JPH03226388A - Laser beam marking method - Google Patents

Laser beam marking method

Info

Publication number
JPH03226388A
JPH03226388A JP2022623A JP2262390A JPH03226388A JP H03226388 A JPH03226388 A JP H03226388A JP 2022623 A JP2022623 A JP 2022623A JP 2262390 A JP2262390 A JP 2262390A JP H03226388 A JPH03226388 A JP H03226388A
Authority
JP
Japan
Prior art keywords
marking
laser beam
laser
lines
straight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022623A
Other languages
Japanese (ja)
Inventor
Toshisada Takahashi
高橋 利定
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2022623A priority Critical patent/JPH03226388A/en
Publication of JPH03226388A publication Critical patent/JPH03226388A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To prevent double irradiation and to uniformize marking by specifying laser beam marking of an intersection and its circumferential part when two straight or curved lines configuring a marking pattern intersect each other at an acute angle. CONSTITUTION:When two straight or curved lines configuring a laser beam marking pattern intersect each other at an acute angle, the spot interval and the marking speed between a place where the interval between the central lines of the lines A, B having line width W each makes a half the line width and an intersection 0 are made twice the value in the area except this area, thereby, the density of laser beam spots can be uniformized to obtain a uniform laser beam marking.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザ光を2つのガルバノメータ型オプティカ
ルスキャナに取り付けられたばラーにより反射させて、
2次元のパターンをマーキングする方法に関し、特に直
線9円9円弧からなるパターンの交点において、これら
のラインが鋭角を形成している場合に、レーザ光とガル
バノメータ型オプティカルスキャナのソフトウェアによ
る制御方法に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention reflects a laser beam by a roller attached to two galvanometer type optical scanners.
This invention relates to a method for marking a two-dimensional pattern, and in particular to a method for controlling a laser beam and a galvanometer-type optical scanner using software when the lines form an acute angle at the intersection of a pattern consisting of nine straight lines and nine circular arcs.

〔従来の技術〕[Conventional technology]

従来、2次元のパターンをレーザマーキングするトキ、
パターンの交点においては、これらの点を通る各ライン
(直線1円または円弧)をマーキングするとき、これら
の点の周囲では、1本のライン以外については、ライン
上を交点から線幅分だけ離れた点からレーザマーキング
しはじめていた。そのため各ラインの交わる角度が小さ
いときには、ある部分は2重に照射されてしまう。
Conventionally, Toki, which laser marks two-dimensional patterns,
At the intersection points of the pattern, when marking each line (straight circle or arc) that passes through these points, around these points, for all but one line, mark the line width away from the intersection point. Laser marking started from this point. Therefore, if the angle at which each line intersects is small, a certain part will be doubly irradiated.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のレーザマーキング方法によるとパターン
の交点において、これらの点を形成する各ラインが鋭角
をなして交わるか接続している場合には、2重に照射さ
れる部分を生じて、十分?均一なマーキング状態を得る
ことができないで、2重に照射された部分は他の部分よ
りも深く加工されてしまうという欠点がある。
According to the conventional laser marking method described above, if the lines forming these points intersect or connect at acute angles at the intersections of the patterns, double irradiation occurs, resulting in insufficient laser marking. This method has the disadvantage that it is not possible to obtain a uniform marking state, and the doubly irradiated area is machined more deeply than other areas.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のレーザマーキング方法では、直線、Pまたは円
弧やその他の曲線から構成されるパターンの交点及びそ
の近傍に関して、以下の方法でL−ザマーキングを行う
。第1図に示されている(は、線幅Wの2本の直線Aと
Bが点0で交わっ1いるケースである。図示の如く、直
線Aの中心層をX軸とし、点0を通りX軸に垂直にy軸
を定にると、直線への1つのエツジと、直線Bの中心層
の交点Iを通るy軸に平行な直線りとy軸の間プ領域C
では、2本の直線A、Bが大きくオーパラ、プしている
。そこでこの領域外のバイトサイ2(直線を形造るレー
ザのスポットの中心間隔)をb1?  この領域内のバ
イトサイズをb2とするきき、bz=2bIとして、レ
ーザのスポットの重席を変化させる。但し加工性を変え
ないために、レーザ周波数は領域内外で同一とする。こ
うすることによシ、2本の直線内の全領域でレーザのス
ポットの密度は、はぼ−様となり、均一なレーザマーキ
ングが可能となる。
In the laser marking method of the present invention, L-za marking is performed in the following manner at the intersections of patterns composed of straight lines, P, circular arcs, and other curved lines and their vicinity. (shown in Figure 1) is a case in which two straight lines A and B of line width W intersect at point 0.As shown in the figure, the center layer of straight line A is the X axis, and point 0 is If the y-axis is set perpendicular to the X-axis, one edge to the straight line and a straight line parallel to the y-axis passing through the intersection point I of the center layer of the straight line B and the gap area C between the y-axis.
Now, the two straight lines A and B overlap greatly. Therefore, the bite size 2 outside this area (the distance between the centers of the laser spots that form a straight line) is b1? Assuming that the bite size in this area is b2, bz=2bI, and the laser spot weight is changed. However, in order not to change the processability, the laser frequency is the same inside and outside the area. By doing this, the density of the laser spot in the entire area within the two straight lines becomes hazy, and uniform laser marking becomes possible.

〔実施例〕〔Example〕

第1図はマーキングされるパターンの一部で、2つの直
線A、Bが点Oで交わっている例である。
FIG. 1 is a part of a pattern to be marked, and is an example in which two straight lines A and B intersect at a point O.

これらの直線はレーザのスポットを出射させながら、直
線の方向に移動させることにより、連らなったスポット
によシ、形成される。スポットの径に応じて直線の線幅
Wが決まる。
These straight lines are formed by a series of spots by moving the laser spot in the straight line direction while emitting the laser spot. The line width W of the straight line is determined depending on the diameter of the spot.

図示の如くX軸、y軸を定め、線幅Wの2本の直線Aと
Bを各々、y=0.y=axとする。直線人の一方のエ
ツジと他方の直線Bの中心線との交点をIとすると、こ
の交点の座標はI(−1゜m−)で表わされる。−1≦
X≦Oの範囲内に中心を持つ各直線内のスポットに関し
ては、相隣り合うスポット間の距離(バイトサイズ)を
−八〉Xまたはx>0の領域でのバイトサイズの2倍に
する。この領域Cでは両方の直線を形成する全体のスポ
ットにより、この領域外におけるスボ。
As shown in the figure, the X-axis and y-axis are determined, and two straight lines A and B of line width W are drawn, respectively, with y=0. Let y=ax. Letting I be the intersection between one edge of the straight line and the center line of the other straight line B, the coordinates of this intersection are expressed as I (-1°m-). −1≦
For spots in each straight line having centers within the range of X≦O, the distance between adjacent spots (bite size) is twice the bite size in the region of -8>X or x>0. In this region C, the entire spot forming both straight lines will cause the spots outside of this region to be distorted.

トの密度とほとんど等しくなる。almost equal to the density of

また交わる2つのラインのうち、一方のラインBが円弧
または円の場合には、第2図に示すように直線人のエツ
ジと円弧Bの中心線の交点Iは円弧の方程式はX意+(
y+a)”=aス a:円弧の内に中心をもつ各ライン
内のスポットに関しては、相隣り合うスポット間の距離
bz(μm)をトサイズbs(μm)の2倍にすること
により全領域でスポットの密度をほとんど等しくするこ
とができる(円弧の場合は円弧の長さとしてバイトサイ
ズを規定している)。
In addition, if one of the two intersecting lines B is an arc or a circle, the intersection point I of the edge of the straight line and the center line of the arc B is the equation of the arc, as shown in Figure 2.
y+a)"=a space a: Regarding the spots in each line whose center is inside the circular arc, by making the distance bz (μm) between adjacent spots twice the size bs (μm), Spot density can be made almost equal (in the case of circular arcs, the bite size is defined as the length of the circular arc).

レーザの周波数を変えると加工状態が変化するので、こ
れを全領域で一定値f (KHz )に保つ。
Since the machining state changes when the laser frequency is changed, it is maintained at a constant value f (KHz) over the entire range.

ところでマーキング速度V (mm/s ) =b (
μm )の内部でのマーキング速度は、外部の2倍とな
る。
By the way, marking speed V (mm/s) = b (
The marking speed inside (μm) is twice that of the outside.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は直線1円あるいは円弧から
なる一般的なパターンの中で、これらのラインが鋭角を
なして交わる場合、交点とその周辺部においても、パタ
ーンのレーザマーキングを行うときに、できる限り多重
にレーザ光を照射させない九めに、鋭角に交わる点とそ
の周辺部においても、より均一な加工状態が得られると
いう効果がある。
As explained above, the present invention enables laser marking of the pattern even at the intersection point and the surrounding area when these lines intersect at an acute angle in a general pattern consisting of a straight line or a circular arc. A ninth advantage of avoiding multiple laser beam irradiation as much as possible is that a more uniform processing state can be obtained even at acute angle intersection points and their surrounding areas.

【図面の簡単な説明】[Brief explanation of drawings]

第1図と第2図はレーザマーキングパターンの一部を示
す図で、第1図は直線人と直線Bが鋭角をなして点0で
交わっている場合の図である。第2図は直線人と円弧B
の交点0における接線が鋭角をなして交わっている場合
の図である。
1 and 2 are diagrams showing a part of the laser marking pattern, and FIG. 1 is a diagram when a straight line person and a straight line B form an acute angle and intersect at point 0. Figure 2 shows a straight line person and arc B
This is a diagram where the tangent lines at intersection 0 intersect at an acute angle.

Claims (1)

【特許請求の範囲】[Claims] 被加工物にレーザスポットを照射・走査して被加工物に
パターンを描画するレーザマーキング加工法において、
レーザマーキングするパターンを構成する直線または曲
線で成る2本のラインが鋭角をなして交わる場合、線幅
wの各ラインの中心線の間隔が、線幅の1/2になると
ころから、交点までの間のスポット間隔(バイトサイズ
)とマーキング速度(走査速度)を、この領域以外での
値に対して、2倍とすることを特徴とする、レーザマー
キング加工法。
In the laser marking method, which draws a pattern on the workpiece by irradiating and scanning a laser spot on the workpiece,
When two straight or curved lines that make up the pattern to be laser marked intersect at an acute angle, the distance between the center lines of each line with line width w is from 1/2 of the line width to the point of intersection. A laser marking processing method characterized by doubling the spot spacing (bite size) and marking speed (scanning speed) between the two regions compared to values outside this region.
JP2022623A 1990-01-31 1990-01-31 Laser beam marking method Pending JPH03226388A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022623A JPH03226388A (en) 1990-01-31 1990-01-31 Laser beam marking method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022623A JPH03226388A (en) 1990-01-31 1990-01-31 Laser beam marking method

Publications (1)

Publication Number Publication Date
JPH03226388A true JPH03226388A (en) 1991-10-07

Family

ID=12087957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022623A Pending JPH03226388A (en) 1990-01-31 1990-01-31 Laser beam marking method

Country Status (1)

Country Link
JP (1) JPH03226388A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000346084A (en) * 1999-06-10 2000-12-12 Uchiyama Mfg Corp Bearing seal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000346084A (en) * 1999-06-10 2000-12-12 Uchiyama Mfg Corp Bearing seal

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