JPH03224257A - Cooling equipment for semiconductor device - Google Patents

Abstract

PURPOSE:To improve cooling effect and obtain a small-sized apparatus, by installing penetrating holes, grooves the rear, and the junction of grooves, on a cooling plate on which semiconductor devices are fixed directly or via a metal plate and the like, and making cooling medium flow directly or by using means like pipe burying. CONSTITUTION:A pair of semiconductor devices Q1, Q2 are laterally arranged on a cooling plate 22 via a common metal plate 53 and a series metal plate 54, and electrically connected in series. Since both end parts of an upper metal plate 55 are in contact with the plane 54 via an insulating sheet 52d, thermal conduction from the upper surface to the cooling plate is promoted. Grooves formed in the rear of the cooling plate 22 are made to face each other, and a liquid cooling pipe 3 is fixed on the plate 22 with embedded bolts 51, 56. Thermal conduction distance is shortened by the depth of the groove, and three surfaces contact, so that cooling performance is increased. By preventing the leak of liquid with penetrating holes or packing except the pipe 3, the performance is further improved. Since semiconductor devices can be arranged on both surfaces of a cooling plate, miniaturization is enabled.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a cooling structure for a semiconductor device.

[Conventional technology]

In the conventional cooling structure for semiconductor devices, as shown in FIG. 7 or 8, one or more rectangular liquid cooling pipes 3 are pressed against the cooling plate 2 with a grooved stop plate 4, and the cooling plate is closed. The structure is such that the semiconductor device 1 is cooled through the FET 2.
(field effect transistor), the source terminal S is connected to the electric wire 1a through the screw 1s, and the drain terminal is connected to the cooling plate 2.
and the electric wire 1b through the screw 1d.

[Problem to be solved by the invention]

In the conventional semiconductor device cooling structure, the semiconductor device l
The cooling performance of is determined by the following items.

A) Contact thermal resistance between the semiconductor device 1 and the cooling plate 2 B) Thermal resistance due to the thickness of the cooling plate 2 C) Contact thermal resistance between the cooling plate 2 and the liquid cooling pipe 3 and the cooling structure of the conventional semiconductor device. There is a problem in that the thermal resistance due to the thickness of the cooling plate 2 and the contact thermal resistance between the cooling plate 2 and the liquid cooling pipe 3 are large.

Therefore, an object of the present invention is to provide a structure that improves the cooling performance of a semiconductor device.

[Means to solve the problem]

In order to solve the above problems, the first to fourth inventions provide a structure in which a groove is provided on the back surface of a cooling plate to which a semiconductor device is attached, and a liquid cooling pipe is embedded in this groove, or a structure is adopted in which a liquid cooling pipe is embedded in the groove. The back surfaces of the attached cooling plates are joined together to form a pair, and opposing grooves are provided on this joint surface, and a liquid cooling pipe is embedded in this groove. Furthermore, a through-hole is provided in the cooling plate to which the semiconductor device is attached, and a cooling medium is allowed to flow through the through-hole, or the back sides of the cooling plate to which the semiconductor device is attached are joined together to form a pair, and the cooling plate is placed opposite to this bonded surface. A groove is provided in which the cooling medium flows.

A cooling device for a semiconductor device according to a fifth aspect of the present invention includes a common metal plate joined to a cooling plate via a common insulating sheet, and a pair of two that are arranged side by side on the common metal plate and have terminals on an upper surface and a lower surface. a pair of semiconductor devices, a crank-shaped series metal plate disposed continuously on the top surface of one of the semiconductor devices and the bottom surface of the other semiconductor device, and a crank-shaped series metal plate that covers the top surface and both sides of the pair of semiconductor devices, and the common metal plate that covers the top surface and both sides of the pair of semiconductor devices. a top metal plate having both ends parallel to the plate; a series metal plate in a region above the one semiconductor device between the series metal plate and the top metal plate; and a series metal plate in a region below the other semiconductor device. and the common metal plate and between the both ends of the upper metal plate and the common metal plate, and an insulating bolt that fixes the both ends to the cooling plate. It is something.

However, the fifth invention may be placed back to back, a plurality of them may be arranged on the same plane, or the means of the first to fourth inventions may be added, and the cooling plate may have fins instead of liquid cooling pipes. or a metal wiring board.

[Effect]

In the first to fourth inventions, the cooling plate that transfers the amount of heat generated by the semiconductor device has such features that the heat transfer distance is reduced by the depth of the groove, and that the number of liquid cooling pipes is small (all three sides are the cooling plate). Cooling performance is improved by increasing the heat transfer area through contact with the liquid cooling pipe.In addition to the above effect, by eliminating the liquid cooling pipe, the contact thermal resistance between the cooling plate and the liquid cooling pipe is also eliminated, further improving cooling performance. .

In the fifth invention, since the pair of semiconductor devices are arranged side by side on the cooling plate and the lower surface of each semiconductor device is located on the cooling plate, cooling from the lower surface is preferable.

Even though they are arranged side by side, the two semiconductor devices are electrically connected in series by the crank-shaped series metal plates. Naturally, the series metal plate and the upper metal plate are thin plates and have a large surface area, and cooling from these parts is promoted. In particular, since both ends of the top metal plate are in contact with the common metal plate via the insulating sheet, heat conduction from the top surface to the cooling plate facilitates cooling.

The portions other than those where the pair of semiconductor devices are connected by the series metal plate are electrically insulated by the common insulating sheet and each insulating sheet, thereby establishing the series connection of the pair of semiconductor devices. Since the connection is compact, the inductance is reduced and the characteristics of the electronic circuit are improved.

〔Example〕

FIG. 1 shows a first embodiment of the present invention, in which the same parts as in the conventional example are given the same reference numerals.

The semiconductor device 1 is fixed to the cooling plate 21 with set screws. The rectangular liquid cooling pipe 3 is completely embedded in the groove 21a provided in the cooling plate 21. The liquid cooling pipe 3 is fixed by screwing the stop plate 41 to the cooling plate 21. Semiconductor device 1 and cooling plate 21
The contact surface between the cooling plate 21 and the liquid-cooled vibrator 3 is coated with heat dissipation grease in order to enhance the heat transfer effect.

Comparing the cooling performance with the conventional example, firstly, cooling plates 2 and 21
The thermal resistance of the two is significantly different.

In the case of the conventional example, the thermal resistance of the cooling plate 2 is θl (℃/W)
, the specific heat resistance is δ (℃・cIl/W), the distance from the liquid-cooled vibrator 3 to the semiconductor device 1 is A (am), and the contact area between the cooling plate and the liquid-cooled vibrator is S (cd), then θ, = δ
It will be A/S.

The thermal resistance of the cooling plate 21 in the case of FIG. 1 is that since the distance B from the liquid-cooled vibrator 3 to the semiconductor device 1 is smaller than the dimension A of the conventional example, the thermal resistance is proportionally smaller, resulting in cooling performance. Furthermore, the side surface of the liquid-cooled vibrator is also effective in reducing the thermal resistance, further increasing the effect.

FIG. 2 shows a second embodiment, and the difference from FIG. 1 is that two grooved cooling plates 22 are prepared as a pair, and the liquid cooling vibe 3 is sandwiched between each cooling plate 22. The purpose is to make it a double-sided type with semiconductor devices 1 and 5 attached to it. In this case, all surfaces of the liquid cooling vibrator 3 are exposed to the semiconductor devices 1 and 5.
It is used for cooling, eliminating waste and eliminating the need for a stop plate.

In any of the embodiments, the liquid cooling vibrator and the groove are not limited to square shapes; for example, the first embodiment may have an inverted U-shape, and the second embodiment may have a circular shape.

FIG. 3 shows a third embodiment, in which the cooling plate 23 has through holes 2.
3a, through which a cooling medium flows. Although not shown, nipples are provided at both ends of the through hole 23a of the cooling plate 230 to connect a pipe through which a cooling medium flows. In this method, there is no liquid-cooled vibrator, so there is no contact thermal resistance between the cooling plate and the liquid-cooled vibrator, and the cooling performance is further improved.

FIG. 4 shows a fourth embodiment, which differs from the third embodiment in that two grooved cooling plates 24 are arranged in a pair facing each other, and the grooves 24a are used as cooling medium passages. In this structure, a gasket 7 is provided to prevent leakage of the cooling medium.

Note that the through hole 23a in the third embodiment may be square, and the groove 24a in the fourth embodiment may be circular.

FIG. 5 shows a diffusion exploded sectional view of the fifth embodiment, and FIG. 6 shows its circuit diagram. In the figure, the back surfaces of a pair of cooling plates 22 are joined together, opposing grooves are provided in the joined parts, and a plurality of liquid cooling vibes 3 are embedded with heat dissipation grease applied thereto, and fixed with a plurality of setscrews 51.

Now, a common metal plate 53 such as a thin copper plate is provided to be joined to the upper cooling plate 22 via an insulating sheet 52, and a pair of terminals S and D are provided on the common metal plate horizontally and on the upper and lower surfaces. Semiconductor devices Q1°Q2 are arranged. The top surface of this one semiconductor device Q and the other semiconductor device Q2
A crank-shaped series metal vi54 is disposed continuously on the lower surface of the semiconductor device Q s , Q z
An upper surface metal plate 55 having both ends 55a parallel to the common metal plate 53 is arranged so as to cover the upper surface and both sides of the common metal plate 53.

Between the series metal plate 54 and the top metal plate 55 in the area above the one semiconductor device Q1, and between the series metal plate 54 and the common metal plate 53 in the area below the other semiconductor device Q2. and an insulating sheet 52a such as a silicone sheet between the ends 55a of the upper metal plate 55 and the common metal plate 53.

52b, 52c, and 52d are interposed. Then, both ends 55a are fixed to the cooling plate 22 with two insulating bolts 56.

This insulating bolt 56 is connected to a nut 57 sandwiched between the cooling plate 22.
The nut 58 is screwed into the both ends 55a from above and below.
Tighten. Then, the double nut 59 at the tip of the insulating bolt 56 is connected to the upper metal plate 54 above the terminal S of the semiconductor devices Q, Qz via the leaf spring 60 and the insulating triangular prism 61.
Tighten. It is preferable to adjust the forces W and R.

Capacitor CI+C! is insulation sheet 52c + 52
d is sandwiched between the capacitor terminals, and each terminal is connected by contacting both ends 55a and the common metal plate 53, respectively.

In the above, semiconductor devices Q + and Q z are placed on the upper cooling plate 22.
, capacitors C+ and Ct are attached, but semiconductor devices W Q s * Q 4 ,
The structure for attaching capacitors C and C is simply upside down. The one with this structure is the FE shown in Figure 6.
This is a DC power supply circuit using T, but P in the circuit diagram
The t, NR, and G terminals can be easily extracted from the structure diagram.

This structure can also be used when inverter transistors are assembled into a three-phase bridge circuit.

According to the embodiment, the pair of semiconductor devices are arranged side by side on the cooling plate, and the lower surface of each semiconductor device is located on the cooling plate, so that cooling from the lower surface is preferable.

Even though they are arranged side by side, the two semiconductor devices are electrically connected in series by the crank-shaped series metal plates. Naturally, the series metal plate and the upper metal plate are thin plates and have a large surface area, and cooling from these parts is promoted. In particular, since both ends of the top metal plate are in contact with the common metal plate via the insulating sheet, heat conduction from the top surface to the cooling plate facilitates cooling.

The portions other than those where the pair of semiconductor devices are connected by the series metal plate are electrically insulated by the common insulating sheet and each insulating sheet, thereby establishing the series connection of the pair of semiconductor devices. Since the connection is compact, the inductance is reduced and the characteristics of the electronic circuit are improved.

〔Effect of the invention〕

According to this group of inventions, in the first and second inventions, since the liquid cooling pipe is embedded in the groove of the cooling plate, the distance between the liquid cooling vibrator and the semiconductor device is shortened, and the cooling performance is improved. Since the heat generated by the semiconductor device can be transferred using most of the area of the outer surface of the cold vibrator, there is an effect that the cooling device can be made smaller.

In the third and fourth inventions, since there is no liquid cooling pipe, there is no contact thermal resistance between the liquid cooling pipe and the cooling plate, and the cooling performance is further improved.

Furthermore, in the case of a double-sided type, two semiconductor devices are attached to both sides of the cooling plate, which has the effect of further miniaturizing the cooling plate.

In the fifth invention, the semiconductor devices are arranged side by side and the lower surfaces directly contact the cooling plate through the common metal plate and the common insulating sheet, so cooling is good, and furthermore, the series metal plate and the upper metal plate have a large surface area. Cooling is also improved in that the upper metal plate transfers heat to the cooling plate at both ends. The crank-shaped series metal plates have the effect of compactly connecting side-by-side semiconductor devices in series, reducing inductance, and improving circuit characteristics.

[Brief explanation of drawings]

Fig. 1 is a front view showing the first embodiment, Fig. 2 is a front view showing the second embodiment, Fig. 3 is a front view showing the third embodiment, and Fig. 4 is a front view showing the fourth embodiment. A front view showing an example, FIG. 5 is a diffusion exploded sectional view showing the fifth embodiment, FIG. 6 is a circuit diagram of FIG. 5, and FIGS. 7 and 8 are front views showing different conventional examples. It is. 1.5...Semiconductor device, 2.21.22.23.24
...Cooling plate, 3...Liquid cooling vibrator, 4, 41...Stopping plate, 21a. 24a...Groove, 23a...Through hole, 7...Packing, 52...Common insulation sheet, 52a, 52b, 52
c, 52d - insulation sheet, 53... common metal plate,
54...Series metal plate, 55...Top surface metal plate, 55a
... Both ends, 56 ... Insulation bolt, 60 ... Leaf spring, 61 ... Insulation triangular prism, C+, Cz, C3, C4.
...Capacitor, ql, Qt, Q3. Qa...Semiconductor device. Figure Figure Figure Figure

Claims (1)

[Claims] 1) A groove is provided on the back surface of the cooling plate to which the semiconductor device is attached,
A semiconductor device cooling device characterized by having a liquid cooling pipe embedded in this groove. 2) A cooling device for a semiconductor device, characterized in that the back surfaces of the cooling plates to which the semiconductor devices are attached are joined together to form a pair, grooves are provided facing each other on the joint surfaces, and liquid cooling pipes are embedded in the grooves. 3) A cooling device for a semiconductor device, characterized in that a cooling plate to which a semiconductor device is attached is provided with a through hole, and a cooling medium is allowed to flow through the through hole. 4) A cooling device for a semiconductor device, characterized in that the back surfaces of cooling plates to which semiconductor devices are attached are joined together to form a pair, opposing grooves are provided on the joined surfaces, and a cooling medium is allowed to flow through the grooves. 5) A common metal plate joined to the cooling plate via a common insulating sheet, a pair of two semiconductor devices arranged side by side on the common metal plate and having terminals on the top and bottom surfaces, and one of the semiconductor devices. a crank-shaped series metal plate disposed continuously on the top surface and the bottom surface of the other semiconductor device; and a top metal plate that covers the top surface and both sides of the pair of semiconductor devices and has both ends parallel to the common metal plate. and between the series metal plate and the top metal plate in a region above the one semiconductor device,
an insulating sheet interposed between the series metal plate and the common metal plate in a region below the other semiconductor device and between the both ends of the top metal plate and the common metal plate; A cooling device for a semiconductor device, comprising an insulating bolt that fixes both ends to the cooling plate.