JPH03229763A - Thermoplastic resin composition - Google Patents
Thermoplastic resin compositionInfo
- Publication number
- JPH03229763A JPH03229763A JP2024799A JP2479990A JPH03229763A JP H03229763 A JPH03229763 A JP H03229763A JP 2024799 A JP2024799 A JP 2024799A JP 2479990 A JP2479990 A JP 2479990A JP H03229763 A JPH03229763 A JP H03229763A
- Authority
- JP
- Japan
- Prior art keywords
- inorganic powder
- thermoplastic resin
- particle diameter
- weight
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 17
- 239000011342 resin composition Substances 0.000 title claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 34
- 239000002245 particle Substances 0.000 claims abstract description 22
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 230000005484 gravity Effects 0.000 abstract description 10
- 238000002156 mixing Methods 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 238000011049 filling Methods 0.000 abstract description 4
- 239000004952 Polyamide Substances 0.000 abstract description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 abstract description 3
- 229920002647 polyamide Polymers 0.000 abstract description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 abstract description 3
- 229910052725 zinc Inorganic materials 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910052791 calcium Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 150000004767 nitrides Chemical class 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 229910052721 tungsten Inorganic materials 0.000 abstract description 2
- 229910052726 zirconium Inorganic materials 0.000 abstract description 2
- 238000001746 injection moulding Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000004898 kneading Methods 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- SHLNMHIRQGRGOL-UHFFFAOYSA-N barium zinc Chemical compound [Zn].[Ba] SHLNMHIRQGRGOL-UHFFFAOYSA-N 0.000 description 1
- -1 bofester Polymers 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、熱可塑性樹脂に無機粉末を高充填した射出成
形用材料に係り、電気電子部品や機械部品等に好適な高
比重、高強度、高剛性で、且つ優れた成形性を有する熱
可塑性樹脂組成物に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an injection molding material in which a thermoplastic resin is highly filled with inorganic powder, and has high specific gravity and high strength suitable for electrical and electronic parts, mechanical parts, etc. , relates to a thermoplastic resin composition having high rigidity and excellent moldability.
（従来の技術）
従来、無機粉末を高充填した組成物としては、熱可塑性
樹脂にフェライトやコバルト合金等の磁性粉末を配合し
た、所謂、プラスチ、クマグネノト用樹脂組成物がよく
知られている。又、金属粉末を高充填し、高比重性や導
電性を付与した樹脂組成物も多くの産業分野で広く使用
されている。(Prior Art) Conventionally, as a composition highly filled with inorganic powder, a so-called resin composition for plasti or kumagnenote, which is a mixture of thermoplastic resin and magnetic powder such as ferrite or cobalt alloy, is well known. Furthermore, resin compositions highly filled with metal powder to impart high specific gravity and conductivity are also widely used in many industrial fields.
例えば、特開昭５６〜１５９２４８号公報では、ポリテ
トラメナレンテレフタレートに銅、鉄、ニッケル、アル
ミニウム、金等の金属粉末を配合した高比重で、且つ成
形性、熱伝導性に優れた樹脂組成物が示されている。又
、特公昭６１重量２６１号公報には、熱可塑性樹脂に平
均粒径８μｍ〜４０μｍの亜鉛粉末を配合した高比重熱
可塑性樹脂組成物の製造方法が挙げられている。For example, in JP-A-56-159248, a resin composition with high specific gravity and excellent moldability and thermal conductivity is made by blending metal powders such as copper, iron, nickel, aluminum, and gold with polytetramenalene terephthalate. things are shown. Furthermore, Japanese Patent Publication No. 61-261 discloses a method for producing a high specific gravity thermoplastic resin composition in which zinc powder having an average particle size of 8 μm to 40 μm is blended with a thermoplastic resin.
しかしながら、無機粉末を配合した熱可塑性樹脂組成物
は、無機粉末の配ｊ量増加に伴ない、寸法精度が向上し
、高比重化するが、一方では、流動性が低下し、成形品
外観不良等の問題点を有する。例えば、無機粉末を容量
比で４０％以上配合した樹脂組成物は、射出成形時に十
分な流動性がなく、ショートショット、成形品外観不良
等の欠屯を有する。又、その前段階で溶融混練し、ペレ
ット化することも極めて困難である。However, thermoplastic resin compositions containing inorganic powder have improved dimensional accuracy and higher specific gravity as the amount of inorganic powder increases, but on the other hand, flowability has decreased and molded products have poor appearance. It has the following problems. For example, a resin composition containing 40% or more by volume of inorganic powder does not have sufficient fluidity during injection molding, and has shortcomings such as short shots and poor appearance of the molded product. Furthermore, it is extremely difficult to melt-knead and pelletize the material in the preliminary stage.
（発明が解決しようとする課題）
本発明はこのような事情に鑑みなされたものであって、
その目的とするところは、高比重で高強度、亮剛性を有
し、かつ成形性に優れた執可塑性樹脂組成物を提供する
ムこある。(Problem to be solved by the invention) The present invention has been made in view of the above circumstances, and
The purpose is to provide a flexiplastic resin composition that has high specific gravity, high strength, good rigidity, and excellent moldability.
（課題を解決するｆこめの手段）
１述の目的は、熱可塑性樹脂と無機粉末とからなる組成
物で、ちって、該無機粉末の粒度分布が、粒径１０μｍ
未満のものが無機粉末全体重量中４０〜７０重量％、１
０〜２０μｍのものが同じく１５重量％以下、２０μｍ
を超えるものが同じく２５〜５０重量％であることを特
徴とする熱可塑性樹脂組成物によって達成される。(Comprehensive means for solving the problem) The object mentioned above is a composition consisting of a thermoplastic resin and an inorganic powder, and the particle size distribution of the inorganic powder is 10 μm.
Less than 40 to 70% by weight of the total inorganic powder, 1
Similarly, 15% by weight or less of 0 to 20 μm, 20 μm
This is achieved by a thermoplastic resin composition characterized in that it also contains 25 to 50% by weight.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に使用する熱可塑性樹脂としては、加熱流動性が
あり、射出成形可能なものであれば特に限定するもので
はなく、例えば、ポリアミド、ボフエステル、ポリカー
ボネート、ポリエーテルサルフォン、ポリオレフィン、
ポリフェニレンオキサイド１ ポリフェニレンサルファ
イド、ポリエテルエーテルケトン、ＡＳ樹脂、ＡＮ樹脂
ＡＢＳ樹脂等が挙げられる。これらの中でも、ポリアミ
ド、ポリエステル７ポリフエニレンサルフアイドが好適
である。The thermoplastic resin used in the present invention is not particularly limited as long as it has heat flowability and can be injection molded, and examples include polyamide, bofester, polycarbonate, polyether sulfone, polyolefin,
Polyphenylene oxide 1 Examples include polyphenylene sulfide, polyetheretherketone, AS resin, AN resin, ABS resin, and the like. Among these, polyamide and polyester 7 polyphenylene sulfide are preferred.
また、本発明に使用する無機粉末としては、鉄ニッケル
、コバルト、ａ、亜鉛、タングステン等の金属、これら
２種以上の金属からなる合金、及びケイ素、アルミニウ
ム、カルシウム、バリウム亜鉛、ジルコニウム等の酸化
物、炭化物もしくは窒化物等のセラミック等が挙げられ
る。また、これらは１種でも、２種以上混合して用いて
もよい。Inorganic powders used in the present invention include metals such as iron nickel, cobalt, a, zinc, and tungsten, alloys of two or more of these metals, and oxidized materials such as silicon, aluminum, calcium, barium zinc, and zirconium. Examples include ceramics such as carbides, nitrides, etc. Further, these may be used alone or in combination of two or more.
本発明ムこおいて、無機粉末の粒度分布は、粒径１０８
ｍ未満のものが無機粉末全体重量中４０〜７０重量％、
１０〜２０μｍのものが１５重量％以下、２０μｍを超
えるものが２５〜５０重量％であることが肝要であり、
好ましくは粒径１０μｍ未満のものが４５〜６５重量％
、１０〜２０μｍのものが１０重蓋％以下、２０μｍを
超えるものが３０〜４５重量％である。無機粉末をより
高充填した樹脂組成物を得ようとする場合に５よ、無機
粉末の粒度分布を上記範囲にすることが肝要で、このよ
うな粒度分布の無ｉ粉末を用いることにより、流動性、
成形品外観とも優れた熱可塑性樹脂組成物を得ることが
できる。１０μｍ未満のものが４０重量％未満であると
成形品外観が不良となり、７０重量％を超えると流動性
が低下し、混練及び射出成形性が困難になる。１０〜２
０μｍの範囲のものが１５重量％を超えると流動性が著
しく低下する。又、２０．ｃａｍを垣えるものが２５重
量％未満である場合にも流動性が低下し、５０重蓋％を
超えると成形品外観不良となる。In the present invention, the particle size distribution of the inorganic powder is 108
40 to 70% by weight of the total weight of the inorganic powder,
It is important that 10 to 20 μm is 15% by weight or less, and 25 to 50% by weight is more than 20 μm.
Preferably 45 to 65% by weight of particles with a particle size of less than 10 μm
, 10% by weight or less is 10 to 20 μm, and 30 to 45% by weight is more than 20 μm. When trying to obtain a resin composition with a higher loading of inorganic powder, it is important to keep the particle size distribution of the inorganic powder within the above range. sex,
A thermoplastic resin composition with excellent molded product appearance can be obtained. If the amount of particles less than 10 μm is less than 40% by weight, the appearance of the molded product will be poor, and if it exceeds 70% by weight, fluidity will decrease, making kneading and injection moldability difficult. 10-2
If the amount of particles in the 0 μm range exceeds 15% by weight, fluidity will be significantly reduced. Also, 20. If the amount of the material that can block the cam is less than 25% by weight, the fluidity will decrease, and if it exceeds 50% by weight, the appearance of the molded product will be poor.
また、無機粉末の熱可塑性樹脂への配合量は、好ましく
は６５〜９８重量％で、より好ましくは７０〜９８重量
％である。配合量が６５重量％未満の場合、流動性、成
形品外観は良好であるが、比重、Ｍｌ性等が不十分とな
る傾向がある。逆に、９８重量％を超える場合、加熱溶
融時の流動性が悪く、射出成形が困難となり易い。Moreover, the blending amount of the inorganic powder in the thermoplastic resin is preferably 65 to 98% by weight, more preferably 70 to 98% by weight. When the blending amount is less than 65% by weight, the fluidity and appearance of the molded product are good, but the specific gravity, Ml properties, etc. tend to be insufficient. On the other hand, if it exceeds 98% by weight, the fluidity during heating and melting will be poor, making injection molding difficult.
執可塑性樹脂への無機粉末の配合方法は、特に限定され
るものではなく、例えば、執可塑性樹脂粉末と集穀粉末
とをヘンンエルミキサー等の高速回転翼を有する混′ｆ
１機で撹拌による摩擦溶融で造粒する方法や、車軸、或
いは２軸混練機で溶融混練する方法、又これらを組み合
わせる方法等が挙げられる。The method of blending the inorganic powder with the plasticizing resin is not particularly limited, and for example, mixing the plasticizing resin powder and grain powder with a high-speed rotary blade such as a Hennel mixer.
Examples include a method of granulating by friction melting using a single machine, a method of melting and kneading with an axle or twin-screw kneader, and a method of combining these methods.
（発明の効果）
本発明にかかる熱可塑性樹脂組成物は、射出成形材料と
して良好な成形性、成形品外観を有するものである。ま
た、無機粉末を理論的最高充填量近くまで高充填するこ
とを可能とし、無機粉末を高充填しても流動性に優れ、
成形性が良好である。(Effects of the Invention) The thermoplastic resin composition according to the present invention has good moldability and molded product appearance as an injection molding material. In addition, it is possible to highly fill inorganic powder close to the theoretical maximum filling amount, and even with high inorganic powder filling, it has excellent fluidity.
Good moldability.
無機粉末の種類に応じ、高い寸法精度の必要なもの、大
きい比重の必要なもの、ブラマグ、セラミック射出成形
、金属射出焼結等の用途に有用な樹脂組成物として提供
される。Depending on the type of inorganic powder, it is provided as a resin composition useful for applications such as those that require high dimensional accuracy, those that require high specific gravity, Brahmag, ceramic injection molding, and metal injection sintering.
以下、実施例を挙げて本発明を具体的に説明する。The present invention will be specifically described below with reference to Examples.
（実施例１〜４．比較例１〜１０）
粉末状ナイロン６樹脂（鑵紡■製、 ＭＣｌ０２）とタ
ングステン粉末とを表−１に示す割合で配合した。また
、この時使用したタングステン粉末の粒度分布は表−１
に示すようにした。次いで、これをヘンシェルミキサー
を用いて高速撹拌下で摩擦熔融した後、冷却固化して再
粉砕し、更に、３Ｑｍｍφ２軸混練機を用いて、シリン
ダー温度２５０〜２６０℃で熔融混練し、成形用ペレッ
トを得た。次いで、得られたペレットを用いて通常実施
されているナイロン６樹脂の成形条件で射出成形し、成
形サンプルを得た。(Examples 1 to 4. Comparative Examples 1 to 10) Powdered nylon 6 resin (MCl02, manufactured by Hanbo Co., Ltd.) and tungsten powder were blended in the proportions shown in Table-1. In addition, the particle size distribution of the tungsten powder used at this time is shown in Table-1.
I made it as shown. Next, this was friction-melted under high-speed stirring using a Henschel mixer, cooled, solidified, and re-pulverized, and further melted and kneaded using a 3Q mmφ twin-screw kneader at a cylinder temperature of 250 to 260°C to form pellets for molding. I got it. Next, injection molding was performed using the obtained pellets under commonly used molding conditions for nylon 6 resin to obtain molded samples.
また、前記同様の方法を用い、タングステン粉末をアル
ミナ粉末にかえ、配合比１粒度分布を表２に示すように
して成形サンプルを得た。In addition, molded samples were obtained using the same method as above, replacing the tungsten powder with alumina powder, and having the particle size distribution at one blending ratio shown in Table 2.
得られた成形サンプルの評価を行った。評価の比較例３
及び比較例８は、３０ｍｍψ２軸混練機で混練できず、
成形用ペレットを採取できなかった・
表−３の如く、無機粉末の粒度分布が本発明の範囲内で
ある場合は、混練操業性、射出成形性及び成形品外観全
てに優れていた。逆に、無機粉末の粒度分布が本発明の
範囲から外れた場合、混練操業性、射出成形性及び成形
品外観全てを満足することはできなかった。The obtained molded sample was evaluated. Evaluation comparison example 3
and Comparative Example 8 could not be kneaded with a 30 mmψ twin-screw kneader,
Pellets for molding could not be collected. As shown in Table 3, when the particle size distribution of the inorganic powder was within the range of the present invention, the kneading operability, injection moldability, and appearance of the molded product were all excellent. Conversely, when the particle size distribution of the inorganic powder deviates from the range of the present invention, it was not possible to satisfy all of the kneading operability, injection moldability, and appearance of the molded product.
〜ギ′と〜Gi′ and
Claims (1)
該無機粉末の粒度分布が、粒径１０μｍ未満のものが無
機粉末全体重量中４０〜７０重量％、１０〜２０μｍの
ものが同じく１５重量％以下、２０μｍを超えるものが
同じく２５〜５０重量％であることを特徴とする熱可塑
性樹脂組成物。A composition comprising a thermoplastic resin and an inorganic powder,
The particle size distribution of the inorganic powder is such that 40 to 70% by weight of the total inorganic powder has a particle size of less than 10 μm, 15% by weight or less of 10 to 20 μm, and 25 to 50% by weight of more than 20 μm. A thermoplastic resin composition characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024799A JPH0717784B2 (en) | 1990-02-02 | 1990-02-02 | Thermoplastic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024799A JPH0717784B2 (en) | 1990-02-02 | 1990-02-02 | Thermoplastic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03229763A true JPH03229763A (en) | 1991-10-11 |
| JPH0717784B2 JPH0717784B2 (en) | 1995-03-01 |
Family
ID=12148246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024799A Expired - Lifetime JPH0717784B2 (en) | 1990-02-02 | 1990-02-02 | Thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717784B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135591A (en) * | 1996-10-29 | 1998-05-22 | Matsushita Electric Ind Co Ltd | Heat conductive substrate and wiring substrate |
| WO1999016831A1 (en) * | 1997-09-30 | 1999-04-08 | Ngk Insulators, Ltd. | Plastic/ceramic composite material and process for producing the same |
| US6472058B2 (en) | 1997-12-16 | 2002-10-29 | Ngk Insulators, Ltd. | Fiber-composite material and method for producing the same |
| WO2014157694A1 (en) * | 2013-03-29 | 2014-10-02 | 出光ライオンコンポジット株式会社 | Polyarylene sulfide resin composition and use of same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3587377B1 (en) * | 2017-02-27 | 2022-07-06 | Kyocera Corporation | Corrosion-resistant member |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56834A (en) * | 1979-06-15 | 1981-01-07 | Showa Denko Kk | Additive for high-molecular material |
-
1990
- 1990-02-02 JP JP2024799A patent/JPH0717784B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56834A (en) * | 1979-06-15 | 1981-01-07 | Showa Denko Kk | Additive for high-molecular material |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135591A (en) * | 1996-10-29 | 1998-05-22 | Matsushita Electric Ind Co Ltd | Heat conductive substrate and wiring substrate |
| WO1999016831A1 (en) * | 1997-09-30 | 1999-04-08 | Ngk Insulators, Ltd. | Plastic/ceramic composite material and process for producing the same |
| US6472058B2 (en) | 1997-12-16 | 2002-10-29 | Ngk Insulators, Ltd. | Fiber-composite material and method for producing the same |
| WO2014157694A1 (en) * | 2013-03-29 | 2014-10-02 | 出光ライオンコンポジット株式会社 | Polyarylene sulfide resin composition and use of same |
| JP2014198801A (en) * | 2013-03-29 | 2014-10-23 | 出光ライオンコンポジット株式会社 | Polyarylene sulfide resin composition and application of the same |
| US10000628B2 (en) | 2013-03-29 | 2018-06-19 | Lion Idemitsu Composites Co., Ltd. | Polyarylene sulfide resin composition and use of same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717784B2 (en) | 1995-03-01 |
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