JPH03227039A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPH03227039A
JPH03227039A JP2022642A JP2264290A JPH03227039A JP H03227039 A JPH03227039 A JP H03227039A JP 2022642 A JP2022642 A JP 2022642A JP 2264290 A JP2264290 A JP 2264290A JP H03227039 A JPH03227039 A JP H03227039A
Authority
JP
Japan
Prior art keywords
wiring
wiring layer
analog
digital signal
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022642A
Other languages
Japanese (ja)
Inventor
Toyokazu Kabayama
樺山 豊和
Masahiro Nakamura
雅博 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2022642A priority Critical patent/JPH03227039A/en
Publication of JPH03227039A publication Critical patent/JPH03227039A/en
Pending legal-status Critical Current

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  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To contrive a reduction in the manhour of a layout and avoidance of a reduction in speed due to a detour of wirings by a method wherein a region, where first wiring layers intersect with a second wiring layer, is included between the first wiring layers, through which analog signals pass, and the second wiring layer, through which a digital pass, and a block having a third wiring layer, which is connected to the GND, is previously signal-arranged. CONSTITUTION:In order to connector wirings in an automatic layout between terminals, by which the wirings are connected to one another, at the shortest distance, analog signals inputted through analog input terminals A1, A2, A3 and A4 of a custom microcomputer 17 pass through analog signal wirings 1, 2, 3 and 4 and are inputted in a cell S2 by analog signal wirings 5, 6, 7 and 8 via a first wiring layers 11, 12, 13 and 14 of a block B1. A digital signal outputted from a port S1 passes through a digital signal wiring 9 and is inputted in a CPU by a digital signal wiring 10 via a second wiring layer 15 isolated from the layers 11, 12, 13 and 14 by a third wiring layer 16 which is connected to the GND. Thereby, it becomes possible to lay out the digital signal wirings and the analog signal wirings at the shortest distance on a mask pattern.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体集積回路に関し、特に自動レイアウト
法により設計されたアナログ信号配線とデジタル信号配
線を混在して有する半導体集積回路に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit, and more particularly to a semiconductor integrated circuit having a mixture of analog signal wiring and digital signal wiring designed by an automatic layout method.

〔従来の技術〕[Conventional technology]

スタンダードセル方式カスタムLSIの中でも特に、C
PUコア方式と呼ばれるカスタムLSIは、CPU、R
OM、RAM、I/Oポート、シリアルエ/○、タイマ
等のLSI製造メーカが用意した大規模セルを組み合わ
せることにより、ユーザは自分にあったマイクロコンピ
ュータを自由に構成できる(このようなマイクロコンピ
ュータを以下、カスタムマイコンと呼ぶ)。
Among standard cell type custom LSIs, C
A custom LSI called the PU core method uses CPU, R
Users can freely configure a microcomputer that suits them by combining large-scale cells prepared by LSI manufacturers such as OM, RAM, I/O ports, serial processors, timers, etc. (hereinafter referred to as a custom microcontroller).

第3図及び第4図はアナログ信号とデジタル信号が混在
する従来のカスタムマイコンの例を示すマスクレイアウ
ト図である。
3 and 4 are mask layout diagrams showing an example of a conventional custom microcomputer in which analog signals and digital signals coexist.

第3図及び第4図に示すように、32は前記したカスタ
ムマイコンで、A5.A6.A7.A8はカスタムマイ
コンのアナログ信号の入力端子、S5はアナログ信号が
入力される大規模セルであり、大規模セルS5と入力端
子Al、A2゜A3.A4とを結ぶ27,28,29.
30はアナログ信号配線である。また、S4はI/Oポ
ートの大規模セル、S6はCPUの大規模セルで、I/
OポートとCPUを結ぶ31はアドレスバス、データバ
ス、リード信号、ライト信号、システムクロック等のデ
ジタル信号配線で、簡略して1本で示しである。
As shown in FIGS. 3 and 4, 32 is the custom microcomputer described above, and A5. A6. A7. A8 is an input terminal for analog signals of the custom microcomputer, and S5 is a large-scale cell into which analog signals are input.The large-scale cell S5 and input terminals Al, A2, A3, . 27, 28, 29 which connects A4.
30 is an analog signal wiring. In addition, S4 is a large-scale cell of the I/O port, and S6 is a large-scale cell of the CPU.
Reference numeral 31 connecting the O port and the CPU is a digital signal wiring for an address bus, a data bus, a read signal, a write signal, a system clock, etc., and is simply shown as one wire.

アナログ信号とデジタル信号が混在する回路において、
アナログ信号配線とデジタル信号配線が交差すると、ア
ナログ信号はデジタル信号の影響を受けてアナログ信号
にノイズが発生する。そのため従来、カスタムマイコン
の自動レイアウトにおいて、アナログ信号とデジタル信
号が混在し、第3図のように大規模セルが配置された場
合、カスタムマイコンの大規模セルは予め用意されたセ
ルであるからセルの端子の位置は決まっているため、且
つ、自動レイアウトは一般的に接続する端子間を最短で
配線するため、アナログ信号配線とデジタル信号配線と
が交差しないように、アナログ信号配線と交差する可能
性のあるデジタル信号配線を予め人手で配線しておいた
り、または自動配線後、アナログ信号配線と交差したデ
ジタル信号配線を人手により修正していた。例えば、第
3図において、S4と86を接続するデジタル信号配線
31を第4図に示すデジタル信号配線33のように、予
め人手により迂回して配線していた。
In circuits where analog and digital signals coexist,
When analog signal wiring and digital signal wiring intersect, the analog signal is influenced by the digital signal and noise is generated in the analog signal. Therefore, in the conventional automatic layout of a custom microcontroller, when analog signals and digital signals are mixed and large cells are arranged as shown in Figure 3, the large cells of the custom microcontroller are pre-prepared cells. Since the positions of the terminals are fixed, and automatic layout generally routes the wiring between the connected terminals in the shortest possible time, it is possible to avoid crossing the analog signal wiring and digital signal wiring so that they do not intersect with the analog signal wiring. In some cases, the digital signal wiring that has the same characteristics as the analog signal wiring is manually routed in advance, or after automatic wiring, the digital signal wiring that intersects with the analog signal wiring is manually corrected. For example, in FIG. 3, the digital signal wiring 31 connecting S4 and 86 was previously manually routed around the digital signal wiring 33 shown in FIG.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の半導体集積回路は、自動レイアウトによ
る設計では、デジタル信号配線とアナログ信号配線が交
差してレイアウトされる可能性があった。即ち、自動レ
イアウトは一般的に接続する端子間を最短で配線するよ
うなアルゴリズムであり、且つカスタムマイコンの大規
模セルは予め用意されたセルであるため、大規模セルを
配置後、そのまま自動レイアウトを行った場合、アナロ
グ信号配線とデジタル信号配線が交差する確率はかなり
高いものとなる。
When designing the conventional semiconductor integrated circuit described above using automatic layout, there is a possibility that the digital signal wiring and the analog signal wiring may be laid out in such a manner that they intersect. In other words, automatic layout is generally an algorithm that wires the connected terminals in the shortest possible time, and since the large-scale cell of a custom microcontroller is a pre-prepared cell, automatic layout can be performed directly after placing the large-scale cell. If this is done, the probability that analog signal wiring and digital signal wiring will intersect is quite high.

従って、アナログ信号配線と交差する可能性のあるデジ
タル信号配線を予め人手で配線しておいたり、または自
動配線後、アナログ信号配線と交差したデジタル信号配
線を人手により修正していたが、人手で修正することに
よるミスが起こり易く、また信号配線を迂回することに
より、チップサイズの増大や、迂回した配線が長くなる
ことによりスピードが低下する問題があった。
Therefore, digital signal wiring that may intersect with analog signal wiring was manually routed in advance, or after automatic wiring, digital signal wiring that intersected with analog signal wiring was manually corrected. Mistakes are likely to occur due to corrections, and detouring the signal wiring increases the chip size, and the detoured wiring becomes longer, resulting in a reduction in speed.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の半導体集積回路は、アナログ信号が通る第1の
配線層と、デジタル信号が通る第2の配線層、第1の配
線層と第2の配線層の間に第1の配線層と第2の配線層
の交差する領域を含みGNDに接続される第3の配線層
を有するブロックを予めアナログ信号配線とデジタル信
号配線が交差するところに配置している。
The semiconductor integrated circuit of the present invention includes a first wiring layer through which an analog signal passes, a second wiring layer through which a digital signal passes, and a first wiring layer and a second wiring layer between the first wiring layer and the second wiring layer. A block including a region where the two wiring layers intersect and has a third wiring layer connected to GND is placed in advance at the intersection of the analog signal wiring and the digital signal wiring.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は、本発明の一実施例を示すマスクレイアウト図
である。
FIG. 1 is a mask layout diagram showing one embodiment of the present invention.

第1図に示すように、Sl、S2.S3は大規模セルあ
る。Slはボートであり、アドレスバス、データバス、
リード信号、ライト信号、システムクロック等のデジタ
ル信号により、ブロックB1を介してCPU、S3と接
続されている。なお、実際レイアウトを行う場合、ボー
ト、SlとCPU、S3とを結ぶ前記デジタル信号は複
数本であるが、第1図では前記アドレスバス、データバ
ス、リード信号、ライト信号、システムクロック等のデ
ジタル信号配線を簡略して1本とし、9および10とし
て示す。S2はアナログ信号が入力されるブロック、A
I、A2.A3.A4は半導体集積回路のアナログ信号
を入力する入力端子で、入力されたアナログ信号はブロ
ックB1を介しS2に接続される。
As shown in FIG. 1, Sl, S2. S3 has a large cell. Sl is a boat, which has an address bus, a data bus,
It is connected to the CPU and S3 via block B1 using digital signals such as read signals, write signals, and system clocks. Note that in actual layout, there are multiple digital signals that connect the board, Sl, and CPU, S3, but in FIG. The signal wiring is simplified to one, and is shown as 9 and 10. S2 is a block to which an analog signal is input, A
I, A2. A3. A4 is an input terminal for inputting an analog signal of the semiconductor integrated circuit, and the input analog signal is connected to S2 via block B1.

第2図は、第1図のブロックB1のマスクレイアウト図
を示す。
FIG. 2 shows a mask layout diagram of block B1 in FIG.

第2図に示すように、11.12,13.14はアナロ
グ信号が通る第一の配線層、15はデジタル信号が通る
第2の配線層で、実際にはSlと83を結ぶデジタル信
号と同じ本数だけ存在する。また、16は第1の配線層
11,12,13,14と第2の配線層15との間存在
するGNDに接続される第3の配線層であり、第1の配
線層と第2の配線層の交差する領域を含んでいる。
As shown in Figure 2, 11, 12 and 13, 14 are the first wiring layer through which analog signals pass, and 15 is the second wiring layer through which digital signals pass, and in reality, the digital signals connect Sl and 83. The same number exists. Further, 16 is a third wiring layer connected to GND existing between the first wiring layers 11, 12, 13, 14 and the second wiring layer 15, Includes areas where wiring layers intersect.

第1図のように大規模セルが配置された場合、自動レイ
アウトにおける配線は接続する端子間を最短で接続する
ため、カスタムマイコン17のアナログ入力端子Al、
A2.A3.A4から入力されたアナログ信号はアナロ
グ信号配線1,23.4を通り、第2図のブロックB1
の第1の配線層11,12.13.14を介し、アナロ
グ信号配線5,6,7.8でセルS2に入力される。
When large-scale cells are arranged as shown in Fig. 1, the wiring in the automatic layout connects the connected terminals in the shortest possible time, so the analog input terminal Al of the custom microcontroller 17,
A2. A3. The analog signal input from A4 passes through analog signal wiring 1, 23.4 and is sent to block B1 in Figure 2.
The signals are input to the cell S2 via the first wiring layers 11, 12, 13, and 14 of the analog signal wirings 5, 6, 7.8.

またボートS1より出力されたデジタル信号は、第1図
のデジタル信号配線9を通り、第2図に示す、GNDに
接続される第3の配線層16によって第1の配線層11
,12.13.14と分離された、第2の配線層15を
介し、デジタル信号配線10でCPUに入力されること
になる。
Further, the digital signal output from the boat S1 passes through the digital signal wiring 9 shown in FIG.
, 12, 13, and 14, and are inputted to the CPU via the digital signal wiring 10 via the second wiring layer 15.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、アナログ信号が通る第1
の配線層、デジタル信号が通る第2の配線層、及び第1
の配線層と第2の配線層の間に第1の配線層と第2の配
線層の交差する領域を含みGNDに接続される第3の配
線層を有するブロックを、予めアナログ信号とデジタル
信号とが交差するところに配置して、自動レイアウトを
行うことにより、デジタル信号配線及びアナログ信号配
線を最短でマスクパタンレイアウトすることが可能とな
り、しかも人手による自動レイアウト後のマスクパタン
レイアウトデータの修正の必要がなくなるので、レイア
ウト工数の削減、半導体集積回路のチップサイズの縮小
、および配線が迂回することによるスピードの低下を回
避できるという効果がある。
As explained above, the present invention provides the first
wiring layer, a second wiring layer through which digital signals pass, and a first wiring layer.
A block having a third wiring layer connected to GND and including an area where the first wiring layer and the second wiring layer intersect between the wiring layer and the second wiring layer is preliminarily connected to analog and digital signals. By placing them where they intersect and performing automatic layout, it is possible to lay out the mask pattern of digital signal wiring and analog signal wiring in the shortest possible time, and it is also possible to manually correct the mask pattern layout data after automatic layout. Since this is no longer necessary, it is possible to reduce the number of layout steps, reduce the chip size of the semiconductor integrated circuit, and avoid a reduction in speed due to wiring detours.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示すマスクレイアウト図、
第2図は第1図のブロックB1のマスクレイアウト図、
第3図及び第4図は従来の半導体集積回路の一例を示す
マスクレイアウト図である。 1.2,3,4,5,6,7.8・・・アナログ信号配
線、9,10・・・デジタル信号配線、11゜12.1
3.14・・・第1の配線層、15・・・第2の配線層
、16・・・第3の配線層、17・・・カスタムマイコ
ン、27,28,29.30・・・アナログ信号配線、
31.33・・・デジタル信号配線、32・・・カスタ
ムマイコン、Al、A2.A3.A4゜A5.A6.A
7.A8・・・アナログ入力端子、Sl、S2.S3・
・・大規模セル。
FIG. 1 is a mask layout diagram showing an embodiment of the present invention;
FIG. 2 is a mask layout diagram of block B1 in FIG.
3 and 4 are mask layout diagrams showing an example of a conventional semiconductor integrated circuit. 1.2, 3, 4, 5, 6, 7.8...Analog signal wiring, 9,10...Digital signal wiring, 11°12.1
3.14... First wiring layer, 15... Second wiring layer, 16... Third wiring layer, 17... Custom microcomputer, 27, 28, 29. 30... Analog signal wiring,
31.33...Digital signal wiring, 32...Custom microcomputer, Al, A2. A3. A4゜A5. A6. A
7. A8...Analog input terminal, Sl, S2. S3・
...Large scale cell.

Claims (1)

【特許請求の範囲】[Claims] 予め用意されたCPU、I/Oポート、ROM、RAM
、タイマ等の大規模セルの相互の接続情報を基に自動レ
イアウト手法を用いて設計されたアナログ信号配線とデ
ジタル信号配線とを混在して有する半導体集積回路にお
いて、アナログ信号が通る第1の配線層と、デジタル信
号が通る第2の配線層と、前記第1の配線層と前記第2
の配線層の間に設けて前記第1の配線層と前記第2の配
線層の交差する領域を含みGNDに接続される第3の配
線層とを有することを特徴とする半導体集積回路。
Pre-prepared CPU, I/O port, ROM, RAM
In a semiconductor integrated circuit having a mixture of analog signal wiring and digital signal wiring designed using an automatic layout method based on mutual connection information of large-scale cells such as timers, the first wiring through which analog signals pass. a second wiring layer through which digital signals pass, the first wiring layer and the second wiring layer;
A semiconductor integrated circuit comprising: a third wiring layer provided between the wiring layers, including a region where the first wiring layer and the second wiring layer intersect, and connected to GND.
JP2022642A 1990-01-31 1990-01-31 Semiconductor integrated circuit Pending JPH03227039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022642A JPH03227039A (en) 1990-01-31 1990-01-31 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022642A JPH03227039A (en) 1990-01-31 1990-01-31 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPH03227039A true JPH03227039A (en) 1991-10-08

Family

ID=12088502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022642A Pending JPH03227039A (en) 1990-01-31 1990-01-31 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPH03227039A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037171A (en) * 2001-07-23 2003-02-07 Niigata Seimitsu Kk Semiconductor integrated circuit
DE102010006140A1 (en) 2009-02-03 2011-04-07 Ngk Insulators, Ltd., Nagoya Process for producing a honeycomb structure
US8679997B2 (en) 2010-03-30 2014-03-25 Ngk Insulators, Ltd. Ceramic clay, ceramic formed article, and ceramic structure, and manufacturing methods thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037171A (en) * 2001-07-23 2003-02-07 Niigata Seimitsu Kk Semiconductor integrated circuit
DE102010006140A1 (en) 2009-02-03 2011-04-07 Ngk Insulators, Ltd., Nagoya Process for producing a honeycomb structure
US8679997B2 (en) 2010-03-30 2014-03-25 Ngk Insulators, Ltd. Ceramic clay, ceramic formed article, and ceramic structure, and manufacturing methods thereof

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