JPH0321899U - - Google Patents
Info
- Publication number
- JPH0321899U JPH0321899U JP8244889U JP8244889U JPH0321899U JP H0321899 U JPH0321899 U JP H0321899U JP 8244889 U JP8244889 U JP 8244889U JP 8244889 U JP8244889 U JP 8244889U JP H0321899 U JPH0321899 U JP H0321899U
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- mounting
- circuit board
- printed circuit
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000007547 defect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図は従来のシールドケースの取付構造を示す分
解斜視図、第３図、第４図は従来例における基板
の配線パターンの半田付不良を説明するための側
面図である。
図中、１……プリント基板、１ａ……取付穴、
２……シールドケース、２ａ……取付脚、２ｂ…
…空間部、３……シールド蓋、３ａ……取付穴で
ある。なお、図中同一符号は同一又は相当部分を
示す。
Fig. 1 is a perspective view showing an embodiment of this invention, Fig. 2 is an exploded perspective view showing the mounting structure of a conventional shield case, and Figs. 3 and 4 are soldering of the circuit board wiring pattern in the conventional example. It is a side view for explaining a defect. In the figure, 1...Printed circuit board, 1a...Mounting hole,
2...Shield case, 2a...Mounting leg, 2b...
...Space portion, 3...Shield lid, 3a...Mounting hole. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
た取付脚を、これと対向してプリント基板に配設
された取付穴に挿入して、プリント基板の裏面か
ら半田付するようにしたシールドケースの取付構
造において、上記取付脚にスリツト状の空間部を
設け、この空間部に半田を付着させてなるシール
ドケースの取付構造。 Installation of a shield case in which the mounting legs that protrude vertically from the bottom of the side wall of the shield case frame are inserted into the mounting holes provided on the printed circuit board on the opposite side, and soldered from the back of the printed circuit board. In the structure, the shield case mounting structure includes a slit-shaped space provided in the mounting leg and solder adhered to the space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8244889U JPH0321899U (en) | 1989-07-13 | 1989-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8244889U JPH0321899U (en) | 1989-07-13 | 1989-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0321899U true JPH0321899U (en) | 1991-03-05 |
Family
ID=31629271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8244889U Pending JPH0321899U (en) | 1989-07-13 | 1989-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321899U (en) |
-
1989
- 1989-07-13 JP JP8244889U patent/JPH0321899U/ja active Pending