel pipe in water is Cu20. C
As long as these films are uniformly formed, the amount of Cu ions eluted will hardly exceed the standard value under normal usage conditions.
ところか、皮膜か形成されるまでの使用初期とか、また
pHが低い水質で皮膜の熔解性か高い場合には、Cuイ
オン溶出量が基準値以上になることか経験されている。However, it has been experienced that the amount of Cu ions eluted exceeds the standard value during the initial stage of use until a film is formed, or when the water quality has a low pH and the film is highly soluble.
そこて、Cu20.CuO以外の皮膜で皮膜形成か早く
、かつ低pH水中でも安定性の高い皮膜を形成させる方
策として、特公昭62−34821号公報では適量のA
uを添加し、シリケート皮膜を形成している。So, Cu20. As a measure to form a film other than CuO quickly and with high stability even in low pH water, Japanese Patent Publication No. 62-34821 discloses that an appropriate amount of A
u is added to form a silicate film.
特公昭62−34821号公報に記載された合金を詳細
に検討したところ、特定の酸化性雰囲気中で酸化処理す
ると、Cu2o、CuO等のCu木来の皮膜よりもさら
に表面層にAJ2303等のアルミ酸化物やAfl(○
H)3等のアルミ水酸化物か形成されることを見い出し
た。A detailed study of the alloy described in Japanese Patent Publication No. 62-34821 revealed that when oxidized in a specific oxidizing atmosphere, aluminum such as AJ2303 forms on the surface layer even more than the Cu wood film such as Cu2O and CuO. Oxide and Afl(○
It has been found that aluminum hydroxides such as H) 3 are formed.
そして、これらの皮月莫によりCu、Cu20CuOか
らのCuの溶出か抑制されることがわかった。It was also found that the elution of Cu from Cu and Cu20CuO is suppressed by these skin moles.
そこで、使用初期からA1によるCu溶出抑制効果を得
るためには、シリケート皮膜を形成せずとも、銅管製造
時酸素含有雰囲気中で酸化処理すれはよいことを確認し
た。これは、AJZかCuよりも酸素との親和性か強い
ため最表面層にアルミ酸化物が形成されるからと考えら
れる。Therefore, it was confirmed that in order to obtain the effect of suppressing Cu elution by A1 from the initial stage of use, it is sufficient to carry out oxidation treatment in an oxygen-containing atmosphere during the production of copper tubes without forming a silicate film. This is thought to be because aluminum oxide is formed on the outermost surface layer because AJZ has a stronger affinity for oxygen than Cu.
たたし、Cu溶出量を水質基準のlppm未満て抑制す
るためには酸化皮膜の膜厚は0.01μm以上必要であ
る。一方、膜厚か10μmを越えると管の曲げ加工時に
皮膜にクラック発生し剥離の原因となる。したかフて酸
化皮膜の膜厚は001〜10μmの範囲が適切である。However, in order to suppress the amount of Cu elution to less than lppm of the water quality standard, the thickness of the oxide film needs to be 0.01 μm or more. On the other hand, if the film thickness exceeds 10 μm, cracks will occur in the film during bending of the tube, causing peeling. Therefore, the appropriate thickness of the oxide film is in the range of 0.001 to 10 μm.
次に各添加元素の含有量を限定した理由を示す。Next, the reason for limiting the content of each additive element will be explained.
Auは前述したように本発明の主要構成成分である。0
.1%未満ではCu溶出抑制作用は実用的でないため、
0.1%以上必要である。As mentioned above, Au is a main component of the present invention. 0
.. If it is less than 1%, the effect of suppressing Cu elution is not practical.
0.1% or more is required.
ところが、Cu中にAIl、を添加すると銅管の長所で
あるろう付は接合性が低下するため、これを改害する目
的で種々の添加元素を検討した結果、Snの添加が有効
であることを見い出し、さらに必要添加量を調べた結果
、重量比でAJZ量の1/10以上必要であることがわ
かった。従ってSnはAJZに次ぐ本発明の主要構成成
分である。However, when Al is added to Cu, the bondability of brazing, which is an advantage of copper pipes, decreases.As a result of investigating various additive elements for the purpose of improving this, it was found that the addition of Sn is effective. As a result of investigating the heading and the required amount to be added, it was found that 1/10 or more of the amount of AJZ is required in terms of weight ratio. Therefore, Sn is the second major component of the present invention next to AJZ.
但し、A℃の添加量が多過ぎると製管時の加工性か低下
するので2.5%以下に抑えるべきであり、またSnの
添加量か多過ぎると熱間加工性か低下するので2.5%
以下に抑えなければならない。However, if the amount of A°C added is too large, the workability during pipe making will decrease, so it should be kept below 2.5%. Also, if the amount of Sn added is too large, the hot workability will decrease. .5%
Must be kept below.
また、P、Mg、B、Mnは健全な鋳塊を得るための脱
酸性元素であるか、銅管の水素脆性を抑制するためには
、これらの脱酸性元素を適量含有させておくことか必要
である。Also, are P, Mg, B, and Mn deoxidizing elements to obtain a healthy ingot, or is it necessary to contain appropriate amounts of these deoxidizing elements in order to suppress hydrogen embrittlement in copper pipes? is necessary.
即ち、ろう付は作業時に、酸化性7囲気てトーチ加熱し
た後還元性雰囲気中で加熱した場合、たとえは無酸素銅
では脆化を起こし易いことか知られており、これは、酸
化性雰囲気中で加熱される際に銅の中へ酸素か拡散侵入
し、この酸素か、還元性雰囲気中で加熱される際に侵入
してくる水素と反応して水素脆化現象を起こすものと考
えられている。しかし上記のように酸素との結合力の強
い元素を微量含有させておくと、これらの元素か、酸化
性雰囲気中で加熱させる際に侵入してくる酸素と結合す
る為に酸素が深部まで侵入し難く、その結果水素脆化を
生し難くなるものと考えられる。たたし、これら脱酸性
元素の量か多過ぎると加工性か悪くなるので、多くとも
総和で05%以下、好ましくは01%以下に抑えるへき
である。In other words, it is known that when brazing is heated with a torch in an oxidizing atmosphere and then heated in a reducing atmosphere, for example, oxygen-free copper tends to become brittle. It is thought that oxygen diffuses into copper when it is heated in a reducing atmosphere, and this oxygen reacts with hydrogen that enters when it is heated in a reducing atmosphere, causing hydrogen embrittlement. ing. However, if a small amount of elements that have a strong bonding force with oxygen are included as mentioned above, oxygen will penetrate deep into the body because these elements will combine with the oxygen that enters when heated in an oxidizing atmosphere. As a result, hydrogen embrittlement is thought to be less likely to occur. However, if the amount of these deoxidizing elements is too large, the processability will deteriorate, so the total amount should be kept at most 0.5% or less, preferably 0.1% or less.
一方、酸化処理条件についても種々検討した結果、酸素
をjppm以上含んた酸素雰囲気中て、かつ150℃以
上に加熱して酸化皮膜を形成するのか適切であることを
確;こした。これは、lppm未満ては高温に加熱して
も酸化皮膜か形成されないためてあり、また、150℃
未満では、酸素含有量の高い雰囲気中でも適切な酸化皮
膜が形成されないためである。On the other hand, as a result of various studies regarding the oxidation treatment conditions, it was determined that it is appropriate to form an oxide film in an oxygen atmosphere containing jppm or more of oxygen and by heating to 150° C. or higher. This is because an oxide film will not be formed even if heated to a high temperature below 1ppm, and at 150°C
This is because if it is less than that, an appropriate oxide film will not be formed even in an atmosphere with a high oxygen content.
ざらに、前記=囲気として水分の含有」かlppm以下
の、好ましくは数+Pl)b以下、より好ましくは数p
Pb以下である7囲気を用いれはCuイ容出を著しく減
少させることか可能となり、また、ろう付は性もさらに
向上する。Roughly speaking, the above-mentioned = moisture content as surrounding air is less than 1 ppm, preferably less than number + Pl), more preferably less than number p
By using an atmosphere containing less than Pb, it is possible to significantly reduce the amount of Cu discharged, and the brazing properties are further improved.
[実施例]
第1表に示す化学成分の銅合金を用いて内径21 mm
x肉厚1.0mmの銅合金管を作製し、さらに酸化処理
を行い各種供試管を作製した。[Example] Using a copper alloy with the chemical composition shown in Table 1, the inner diameter was 21 mm.
x Copper alloy tubes with a wall thickness of 1.0 mm were produced and further subjected to oxidation treatment to produce various test tubes.
酸化皮膜の膜厚は、深さ方向のAuger分析により母
材の金属元素が検出されるまでのエツチング時間から算
出した。The thickness of the oxide film was calculated from the etching time until the metal element of the base material was detected by Auger analysis in the depth direction.
供試管からのCu溶出量の測定は、モデル給水条件で供
試管内を通水させ、定期的に取りはずし、給水を24時
間管内に充填させその間の溶出量を測定した。Cu溶出
量の経時変化を第1表に示した。また、本発明銅合金管
の特性を従来鋼管(リン脱酸鋼管)(CI220T)と
比較するため第1表中のNo3,9,10についてCu
溶出量をグラフ化し第1図に示した。The amount of Cu eluted from the test tube was measured by passing water through the test tube under model water supply conditions, periodically removing it, filling the tube with water for 24 hours, and measuring the amount eluted during that time. Table 1 shows the change over time in the amount of Cu eluted. In addition, in order to compare the characteristics of the copper alloy pipe of the present invention with a conventional steel pipe (phosphorus deoxidized steel pipe) (CI220T), No. 3, 9, and 10 in Table 1 were
The elution amount was graphed and shown in FIG.
また、各供試管のろう付は性は軟ろうを用い300℃で
ソケット(C1220T)をろう付けしたときのろうの
充填率を求め評価に用いた。ろうの充填率を第1表に示
す。In addition, each test tube was brazed using a soft solder, and the filling rate of the solder when a socket (C1220T) was brazed at 300° C. was determined and used for evaluation. The filling rate of wax is shown in Table 1.
本発明銅合金管(No1〜9)は従来鋼管(NoIO1
C1220T)に比べCu溶出量が少なくなっている。The copper alloy tubes (No. 1 to 9) of the present invention are the conventional steel tubes (No. 1 to 9).
The amount of Cu eluted is smaller than that of C1220T).
ただ、No9は酸化皮膜を適切な@厚にしていないため
通水初期高めの値となっている。またろう付は性の低下
は認められない。However, No. 9 does not have an appropriate thickness of oxide film, so the value is high at the initial stage of water flow. Furthermore, no decrease in properties was observed in brazing.
方、No1lはAlの含有量が少ないためCu溶出量か
水質基準値の1ppmに達している。またNo12はS
nかAl量の1/10より少ないため、ろうの充填率か
低くなっており、ろう付は性が低下したことを丁してい
る。On the other hand, since No. 1l has a low Al content, the amount of Cu eluted reached the water quality standard value of 1 ppm. Also, No. 12 is S
Since n is less than 1/10 of the amount of Al, the filling rate of the solder is low, which means that the brazing properties have deteriorated.
方、第2表には酸化処理条件の影響について示している
。供試合金として第1表中のNo4を用いた。On the other hand, Table 2 shows the influence of oxidation treatment conditions. No. 4 in Table 1 was used as the test gold.
矛
表
表中のNo4.13,15.17は本発明範囲の酸化処
理条件で作成したものであり、膜厚は0.01μm以上
で10日後のCu溶出量も0.3ppm程度と少ない。Nos. 4.13 and 15.17 in the Table of Contents were prepared under the oxidation treatment conditions within the range of the present invention, and the film thickness was 0.01 μm or more, and the amount of Cu eluted after 10 days was as small as about 0.3 ppm.
また、No14は酸素濃度が本発明範囲より少なく、N
016は加熱温度が本発明範囲より砥いため、膜厚が0
.01μm未満となり、Cu溶出量も0.8ppmと高
い値を示している。In addition, No. 14 has an oxygen concentration lower than the range of the present invention, and N
016 has a heating temperature higher than the range of the present invention, so the film thickness is 0.
.. The Cu elution amount is also as high as 0.8 ppm.
さらに、不意分の含有量か1ppm以下の酸化性;囲気
中で酸化したNo17の場合は、Cuの溶出量は著しく
減少している。Furthermore, in the case of No. 17, which was oxidized in an ambient atmosphere, the amount of Cu eluted was significantly reduced.
[発明の効果コ
本発明は以上のように構成されため、Cuの溶出による
水質劣化の発生を確実に防止し得る。[Effects of the Invention] Since the present invention is configured as described above, it is possible to reliably prevent water quality deterioration due to Cu elution.
第1図は代表的な供試管のCu熔出量経時変化を示すグ
ラフである。FIG. 1 is a graph showing changes over time in the Cu elution amount of typical test tubes.
Claims (2)
Sn:0.01〜2.5%(但しSn≧Al/10)を
必須的に含み、P、Mg、B、Mn及びSiの1種また
は2種以上を総量で0.001〜0.5%含み、残部が
Cu及び不可避的不純物からなる銅合金よりなる銅合金
管であつて、酸素を1ppm以上含んだ酸素含有雰囲気
中で150℃以上で酸化処理することにより形成された
0.01〜10μmの酸化皮膜を表面に有することを特
徴とする耐食性銅合金管。(1) Al: 0.1 to 2.5% (weight%: same below),
Essentially contains Sn: 0.01 to 2.5% (however, Sn≧Al/10), and one or more of P, Mg, B, Mn, and Si in a total amount of 0.001 to 0.5 %, the balance being Cu and unavoidable impurities, the tube is formed by oxidation treatment at 150°C or higher in an oxygen-containing atmosphere containing 1 ppm or more of oxygen. A corrosion-resistant copper alloy tube characterized by having a 10 μm oxide film on its surface.
囲気であることを特徴とする請求項1記載の耐食性銅合
金管。(2) The corrosion-resistant copper alloy tube according to claim 1, wherein the atmosphere has a moisture content of 1 ppm or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2266290A JPH03229836A (en) | 1990-02-01 | 1990-02-01 | Corrosion-resistant copper alloy tube |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2266290A JPH03229836A (en) | 1990-02-01 | 1990-02-01 | Corrosion-resistant copper alloy tube |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03229836A true JPH03229836A (en) | 1991-10-11 |
Family
ID=12089060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2266290A Pending JPH03229836A (en) | 1990-02-01 | 1990-02-01 | Corrosion-resistant copper alloy tube |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03229836A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0792941A1 (en) * | 1996-02-20 | 1997-09-03 | Wieland-Werke AG | Use of a copper-aluminium-(zinc) alloy as a corrosion-resistant material |
-
1990
- 1990-02-01 JP JP2266290A patent/JPH03229836A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0792941A1 (en) * | 1996-02-20 | 1997-09-03 | Wieland-Werke AG | Use of a copper-aluminium-(zinc) alloy as a corrosion-resistant material |
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