JP2001072775A - Conductive resin molding or sheet - Google Patents
Conductive resin molding or sheetInfo
- Publication number
- JP2001072775A JP2001072775A JP25107299A JP25107299A JP2001072775A JP 2001072775 A JP2001072775 A JP 2001072775A JP 25107299 A JP25107299 A JP 25107299A JP 25107299 A JP25107299 A JP 25107299A JP 2001072775 A JP2001072775 A JP 2001072775A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- sheet
- blend
- conductive resin
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、極めて高度の導電
性、及び優れた成形性や機械的強度を有する導電性樹脂
成形品又はシートに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive resin molded article or sheet having extremely high conductivity and excellent moldability and mechanical strength.
【0002】[0002]
【従来の技術】従来、各種樹脂からなる成形品に導電性
を付与した導電性樹脂成形品、シートとして、合成樹脂
に導電性フィラーを分散、混合した複合材料を用い成形
した成形品、シートが知られている。導電性フィラーと
して金属系、カーボン系などが使用されているが、高度
の導電性を付与するには導電性フィラーの添加量を大幅
に増加せざるを得なく、その結果、成形性の悪化や、脆
弱となり機械的強度が低下するため添加量は制限され、
得られる成形品やシートの導電性も体積固有抵抗値で1
0−1Ω・cmが限界であった。2. Description of the Related Art Conventionally, as a conductive resin molded article or sheet obtained by imparting conductivity to a molded article made of various resins, a molded article or sheet formed by using a composite material obtained by dispersing and mixing a conductive filler in a synthetic resin has been used. Are known. Metal-based, carbon-based, etc. are used as conductive fillers, but in order to impart a high degree of conductivity, the amount of conductive fillers must be increased significantly, resulting in deterioration of moldability and , It becomes brittle and the mechanical strength decreases, so the amount added is limited,
The conductivity of the resulting molded product or sheet is also 1 volume resistivity.
0 -1 Ω · cm was the limit.
【0003】[0003]
【発明が解決しようとする課題】そこで、極めて高度の
導電性を有するとともに、成形性及び機械的強度も優れ
た導電性樹脂成形品やシートが求められていた。Accordingly, there has been a demand for a conductive resin molded article or sheet having an extremely high conductivity and excellent moldability and mechanical strength.
【0004】[0004]
【課題を解決するための手段】本発明者は上記課題を解
決すべく鋭意検討した結果、本発明を完成するに至っっ
た。即ち本発明の要旨は、(a)熱可塑性樹脂と(b)
熱可塑性エラストマーのブレンド物を基質とし、これに
(c)融点が300℃以下の低融点金属、及び(d)金
属粉末を混合してなる導電性樹脂成形品又はシートにあ
る。The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, completed the present invention. That is, the gist of the present invention is that (a) a thermoplastic resin and (b)
The conductive resin molded article or sheet is obtained by mixing a thermoplastic elastomer blend as a substrate, (c) a low melting point metal having a melting point of 300 ° C. or lower, and (d) a metal powder.
【0005】本発明の好ましい実施態様としては、下記
が挙げられる。(a)熱可塑性樹脂と(b)熱可塑性エ
ラストマーのブレンド物が成形品又はシート全体の20
〜80容量%の範囲であるとともに、(c)及び(d)
を合わせた金属成分中の(d)金属粉末の割合が10〜
30容量%の範囲であることを特徴とする上記請求項1
記載の導電性樹脂成形品又はシート。(a)熱可塑性樹
脂と(b)熱可塑性エラストマーのブレンド物の硬度が
デュロメータA硬さで35以上、デュロメータD硬さ6
0以下の範囲であることを特徴とする上記の導電性樹脂
成形品又はシート。(c)成分の低融点金属が、Pb/
Sn、Pb/Sn/Bi、Pb/Sn/Ag、 Pb/A
g、 Sn/Ag、 Sn/Bi、Sn/Cu、Sn/Zn
系から選ばれた低融点合金からなることを特徴とする上
記の導電性樹脂成形品又はシート。(d)成分の金属粉
末がCu、Ni、Al、Cr及びそれらの合金粉末から
なり、その平均粒径が1〜50μmの範囲であることを
特徴とする上記の導電性樹脂成形品又はシート。[0005] Preferred embodiments of the present invention include the following. A blend of (a) a thermoplastic resin and (b) a thermoplastic elastomer is used as a binder for the entire molded article or sheet.
(C) and (d)
The ratio of the metal powder (d) in the metal component obtained by combining
2. The method according to claim 1, wherein the amount is in the range of 30% by volume.
The conductive resin molded article or sheet according to the above. The hardness of the blend of (a) the thermoplastic resin and (b) the thermoplastic elastomer is 35 or more in durometer A hardness and 6 in durometer D hardness.
The conductive resin molded article or sheet described above, which is in a range of 0 or less. The low melting point metal of the component (c) is Pb /
Sn, Pb / Sn / Bi, Pb / Sn / Ag, Pb / A
g, Sn / Ag, Sn / Bi, Sn / Cu, Sn / Zn
The conductive resin molded article or sheet described above, comprising a low melting point alloy selected from the group consisting of: (D) The conductive resin molded article or sheet described above, wherein the metal powder of the component is made of Cu, Ni, Al, Cr, or an alloy powder thereof, and has an average particle diameter in the range of 1 to 50 μm.
【0006】[0006]
【発明の実施の形態】以下、本発明を詳しく説明する。
本発明の導電性樹脂成形品又はシートは、その材料が
(a)熱可塑性樹脂、(b)熱可塑性エラストマー、
(c)融点が300℃以下の低融点金属、及び(d)金
属粉末の混合物(以下、「混合材」という)からなるこ
とに特徴がある。このように熱可塑性樹脂、熱可塑性エ
ラストマーと導電性を付与するための金属成分を特定の
組合せとすることにより、極めて高度の導電性と他の特
性をバランス良く付与できることを見出したものであ
り、混合材においては(a)熱可塑性樹脂と(b)熱可
塑性エラストマーのブレンド物を組成物全体の20〜8
0容量%、好ましくは40〜60容量%の範囲で含有す
ることが好ましい。樹脂ブレンド成分が80容量%を越
えると導電性が発現し難い傾向にあり、20容量%未満
では、流動性が低下して成形性に劣り易い。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
The conductive resin molded article or sheet according to the present invention is composed of (a) a thermoplastic resin, (b) a thermoplastic elastomer,
It is characterized by comprising a mixture of (c) a low melting point metal having a melting point of 300 ° C. or lower and (d) a metal powder (hereinafter, referred to as “mixture”). By using a specific combination of a thermoplastic resin, a thermoplastic elastomer and a metal component for imparting conductivity, it has been found that a very high degree of conductivity and other properties can be imparted in a well-balanced manner, In the mixed material, a blend of (a) a thermoplastic resin and (b) a thermoplastic elastomer is used in an amount of 20 to 8 of the total composition.
It is preferably contained in an amount of 0% by volume, preferably 40 to 60% by volume. When the content of the resin blend component exceeds 80% by volume, conductivity tends to hardly develop, and when the content is less than 20% by volume, the fluidity is reduced and moldability tends to be poor.
【0007】(a)熱可塑性樹脂と(b)熱可塑性エラ
ストマーのブレンド物の硬度がデュロメータA硬さで3
5以上、デュロメータD硬さ60以下の範囲、好ましく
はデュロメータA硬さで50以上、デュロメータD硬さ
50以下であることが好ましい。ブレンド物の硬度がデ
ュロメータA硬さで35未満では、柔らかすぎて成形が
困難となり、デュロメータD硬さ60以上では、脆性改
質の効果が失われ易い。また、樹脂ブレンド物と低融点
金属との接着強度を向上させるために酸変成ポリオレフ
ィンなどの界面接着剤を添加することも好適である。
(d)の金属粉末は低融点金属の分散助剤として作用
し、金属成分中の(d)金属粉末の割合を10〜30容
量%、好ましくは15〜25容量%の範囲とすることが
好ましい。10容量%未満では、分散状態が悪くなり、
また30容量%を越えると流動性が低下するとともに脆
化しやすく、さらに導電性も低下する傾向が見られる。The hardness of the blend of (a) the thermoplastic resin and (b) the thermoplastic elastomer is 3 in durometer A hardness.
It is preferable that the hardness is 5 or more and the durometer D hardness is 60 or less, and it is preferable that the durometer A hardness is 50 or more and the durometer D hardness is 50 or less. If the hardness of the blend is less than 35 in durometer A hardness, it is too soft and molding is difficult, and if the durometer D hardness is 60 or more, the effect of brittleness modification tends to be lost. It is also preferable to add an interfacial adhesive such as an acid-modified polyolefin in order to improve the adhesive strength between the resin blend and the low melting point metal.
The metal powder (d) acts as a dispersing aid for the low melting point metal, and the proportion of the metal powder (d) in the metal component is preferably in the range of 10 to 30% by volume, preferably 15 to 25% by volume. . If the content is less than 10% by volume, the dispersion state becomes poor,
On the other hand, if it exceeds 30% by volume, the fluidity tends to decrease and the material tends to become brittle, and the conductivity tends to decrease.
【0008】混合材に用いられる(a)熱可塑性樹脂と
してはポリオレフィン系樹脂やABS樹脂、ポリエステ
ル樹脂、ポリカーボネート樹脂など種々の材料が使用で
き(b)熱可塑性エラストマーとしては、(a)熱可塑
性樹脂に相溶可能なものであれば良くオレフィン系、ス
チレン系、塩ビ系、ウレタン系、エステル系、アミド系
など種々のタイプのものが使用可能である。例えば、
(a)熱可塑性樹脂としてポリプロピレン(PP)を使
用した場合、(b)熱可塑性エラストマーはポリオレフ
ィン系エラストマーを用いるのが好適である。Various materials such as polyolefin resin, ABS resin, polyester resin, and polycarbonate resin can be used as the thermoplastic resin (a) used for the mixture material. (B) As the thermoplastic elastomer, (a) the thermoplastic resin Any type can be used as long as it is compatible with olefins, styrenes, PVCs, urethanes, esters and amides. For example,
When polypropylene (PP) is used as the thermoplastic resin (a), it is preferable to use a polyolefin-based elastomer as the thermoplastic elastomer (b).
【0009】(c)の融点が300℃以下の低融点金属
には各種のものが使用できる。融点の測定方法は示差走
査熱量測定法(DSC)に示差走査熱量測定法(DS
C)ににより測定すればよく、融点が300℃を越える
金属では成形性が劣るという問題がある。具体的にはP
b/Sn、Pb/Sn/Bi、Pb/Sn/Ag、 Pb
/Ag、Sn/Ag、 Sn/Bi、Sn/Cu、Sn/
Zn系から選ばれた低融点合金が好適に使用できる。
(d)成分の金属粉末は上記低融点金属の分散助剤とな
るものであり、Cu、Ni、Al、Cr及びそれらの合
金粉末が好適に使用でき、その平均粒径が1〜50μm
の範囲のものが好ましい。平均粒径は試料を透過型電子
顕微鏡により撮影し、写真から求めた数平均粒子径であ
る。平均粒径が1μm未満では混合の際のハンドリング
が困難であり、また50μmを越えるものでは分散性が
低下し易い傾向がある。Various metals can be used as the low melting point metal having a melting point of 300 ° C. or less in (c). The melting point can be measured by the differential scanning calorimetry (DSC).
The measurement may be performed according to C), and there is a problem that a metal having a melting point exceeding 300 ° C. has poor moldability. Specifically, P
b / Sn, Pb / Sn / Bi, Pb / Sn / Ag, Pb
/ Ag, Sn / Ag, Sn / Bi, Sn / Cu, Sn /
A low melting point alloy selected from Zn-based can be suitably used.
The metal powder of the component (d) serves as a dispersing aid for the low melting point metal, and Cu, Ni, Al, Cr and alloy powders thereof can be suitably used, and the average particle size is 1 to 50 μm.
Are preferred. The average particle diameter is a number average particle diameter obtained by photographing a sample with a transmission electron microscope and obtaining the photograph. When the average particle size is less than 1 μm, handling during mixing is difficult, and when the average particle size exceeds 50 μm, the dispersibility tends to decrease.
【0010】本発明の導電性樹脂成形品又はシートの製
造方法は、上記混合材の各成分を用い、混合したものを
所定の温度でニーダや二軸押出機等の混練機により混練
後、造粒したものを使用する方法が好ましい。混練にお
いては(c)低融点金属が半溶融状態となる温度が好ま
しく、マトリックスとなる樹脂ブレンド物の溶融温度に
応じて適切な金属組成を選択し、低融点金属と分散助剤
となる銅粉、ニッケル粉末等の添加比率を適宜選択する
必要がある。以上の方法で得られた造粒物は、使用目的
に対応する形状の金型を用いて射出成形法、トランスフ
ァー成形法、プレス成形法等の通常の成形法により賦形
し、成形品とすることができる。また、Tダイ押出成形
機等によりシート化も可能である。In the method for producing a conductive resin molded product or sheet of the present invention, the components of the above-mentioned mixed material are kneaded at a predetermined temperature by a kneader such as a kneader or a twin-screw extruder. A method using granules is preferred. In kneading, (c) a temperature at which the low-melting-point metal is in a semi-molten state is preferred, and an appropriate metal composition is selected according to the melting temperature of the resin blend serving as a matrix, and the low-melting-point metal and copper powder serving as a dispersing aid are selected. It is necessary to appropriately select the addition ratio of nickel powder and the like. The granulated product obtained by the above method is formed into a molded product by a normal molding method such as an injection molding method, a transfer molding method, and a press molding method using a mold having a shape corresponding to a purpose of use. be able to. Further, it can be formed into a sheet by a T-die extruder or the like.
【0011】以上述べたように、本発明の導電性成形品
又はシートは、熱可塑性樹脂と熱可塑性エラストマーの
ブレンド物に低融点金属が含有されていることから、極
めて高度の導電性を有する一方で、熱可塑性エラストマ
ーの柔軟性の為、脆弱にならず、成形性及び機械的強度
に優れており、導電性隔壁、導電性部材、帯電防止材、
電磁波シールド材、電極、コネクター、センサー、発熱
体等の幅広い分野への適用が可能である。As described above, the conductive molded article or sheet of the present invention has an extremely high conductivity because the blend of a thermoplastic resin and a thermoplastic elastomer contains a low melting point metal. In, because of the flexibility of the thermoplastic elastomer, does not become brittle, has excellent moldability and mechanical strength, conductive partition, conductive member, antistatic material,
It can be applied to a wide range of fields such as electromagnetic wave shielding materials, electrodes, connectors, sensors, and heating elements.
【0012】[0012]
【実施例】以下、実施例について説明するが、本発明は
これに限定されるものではない。 (実施例1)樹脂ブレンド物の熱可塑性樹脂としてPP
(MS640/トクヤマ)、熱可塑性エラストマーとし
てポリオレフィン系エラストマー(サントプレン201
−55/AESジャパン)を50:50で用いた。ブレ
ンド物の硬度はデューロメータD硬さで40となった。
また、界面接着改質剤として酸変成ポリオレフィン
(「アドテックスER320P」日本ポリオレフィン
(株)製)を用い、低融点金属として鉛フリーハンダ
(Sn−4Cu−2Ni 融点 固相線225℃−液相
線480℃)、金属粉末として平均粒径10μmの銅粉
を用いた。あらかじめ各原料粉末を物理混合し(樹脂ブ
レンド物40容量%、酸変成ポリオレフィン10容量
%、低融点金属45容量%、金属粉末5容量%)、2軸
押出機(「2D25−S」東洋精機(株)製)を用いて
溶融混練後、低融点金属含有樹脂ペレットを作成した。The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the present invention is limited thereto. (Example 1) PP as a thermoplastic resin of a resin blend
(MS640 / Tokuyama), a polyolefin-based elastomer (Santoprene 201) as a thermoplastic elastomer
-55 / AES Japan) was used at 50:50. The hardness of the blend was 40 in Durometer D hardness.
In addition, an acid-modified polyolefin ("Adtex ER320P" manufactured by Nippon Polyolefin Co., Ltd.) is used as an interfacial adhesion modifier, and a lead-free solder (Sn-4Cu-2Ni melting point solid-phase line 225 ° C.-liquidus line) is used as a low-melting metal. 480 ° C.), and copper powder having an average particle size of 10 μm was used as the metal powder. Each raw material powder is physically mixed in advance (resin blend 40% by volume, acid-modified polyolefin 10% by volume, low melting point metal 45% by volume, metal powder 5% by volume), twin screw extruder ("2D25-S" Toyo Seiki ( After melting and kneading using a resin, low-melting-point metal-containing resin pellets were prepared.
【0013】押出条件は以下の通りである。 シリンダー温度: 200℃ スクリュ回転数: 20r.p.m. その後、雌型と雄型とを対向させた射出成型用金型(1
10mm×75mm肉厚1mmの矩形状キャビティ)内
に上記の低融点金属含有樹脂ペレットを以下の条件で射
出成形を行った。 金型温度 : 40℃ シリンダー温度 : 200℃ スクリュ回転数 : 50r.p.m. 射出率 : 60cm3/秒 射出圧力 : 80Mpa 背圧 : 2Mpa 保圧時間 :40秒The extrusion conditions are as follows. Cylinder temperature: 200 ° C Screw rotation speed: 20r. p. m. Thereafter, the injection mold (1) in which the female mold and the male mold are opposed to each other.
The low-melting-point metal-containing resin pellets were injection-molded in a rectangular cavity having a size of 10 mm × 75 mm and a thickness of 1 mm) under the following conditions. Mold temperature: 40 ° C Cylinder temperature: 200 ° C Screw rotation speed: 50r. p. m. Injection rate: 60 cm 3 / sec Injection pressure: 80 Mpa Back pressure: 2 Mpa Holding time: 40 seconds
【0014】冷却後、脱型し目的とする成形品を得た。
得られた成形品の特性は以下の通りであった。 シャルピー衝撃値 :破壊せず 体積固有抵抗値 :4.14×10−4Ω・cm 衝撃試験はJIS K7111に準拠(シャルピ−フラ
ットワイズノッチなし試験片幅 10mm、支点間距離
20mm、試験速度 0.5mm/分)硬度はJIS
K7215に準拠After cooling, the mold was removed to obtain the desired molded product.
The characteristics of the obtained molded product were as follows. Charpy impact value: not destroyed Volume specific resistance value: 4.14 × 10 −4 Ω · cm The impact test conforms to JIS K7111 (Charpy-flat width notched test piece width 10 mm, distance between fulcrums 20 mm, test speed 0. 5mm / min) Hardness is JIS
Compliant with K7215
【0015】(比較例1)実施例1の樹脂ブレンド物に
替え、通常の熱可塑性樹脂であるPP単体(MS640
/トクヤマ)とした以外は実施例1と同一内容で成形品
を得、同様に得られた成形品を評価した。この成形品の
特性は以下の通りであった。 シャルピー衝撃値 :5.44kJ/m2 体積固有抵抗値 :5.04×10−4Ω・cmComparative Example 1 In place of the resin blend of Example 1, PP alone (MS640) which is a normal thermoplastic resin was used.
/ Tokuyama), and a molded article was obtained in the same manner as in Example 1, and the molded article similarly obtained was evaluated. The characteristics of this molded product were as follows. Charpy impact value: 5.44 kJ / m 2 Volume resistivity: 5.04 × 10 −4 Ω · cm
【0016】実施例1と比較例1を比較すると、本発明
の成形品である実施例1は、高い体積固有抵抗値を維持
しつつ、衝撃特性から明らかなように脆弱さを改善して
いることが分かる。Comparison between Example 1 and Comparative Example 1 shows that the molded product of Example 1 of the present invention has improved fragility while maintaining a high volume resistivity, as is apparent from the impact characteristics. You can see that.
【0017】(実施例2)樹脂ブレンド物の熱可塑性樹
脂としてPP(MS640/トクヤマ)、熱可塑性エラ
ストマーとしてポリオレフィン系エラストマー(サント
プレン201−55/AESジャパン)を50:50で
用いた。ブレンド物の硬度はデューロメータD硬さで4
0となった。また、界面接着改質剤として酸変成ポリオ
レフィン(「アドテックスER320P」日本ポリオレ
フィン(株)製)を用い、低融点金属として鉛フリーハ
ンダ(Sn−4Cu−2Ni 融点 固相線225℃−
液相線480℃)、金属粉末として平均粒径10μmの
銅粉を用いた。あらかじめ各原料粉末を物理混合し(樹
脂ブレンド物40容量%、酸変成ポリオレフィン10容
量%、低融点金属45容量%、金属粉末5容量%)、2
軸押出機(「2D25−S」東洋精機(株)製)を用い
て溶融混練後、低融点金属含有樹脂ペレットを作成し
た。押出条件は以下の通りである。 シリンダー温度: 200℃ スクリュ回転数: 40r.p.m. その後、Tダイ押出機により厚さ1mmのシート成形を
下記の条件で行った。 シリンダー温度 : 200℃ 口金温度 :200℃ スクリュ回転数 : 50r.p.m. 180度の折り曲げに対して破断しないシートが容易に
得られた。Example 2 PP (MS640 / Tokuyama) was used as the thermoplastic resin of the resin blend, and a polyolefin-based elastomer (Santoprene 201-55 / AES Japan) was used at 50:50 as the thermoplastic elastomer. The hardness of the blend is 4 in Durometer D hardness.
It became 0. In addition, an acid-modified polyolefin ("Adtex ER320P" manufactured by Nippon Polyolefin Co., Ltd.) is used as an interfacial adhesion modifier, and a lead-free solder (Sn-4Cu-2Ni melting point solidus 225 ° C.) is used as a low melting point metal.
(Liquidus line 480 ° C.), and copper powder having an average particle size of 10 μm was used as the metal powder. Physically mix each raw material powder in advance (resin blend 40% by volume, acid-modified polyolefin 10% by volume, low melting point metal 45% by volume, metal powder 5% by volume), 2
After melt-kneading using a screw extruder (“2D25-S” manufactured by Toyo Seiki Co., Ltd.), a low melting point metal-containing resin pellet was prepared. Extrusion conditions are as follows. Cylinder temperature: 200 ° C Screw rotation speed: 40r. p. m. Thereafter, a sheet having a thickness of 1 mm was formed by a T-die extruder under the following conditions. Cylinder temperature: 200 ° C Cap temperature: 200 ° C Screw rotation speed: 50r. p. m. A sheet that did not break when bent at 180 degrees was easily obtained.
【0018】(比較例2)実施例2の樹脂ブレンド物に
替え通常の熱可塑性樹脂であるPP(MS640/トク
ヤマ)とした以外は実施例2と同一内容で試作を行っ
た。Tダイ押出時の成形条件を種々変更したが、押出物
が脆弱でシート化不能であった。(Comparative Example 2) A trial production was performed in the same manner as in Example 2 except that PP (MS640 / Tokuyama), which is a normal thermoplastic resin, was used instead of the resin blend of Example 2. The molding conditions at the time of extruding the T-die were variously changed, but the extrudate was brittle and could not be formed into a sheet.
【0019】[0019]
【発明の効果】上述したように、本発明の導電性樹脂成
形品又はシートは、熱可塑性樹脂と熱可塑性エラストマ
ーブレンド物に低融点金属が含有されていることから、
極めて高度の導電性と、成形性及び機械的強度に優れて
おり、導電性隔壁、導電性部材、帯電防止材、電磁波シ
ールド材、電極、コネクター、センサー、発熱体などの
幅広い分野への適用が可能である。As described above, the conductive resin molded product or sheet of the present invention contains a low melting point metal in a thermoplastic resin / thermoplastic elastomer blend.
It has an extremely high level of conductivity, excellent moldability and mechanical strength, and can be applied to a wide range of fields such as conductive partitions, conductive members, antistatic materials, electromagnetic wave shielding materials, electrodes, connectors, sensors, and heating elements. It is possible.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F071 AA02 AA14 AB06 AB07 AB08 AB09 AB12 AD02 AD06 AE15 AF14 AF25Y AF26Y AF37 AH12 BC01 4J002 BB01W BB01X BB12W BC02X BD03X BN15W CF00W CF00X CG00W CK02X CL00X DA077 DA087 DA097 DA117 DC006 DC007 FD116 FD117 GQ00 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F071 AA02 AA14 AB06 AB07 AB08 AB09 AB12 AD02 AD06 AE15 AF14 AF25Y AF26Y AF37 AH12 BC01 4J002 BB01W BB01X BB12W BC02X BD03X BN15W CF00W CF00X CG00W CK02X117 DC00 DA 007
Claims (5)
ラストマーのブレンド物を基質とし、これに(c)融点
が300℃以下の低融点金属、及び(d)金属粉末を混
合してなる導電性樹脂成形品又はシート。1. A blend of (a) a thermoplastic resin and (b) a thermoplastic elastomer as a substrate, and (c) a low-melting metal having a melting point of 300 ° C. or less, and (d) a metal powder. Conductive resin molded product or sheet.
ラストマーのブレンド物が成形品又はシート全体の20
〜80容量%の範囲であるとともに、(c)及び(d)
を合わせた金属成分中の(d)金属粉末の割合が10〜
30容量%の範囲であることを特徴とする請求項1記載
の導電性樹脂成形品又はシート。2. A blend of (a) a thermoplastic resin and (b) a thermoplastic elastomer contains 20% of the entire molded article or sheet.
(C) and (d)
The ratio of the metal powder (d) in the metal component obtained by combining
The conductive resin molded product or sheet according to claim 1, wherein the content is in a range of 30% by volume.
ラストマーのブレンド物の硬度がデュロメータA硬さで
35以上、デュロメータD硬さ60以下の範囲であるこ
とを特徴とする請求項1乃至2記載の導電性樹脂成形品
又はシート。3. The hardness of a blend of (a) a thermoplastic resin and (b) a thermoplastic elastomer, wherein the durometer A hardness is 35 or more and the durometer D hardness is 60 or less. 3. The conductive resin molded product or sheet according to any one of claims 1 to 2.
n、Pb/Sn/Bi、Pb/Sn/Ag、 Pb/A
g、 Sn/Ag、 Sn/Bi、Sn/Cu、Sn/Zn
系から選ばれた低融点合金からなることを特徴とする請
求項1乃至3記載の導電性樹脂成形品又はシート。4. The low melting point metal of component (c) is Pb / S
n, Pb / Sn / Bi, Pb / Sn / Ag, Pb / A
g, Sn / Ag, Sn / Bi, Sn / Cu, Sn / Zn
The conductive resin molded article or sheet according to claim 1, wherein the conductive resin molded article or sheet is made of a low melting point alloy selected from a series.
l、Cr及びそれらの合金粉末からなり、その平均粒径
が1〜50μmの範囲であることを特徴とする請求項1
乃至4記載の導電性樹脂成形品又はシート。5. The metal powder of component (d) is Cu, Ni, A
2. The powder of claim 1, wherein said powder is made of l, Cr or an alloy powder thereof, and has an average particle diameter in the range of 1 to 50 μm.
5. A conductive resin molded product or sheet according to any one of items 4 to 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25107299A JP2001072775A (en) | 1999-09-06 | 1999-09-06 | Conductive resin molding or sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25107299A JP2001072775A (en) | 1999-09-06 | 1999-09-06 | Conductive resin molding or sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001072775A true JP2001072775A (en) | 2001-03-21 |
Family
ID=17217222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25107299A Pending JP2001072775A (en) | 1999-09-06 | 1999-09-06 | Conductive resin molding or sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001072775A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002117721A (en) * | 2000-10-12 | 2002-04-19 | Sintokogio Ltd | Conductive plastic |
WO2003029352A1 (en) * | 2001-09-27 | 2003-04-10 | Nippon Kagaku Yakin Co., Ltd. | Resin composition with high thermal conductivity and process for producing the same |
JP2007517928A (en) * | 2003-12-12 | 2007-07-05 | シーメンス アクチエンゲゼルシヤフト | Metal-plastic-hybrid and molded body produced from the hybrid |
CN107488441A (en) * | 2017-09-20 | 2017-12-19 | 天津沃尔提莫新材料技术股份有限公司 | A kind of liquid metal for conducting heat filler and preparation method |
-
1999
- 1999-09-06 JP JP25107299A patent/JP2001072775A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002117721A (en) * | 2000-10-12 | 2002-04-19 | Sintokogio Ltd | Conductive plastic |
WO2003029352A1 (en) * | 2001-09-27 | 2003-04-10 | Nippon Kagaku Yakin Co., Ltd. | Resin composition with high thermal conductivity and process for producing the same |
US6995205B2 (en) | 2001-09-27 | 2006-02-07 | Nippon Kagaku Yakin Co., Ltd. | Resin composition with high thermal conductivity and method of producing the same |
JP2007517928A (en) * | 2003-12-12 | 2007-07-05 | シーメンス アクチエンゲゼルシヤフト | Metal-plastic-hybrid and molded body produced from the hybrid |
CN107488441A (en) * | 2017-09-20 | 2017-12-19 | 天津沃尔提莫新材料技术股份有限公司 | A kind of liquid metal for conducting heat filler and preparation method |
CN107488441B (en) * | 2017-09-20 | 2022-03-22 | 深圳沃尔提莫电子材料有限公司 | Liquid metal heat-conducting filler and preparation method thereof |
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