JPH03218055A - Resin sealed semiconductor package - Google Patents
Resin sealed semiconductor packageInfo
- Publication number
- JPH03218055A JPH03218055A JP1415390A JP1415390A JPH03218055A JP H03218055 A JPH03218055 A JP H03218055A JP 1415390 A JP1415390 A JP 1415390A JP 1415390 A JP1415390 A JP 1415390A JP H03218055 A JPH03218055 A JP H03218055A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- sealed semiconductor
- resin
- finish
- finished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 238000000034 method Methods 0.000 abstract description 6
- 238000010330 laser marking Methods 0.000 abstract description 5
- 230000003746 surface roughness Effects 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 5
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、樹脂封止型半導体用パッケージに関する。[Detailed description of the invention] Industrial applications The present invention relates to a resin-sealed semiconductor package.
従来の技術
近年マーキング消え防止のために、マーキング方式は紫
外線硬化型インク印刷から、レーザ光線を利用したレー
ザマーキングが主流となってきている。それにともない
樹脂封止型半導体用バッケーシの表面は、梨地面仕上か
らレーザマークが可能な鏡面仕上になってきている。BACKGROUND OF THE INVENTION In recent years, in order to prevent markings from fading, the mainstream marking method has changed from ultraviolet curable ink printing to laser marking using laser beams. As a result, the surface of resin-sealed semiconductor packages has changed from a satin finish to a mirror finish that allows laser marking.
発明が解決しようとする課題
このような従来の構成では樹脂封止型半導体用パッケー
シ表面が鏡面仕上の場合、テーピング包装のテープに樹
脂封止型半導体用パッケージ面が接着しにク＜、脱落し
てしまうという課題が生じてきている。また近年、実装
技術の発達にともない、従来のトレー包装から連続供給
可能なテーピング包装の要望が日増しに強まってきてい
る。Problems to be Solved by the Invention In such a conventional configuration, when the surface of the resin-sealed semiconductor package has a mirror finish, the surface of the resin-sealed semiconductor package tends to adhere to the tape of the taping packaging and may fall off. The problem has arisen that In addition, in recent years, with the development of packaging technology, the demand for taping packaging that can be continuously supplied from conventional tray packaging is increasing day by day.
本発明は、このような課題を解決するもので、テーピン
グ包装に支障のない樹脂封止型半導体用パッケージを提
供することを目的するものである。The present invention has been made to solve these problems, and it is an object of the present invention to provide a resin-sealed semiconductor package that can be easily taped and packaged.
課題を解決するための手段
この課題を解決するため、本発明は樹脂封止型半導体用
パッケージの一方の面を鏡面仕上に、他方の面は梨地面
仕上として構成したものである。Means for Solving the Problems In order to solve the problems, the present invention provides a resin-sealed semiconductor package in which one side is finished with a mirror finish and the other side is finished with a satin finish.
作用
この構成により、樹脂封止型半導体用パッケージの一方
の面はレーザマーキングが可能な鏡面仕上に、他方の面
は梨地面仕上にすることにより、テーピング包装での供
給に支障をきたさないこととなる。Function: With this configuration, one side of the resin-sealed semiconductor package has a mirror finish that can be laser marked, and the other side has a satin finish, so there is no problem with supplying it in taped packaging. Become.
実施例
第１図は、本発明の一実施例としてＳＯタイプの樹脂封
止型半導体用パッケージに実施したものである。樹脂封
止型半導体用パッケーシの一方の面を鏡面仕上に、他方
の面は梨地面仕上として構成したもので梨地面の表面粗
さは２〜２５μｍの範囲から効果が大になるように選択
できる。Embodiment FIG. 1 shows an example of the present invention implemented in an SO type resin-sealed semiconductor package. One side of the resin-sealed semiconductor package has a mirror finish and the other side has a matte finish, and the surface roughness of the matte finish can be selected from the range of 2 to 25 μm to maximize the effect. .
発明の効果
以上、本発明の実施例の説明からも明らかなように、本
発明によれば樹脂封止型半導体用パッケーシの一方の面
をレーザマーキングが可能な鏡面仕上に、他方の面は梨
地面仕上にすることにより、テーピング包装での供給に
支障をきたさないという効果かえられる。In addition to the effects of the invention, as is clear from the description of the embodiments of the present invention, according to the present invention, one surface of the resin-sealed semiconductor package has a mirror finish that allows laser marking, and the other surface has a pear finish. By using the ground finish, there is an effect that there is no problem with supplying in taped packaging.
第１図は本発明の一実施例を示すＳＯタイプの樹脂封止
型半導体用パッケーシの側面図、第２図は従来のＳＯタ
イプの樹脂封止型半導体用パッケージの側面図である。
１・・・・・・梨地仕上面、２・・・・・・鏡面仕上面
、３・・・・・・アウターリード。FIG. 1 is a side view of an SO type resin-sealed semiconductor package showing an embodiment of the present invention, and FIG. 2 is a side view of a conventional SO type resin-sealed semiconductor package. 1... Satin finish surface, 2... Mirror finish surface, 3... Outer lead.
Claims (1)
成したことを特徴とする樹脂封止型半導体用パッケージ
。A resin-sealed semiconductor package characterized in that one surface has a mirror finish and the other surface has a satin finish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014153A JP2599473B2 (en) | 1990-01-23 | 1990-01-23 | Resin-sealed semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014153A JP2599473B2 (en) | 1990-01-23 | 1990-01-23 | Resin-sealed semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03218055A true JPH03218055A (en) | 1991-09-25 |
| JP2599473B2 JP2599473B2 (en) | 1997-04-09 |
Family
ID=11853207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014153A Expired - Fee Related JP2599473B2 (en) | 1990-01-23 | 1990-01-23 | Resin-sealed semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2599473B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067205A (en) * | 2005-08-31 | 2007-03-15 | Rohm Co Ltd | Molded electronic component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57129710A (en) * | 1981-02-05 | 1982-08-11 | Hitachi Ltd | Molds for forming resin seal for insert |
| JPS61234551A (en) * | 1985-04-11 | 1986-10-18 | Toshiba Corp | Resin sealed type semiconductor device |
| JPH01149430A (en) * | 1987-12-04 | 1989-06-12 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1990
- 1990-01-23 JP JP2014153A patent/JP2599473B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57129710A (en) * | 1981-02-05 | 1982-08-11 | Hitachi Ltd | Molds for forming resin seal for insert |
| JPS61234551A (en) * | 1985-04-11 | 1986-10-18 | Toshiba Corp | Resin sealed type semiconductor device |
| JPH01149430A (en) * | 1987-12-04 | 1989-06-12 | Fujitsu Ltd | Manufacture of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067205A (en) * | 2005-08-31 | 2007-03-15 | Rohm Co Ltd | Molded electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2599473B2 (en) | 1997-04-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |