JPH03226579A - Atmospheric cvd device - Google Patents
Atmospheric cvd deviceInfo
- Publication number
- JPH03226579A JPH03226579A JP2348090A JP2348090A JPH03226579A JP H03226579 A JPH03226579 A JP H03226579A JP 2348090 A JP2348090 A JP 2348090A JP 2348090 A JP2348090 A JP 2348090A JP H03226579 A JPH03226579 A JP H03226579A
- Authority
- JP
- Japan
- Prior art keywords
- reaction chamber
- detector
- particles
- gas
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims abstract description 21
- 238000006243 chemical reaction Methods 0.000 claims abstract description 19
- 239000000428 dust Substances 0.000 claims abstract description 7
- 230000007423 decrease Effects 0.000 abstract description 5
- 238000012544 monitoring process Methods 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 9
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 5
- 239000012495 reaction gas Substances 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は常圧CVD装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an atmospheric pressure CVD apparatus.
従来、この種の常圧CVD装置は、気相中の反応を抑え
るために、赤外線ランプあるいは高周波コイル等により
ウェーハを載置するサセプタを介して加熱し、5i)(
4(シラン)系ガスを導入し、Si系薄膜を形成する装
置である。また通常、この常圧CVD装置は、図面には
示さないが、ガスを導入して化学反応をもたらす反応室
と、反応ガスをこの反応室に導入する供給管と、反応し
たガスを排気する排気管と、ウェーハを載置するトレー
及びトレーホルダと、排気能力を監視するガス排気圧力
計゛とを有していた。Conventionally, this type of atmospheric pressure CVD apparatus heats the wafer through a susceptor on which it is placed using an infrared lamp or high-frequency coil in order to suppress reactions in the gas phase.
This is an apparatus that introduces 4 (silane)-based gas to form a Si-based thin film. Although not shown in the drawings, normal pressure CVD equipment usually includes a reaction chamber for introducing gas to cause a chemical reaction, a supply pipe for introducing the reaction gas into the reaction chamber, and an exhaust pipe for exhausting the reacted gas. It had a tube, a tray and tray holder for placing wafers, and a gas exhaust pressure gauge for monitoring exhaust capacity.
上述した従来の常圧CVD装置は、前述のようにガス排
気圧力計゛を有しているが、主として5iH4(シラン
)′系ガスを用いるこの種の装置は、反応生成物として
多量の粉末状のS i 02浮遊塵(以下パーティクル
と云う)が発生し、排気管内壁に付着する。その結果、
排気圧力計指示値は正常値を示しているにもかかわらず
排気管断面積1ま減少することによって、排気流量が減
少する。このなめ反応室外へ流出するパーティクルが増
加し、反応室より出るウェーハにパーティクル付着し、
歩留が大幅に低下させるという欠点がある。The above-mentioned conventional atmospheric CVD apparatus has a gas exhaust pressure gauge as mentioned above, but this type of apparatus, which mainly uses 5iH4 (silane)'-based gas, produces a large amount of powder as a reaction product. S i 02 floating dust (hereinafter referred to as particles) is generated and adheres to the inner wall of the exhaust pipe. the result,
Even though the exhaust pressure gauge indicates a normal value, the cross-sectional area of the exhaust pipe decreases by 1, causing the exhaust flow rate to decrease. This licking increases the number of particles flowing out of the reaction chamber, and the particles adhere to the wafer exiting the reaction chamber.
There is a drawback that the yield is significantly reduced.
本発明の目的は、かかる欠点を解消する常圧CVD装置
を提供することである。An object of the present invention is to provide an atmospheric pressure CVD apparatus that eliminates such drawbacks.
本発明の常圧CVD装置は、反応室の外周囲に近接して
配置された吸気管と、この吸気管に接続されるとともに
吸気する排気ガス中の浮遊塵の数を計数する検出器とを
備え、この検出器により計数された浮遊塵数が規定値よ
り越えたら、警報を発することを特徴としている。The atmospheric pressure CVD apparatus of the present invention includes an intake pipe disposed close to the outer periphery of a reaction chamber, and a detector connected to the intake pipe and counting the number of floating dust in the intake exhaust gas. If the number of floating particles counted by this detector exceeds a specified value, an alarm will be issued.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図及び第2図は本発明の一実施例を示す常圧CVD
装置の部分破断正面図及び側面図である。この常圧CV
D装置は、第1図及び第2図に示すように、反応室1の
外側に近接して配置されるとともに反応室1より流出す
るパーティクルを吸い取る吸気管4と、この吸気管4で
吸い取られたパーティクルを検知し、計数する検出器5
と、吸気管4と配管で接続されるとともに流出するガス
を排気するポンプ11とを設けたことである。FIG. 1 and FIG. 2 show an embodiment of the present invention using normal pressure CVD.
FIG. 3 is a partially cutaway front view and a side view of the device. This normal pressure CV
As shown in FIGS. 1 and 2, the device D includes an intake pipe 4 that is disposed close to the outside of the reaction chamber 1 and sucks up particles flowing out from the reaction chamber 1, and Detector 5 that detects and counts particles
In addition, a pump 11 is provided which is connected to the intake pipe 4 through piping and which exhausts outflowing gas.
それ以外は、従来と同じである。Other than that, it is the same as before.
次に、この常圧CVD装置の動作を説明する。Next, the operation of this normal pressure CVD apparatus will be explained.
まず、トレーホルダ6で支持されているトレー10にウ
ェーハ2を乗せ、ウェーハ2を反応室1に入れる。次に
、反応ガスを供給管9より反応室に1に導入する。この
ことにより、反応ガスの化学反応によりウェーハ9面に
気相成長が開始する。このとき、反応したガスは排気管
3で排出される。また、反応室1より流出する反応ガス
は、ダクト8より清浄な空気を吹き出し、流出した反応
ガスを希釈する。一方、吸気管は、反応室1の近くで、
ウェーハ入り口部に辺部に設置されているので、吸気さ
れた雰囲気中のパーティクルは、検出器5によりカウン
トされる。まな、排気圧力計7は、除であるが、使用時
間の経過に伴い上昇する。First, the wafer 2 is placed on the tray 10 supported by the tray holder 6, and the wafer 2 is placed in the reaction chamber 1. Next, a reaction gas is introduced into the reaction chamber 1 through the supply pipe 9. As a result, vapor phase growth starts on the surface of the wafer 9 due to a chemical reaction of the reaction gas. At this time, the reacted gas is exhausted through the exhaust pipe 3. Further, the reaction gas flowing out from the reaction chamber 1 is blown out from the duct 8 to dilute the reaction gas flowing out. On the other hand, the intake pipe is near the reaction chamber 1,
Since the detector 5 is installed at the side of the wafer entrance, particles in the inhaled atmosphere are counted by the detector 5. However, the exhaust pressure gauge 7 increases as the usage time progresses.
第3図は検出器を含むパーティクル検出回路の動作を説
明するためのブロック図である。次に、吸気管4により
吸引されたパーティクルは、検出器5により計数される
。FIG. 3 is a block diagram for explaining the operation of a particle detection circuit including a detector. Next, the particles sucked in by the intake pipe 4 are counted by the detector 5.
次に、この計数信号は、第3図に点線で示すように、コ
ントローラ12へ送られる。このコントローラ12には
、あらかじめパーティクルカウント数の上限値は、設定
器13により設定され、上限値信号が、点線で示すよう
に、コントローラ5へ送られ、パーティクル計数信号と
の比較を行う0次に、排気圧計の上昇にともないこの上
限値を越えたパーティクル数がカウントされた場合、コ
ントローラ12から信号が警報器14へ送られ、警報を
発するとともに反応ガスの供給を断とする。装置を停止
した後、排気管3にたい積したパーティクルを取除き、
装置の稼働を再開する。This count signal is then sent to the controller 12, as shown by the dotted line in FIG. In this controller 12, the upper limit value of the particle count number is set in advance by the setting device 13, and the upper limit value signal is sent to the controller 5 as shown by the dotted line, and is compared with the particle count signal of zero order. When the number of particles exceeding this upper limit is counted as the exhaust pressure gauge increases, a signal is sent from the controller 12 to the alarm 14, which issues an alarm and cuts off the supply of the reactant gas. After stopping the device, remove the particles accumulated in the exhaust pipe 3,
Restart the device.
以上説明したように本発明の常圧CVD装置は、反応室
より流出する浮遊塵を監視する手段を設けることにより
、ガス排気能力低下に伴うパーティクル発生を即時に検
知し、ウェーハのパーティクル付着を最小限に抑えるこ
とができ、歩留低下を防止するという効果がある。As explained above, the atmospheric pressure CVD apparatus of the present invention is equipped with a means for monitoring floating dust flowing out from the reaction chamber, so that particle generation due to a decrease in gas exhaust capacity can be immediately detected, and particle adhesion on wafers can be minimized. This has the effect of preventing a decrease in yield.
第1図及び第2図は本発明の一実施例を示す常圧CVD
装置の部分破断正面図及び部分破断側面図、第3図は検
出器を含むパーティクル検出回路のブロック図である。
1・・・反応室、2・・・ウェーハ、3・・・排気管、
4・・・吸気管、5・・・検出器、6・・・トレーホル
ダ、7・・・排気圧計、8・・・ダクト、9・・・供給
管、10・・・トレー 11・・・ポンプ、12・・・
コントローラ、13・・・設定器、14・・・警報器。FIG. 1 and FIG. 2 show an embodiment of the present invention using normal pressure CVD.
FIG. 3 is a partially cutaway front view and a partially cutaway side view of the device, and is a block diagram of a particle detection circuit including a detector. 1... Reaction chamber, 2... Wafer, 3... Exhaust pipe,
4... Intake pipe, 5... Detector, 6... Tray holder, 7... Exhaust pressure gauge, 8... Duct, 9... Supply pipe, 10... Tray 11... Pump, 12...
Controller, 13...setting device, 14...alarm device.
Claims (1)
気管に接続されるとともに吸気する排気ガス中の浮遊塵
の数を計数する検出器とを備え、この検出器により計数
された浮遊塵数が規定値より越えたら、警報を発するこ
とを特徴とする常圧CVD装置。The reactor is equipped with an intake pipe placed close to the outside of the reaction chamber, and a detector connected to the intake pipe that counts the number of suspended dust in the exhaust gas being taken in. A normal pressure CVD device that is characterized by issuing an alarm when the number of suspended particles exceeds a specified value.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2348090A JPH03226579A (en) | 1990-01-31 | 1990-01-31 | Atmospheric cvd device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2348090A JPH03226579A (en) | 1990-01-31 | 1990-01-31 | Atmospheric cvd device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03226579A true JPH03226579A (en) | 1991-10-07 |
Family
ID=12111693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2348090A Pending JPH03226579A (en) | 1990-01-31 | 1990-01-31 | Atmospheric cvd device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03226579A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6060329A (en) * | 1997-03-27 | 2000-05-09 | Fujitsu Limited | Method for plasma treatment and apparatus for plasma treatment |
-
1990
- 1990-01-31 JP JP2348090A patent/JPH03226579A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6060329A (en) * | 1997-03-27 | 2000-05-09 | Fujitsu Limited | Method for plasma treatment and apparatus for plasma treatment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0299458B1 (en) | Apparatus for treatment of a process gas | |
JP3298785B2 (en) | Semiconductor manufacturing apparatus and dust generation evaluation method | |
US20050161158A1 (en) | Exhaust conditioning system for semiconductor reactor | |
JP2003158080A (en) | Semiconductor manufacturing device, deposit removing method therein and manufacturing method for semiconductor device | |
JPS577715A (en) | Controller for air conditioning of automobile | |
TWI470109B (en) | Method of treating a gas stream | |
IE811017L (en) | Chemical vapor deposition of films on silicon wafers | |
JP2013089689A5 (en) | ||
JPH03226579A (en) | Atmospheric cvd device | |
JPS61265815A (en) | Semiconductor manufacturing apparatus | |
JP3068559B2 (en) | Atmospheric pressure chemical vapor deposition equipment | |
JP3919490B2 (en) | Vacuum exhaust system | |
CN217077787U (en) | Air pressure control system of sub-atmospheric pressure chemical vapor deposition equipment | |
JP2584088B2 (en) | Film deposition equipment | |
JPH05326417A (en) | Apparatus for forming cvd thin film | |
US11738299B2 (en) | Exhaust gas processing system including adsorbent for suppressing powder-like byproduct | |
JPH10204642A (en) | Evacuation treating device | |
US20220223442A1 (en) | Semiconductor manufacturing apparatus and control method thereof | |
TW438958B (en) | Furnace boat-push device | |
JP3020535B2 (en) | Organic matter removal equipment | |
JPH07198556A (en) | Fine particle measuring instrument | |
KR20000051830A (en) | Powder trap device of semiconductor equipment | |
JPH0626460A (en) | Exhaust vacuum pump for vacuum manufacturing device | |
JP2000219971A (en) | Fixed orifice, and discharge system using it | |
JP2513352B2 (en) | Oil rotary pump |