JPH0322707B2 - - Google Patents

Info

Publication number
JPH0322707B2
JPH0322707B2 JP60081828A JP8182885A JPH0322707B2 JP H0322707 B2 JPH0322707 B2 JP H0322707B2 JP 60081828 A JP60081828 A JP 60081828A JP 8182885 A JP8182885 A JP 8182885A JP H0322707 B2 JPH0322707 B2 JP H0322707B2
Authority
JP
Japan
Prior art keywords
heat sink
thermal expansion
metal substrate
copper
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60081828A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61240666A (ja
Inventor
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP60081828A priority Critical patent/JPS61240666A/ja
Publication of JPS61240666A publication Critical patent/JPS61240666A/ja
Publication of JPH0322707B2 publication Critical patent/JPH0322707B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60081828A 1985-04-17 1985-04-17 半導体装置 Granted JPS61240666A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60081828A JPS61240666A (ja) 1985-04-17 1985-04-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60081828A JPS61240666A (ja) 1985-04-17 1985-04-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS61240666A JPS61240666A (ja) 1986-10-25
JPH0322707B2 true JPH0322707B2 (cs) 1991-03-27

Family

ID=13757332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60081828A Granted JPS61240666A (ja) 1985-04-17 1985-04-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS61240666A (cs)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
WO2004038897A1 (ja) 2002-10-28 2004-05-06 Toyota Jidosha Kabushiki Kaisha 発電電動装置
WO2004038896A1 (ja) 2002-10-28 2004-05-06 Toyota Jidosha Kabushiki Kaisha 発電電動装置
JP4239723B2 (ja) 2003-07-24 2009-03-18 トヨタ自動車株式会社 発電電動装置を備える駆動システムおよび発電電動装置の制御をコンピュータに実行させるためのプログラムを記録したコンピュータ読取り可能な記録媒体
CN101496165B (zh) * 2006-07-28 2011-01-19 京瓷株式会社 电子部件收容用封装件以及电子装置

Also Published As

Publication number Publication date
JPS61240666A (ja) 1986-10-25

Similar Documents

Publication Publication Date Title
KR102434878B1 (ko) 히트 싱크가 부착된 파워 모듈용 기판
US4283464A (en) Prefabricated composite metallic heat-transmitting plate unit
US10068829B2 (en) Power-module substrate unit and power module
US4996115A (en) Composite structure
US4482912A (en) Stacked structure having matrix-fibered composite layers and a metal layer
JP6776953B2 (ja) ヒートシンク付パワーモジュール用基板
US4687879A (en) Tiered thermoelectric unit and method of fabricating same
US4049469A (en) Film thermoelement
US3780795A (en) Multilayer heat sink
JP2860037B2 (ja) 半導体装置用放熱基板の製造方法
US3248681A (en) Contacts for semiconductor devices
US3261079A (en) Fabrication of thermoelectric apparatus
US5945732A (en) Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
JPS6337496B2 (cs)
JPH0322706B2 (cs)
JPH0322707B2 (cs)
JPH08316532A (ja) 冷却ユニット構造
JPH10144967A (ja) 冷却用熱電素子モジュール
JPWO2019167942A1 (ja) 絶縁回路基板
US3449173A (en) Thermoelectric couple with soft solder electrically connecting semi-conductors and method of making same
WO2019167931A1 (ja) 絶縁回路基板
US3262030A (en) Electrical semiconductor device
US5355281A (en) Electrical device having a bonded ceramic-copper heat transfer medium
US3814633A (en) Thermo-electric modular structure and method of making same
JPS6015937A (ja) 半導体支持電極用クラツド材

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term