JPH03212999A - Apparatus for mounting electronic component - Google Patents

Abstract

PURPOSE:To accurately detect the holding state of an electronic component by a method wherein a light-diffusing device is installed at a member holding the component so as to be freely attached and detached, the electronic component is irradiated with light via the light-diffusing device and an image of the holding state of the electronic component is recognized. CONSTITUTION:A chip component Cp is irradiated by using an illumination device 16; an image recognition operation of the suction state of the chip component is started. As shown by a broken line (a), light which has been radiated from the illuminator 16 is transmitted through a diffusion plate 15 and is diffused. The chip component Cp is irradiated uniformly with the diffused light. On the other hand, e.g. as shown by a broken line (b), light with which a loading and unloading mechanism D or the like acting as a background at an image pickup operation of the chip component Cp cannot be directly incident on a camera 17 because the diffusion plate 15 exists. The light is diffused after it has been passed through the diffusion plate 15. Consequently, the image of an object situated at the upper side from the diffusion plate 15 of the loading and unloading mechanism O is not formed, and the image of only the chip component Cp is picked up. Thereby, the image can be processed easily, and it is possible to accurately detect the dislocation state of a suction position of the chip component Cp.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a work head device that mounts electronic components by repeatedly picking up the electronic components and placing them on a substrate. .

[Prior art and its problems]

Conventionally, when automatically mounting a large number of chip components such as ICs, resistors, and capacitors on a printed circuit board, a mounting work head is used that is equipped with a suction nozzle that removably attracts the chip components. When mounting a chip component, the mounting work head is freely moved between the pick position, the pick position, and the place position, and the chip component is automatically mounted on the printed circuit board while repeating picking up and placing the chip component. In this mounting operation, when picking up a chip component, the suction position of the suction nozzle relative to the chip component may shift. Conventionally, a mechanical method using chuck claws has been adopted as a method for correcting the deviation of the suction position. In this method, chuck claws are arranged on all sides around the suction nozzle, and the electronic component is evenly gripped by the four chuck claws to correct the suction position, and there is a drawback in the correction accuracy.

Therefore, in recent years, optical methods using image recognition are often used to correct the adsorption position of chip components with high precision. In this method, a camera captures an image of a component being sucked by a suction nozzle, a computer processes the image, detects a deviation in the suction position, and corrects the mounting position based on this.

When using the mounting position correction method using image recognition described above,
As shown in FIG. 4, an illuminator 41 is installed at the bottom of the mounting work head 40. The illuminator 41 is fixedly installed around the mounting shaft 42 that moves up and down, and illuminates the chip component Cp sucked by the suction nozzle 43 attached to the tip of the mounting shaft 42 from the surrounding area.

A camera 44 is arranged below the suction nozzle 43 to take an image of the suction state of the chip component Cp.

When photographing the suction state of the chip component Cp, the chip component Cp is lowered to the height at which it is actually placed onto the printed circuit board B, and the image is taken in order to improve mounting accuracy. Therefore, the projected light from the illuminator 41 moves the suction nozzle 43 onto the mounting shaft 42.
It also irradiates the attachment/detachment mechanism for attaching the device. As a result, the attachment/detachment mechanism and the like become the background and are imaged together with the chip component Cp. When an image of an object other than the chip component Cp is captured, it is difficult to distinguish it from the image of the chip component Cp in image processing, causing a recognition error. Furthermore, the position of the chip component Cp with respect to the illuminator 41 during imaging differs depending on the height of the chip component Cp. However, the illuminator 41
Since these are fixedly installed, depending on the chip component, the entire component may not be uniformly irradiated with light, which may impede image recognition.

[Purpose of the invention]

The present invention has been made in view of the problems of the prior art described above, and it is possible to always accurately image-recognize the holding state of electronic components regardless of the type or size of the electronic components, and to stably hold the electronic components with high precision. The purpose is to provide an electronic component mounting work device that can be mounted on a machine.

[Key points of the invention]

In order to achieve the above object, the present invention picks up an electronic component at a component supply position, performs image recognition of the picked up state, and then holds the electronic component removably in a mounting device that mounts it on a predetermined position on a board. A holding member, an illumination means for irradiating light onto the held electronic component, and a light diffusion means for transmitting and diffusing the light projected from the illumination means, and the light diffusion means is integrally moved to the holding member. The main point is that the installation is possible.

[Embodiments of the invention]

Embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 3.

FIG. 1(a) is an elevational view showing a mounting work head H as an embodiment of the present invention, and FIG. 1(b) is a partial cross-sectional view of its tip, which holds a chip component Cp. This shows the state of transportation. In FIG. 1(a), a head base 1 rotatably supports a rotary table 2, and the rotary table 2 supports a mounting shaft 3 so as to be rotatable therewith and slidable in the vertical direction. The rotary table 2 is connected to a head rotation drive motor 5 via a toothed belt 4. The mounting shaft 3 is connected to a moving table 7 which is provided so as to be slidable up and down along a head mounting plate 6. The moving table 7 is connected to a head lifting/lowering drive motor 9 via a toothed belt 8.

The lower end of the mounting shaft 3 is provided with an attachment/detachment mechanism for detachably attaching the suction nozzle 10. In the attachment/detachment mechanism, as shown in the cross-sectional view of FIG.
．． 11 is rotatably arranged. Each chuck claw 11 is rotatably supported at one end by a retainer 12 which is fixed to the mounting shaft 3 via a shaft 13°13. Each free end of a pair of leaf springs 14 and 14, each end of which is fixed to the retainer 12, is brought into contact with each chuck claw 11 from the outside. Therefore, each chuck claw 11 is urged to rotate in the closing direction by the elastic force of each leaf spring 14.

The suction nozzle 10 consists of a held part 10a and a nozzle part 10b, and has an intake hole 10c formed therethrough along its central axis. An engagement groove 10d is formed in the peripheral surface of the held portion 10a. The above-mentioned chuck claw 1 is attached to this retaining groove 10d.
1.11 are engaged, and the suction nozzle 10 is held between them. A diffusion plate 15 that diffuses and transmits light is fixed to the boundary between the held portion 10a and the nozzle portion 10b. As a material for the diffusion plate 15, translucent vinyl chloride resin, acrylic resin, frosted glass, or the like can be suitably used. In this example, vinyl chloride resin is used to reduce the weight of the mounted work head.

An illuminator 16 is installed around the path along which the suction nozzle 10 at the tip of the mounting shaft 3 and its attachment/detachment mechanism move up and down. The illuminator 16 is attached to the lower surface of the head base 1 by a stay 17. The illuminator 16 is an imaging illuminator for image recognition of the suction state of the chip component Cp by the suction nozzle 10.
irradiate light through. The light projected from the illuminator 16 is diffused when it passes through the diffuser plate 15 and exits, and this diffused light is irradiated onto the chip component Cp.

Next, the chip component mounting operation of the mounting head H will be explained.

First, the mounting head H moves to the chip component supply position, lowers the suction nozzle 10 together with the mounting shaft 3, and suctions the chip component Cp with its tip.

After suctioning the chip component Cp, as shown in FIG. 1(b), the suction nozzle 10 is raised and moved to the image recognition position.

As shown in FIG. 2, a camera 17 is installed at the image recognition position, and the mounting work head H is accurately positioned above the camera 17. Next, the suction nozzle 10 and the chip component Cp are lowered to the height at which the chip component Cp is actually mounted on the printed circuit board B.

Under the above conditions, the illuminator 16 illuminates the chip component Cp, and image recognition of the adsorbed state of the chip component Cp is started.

As shown by the broken line A, the light projected from the illuminator 16 passes through the diffuser plate 15 and is diffused, and the diffused light uniformly illuminates the chip component cp. On the other hand, as shown by the dotted line, for example, the light irradiated onto the attachment/detachment mechanism, etc., which is the background when imaging the chip component Cp, cannot directly enter the camera 17 because of the presence of the diffusion plate 15. After passing through, it diffuses. Therefore, an image of an object above the diffuser plate 15, such as an attachment/detachment mechanism, is not formed, and only the chip component Cp is imaged. This makes image processing easier, and chip parts C
It becomes possible to accurately detect the degree of deviation in the suction position of p.

Moreover, as shown in FIGS. 3(a) and (b), the chip component cp
If the shape changes, the component suction position (lower position of the suction nozzle 10 tip) Pp with respect to the illuminator 16 also changes due to the condition that the image is taken at the same position as when it is mounted on the printed circuit board B. In FIG. 3(a), since the height h of the chip component Cp is low, the distance between the component suction position Pp and the illuminator 16 is large. On the other hand, in FIG. 3(b), since the height h of the chip component Cp is high, the distance between the component suction position Pp and the illuminator 16 is small. As a result, in the past, depending on the shape of the electronic component, there were cases in which it was not possible to accurately image the suction state.

In the mounting work head H of the present invention, since the diffuser plate 15 is fixed to the suction nozzle 10, the diffuser plate 15 and the component suction position P
The distance from Cp to Cp is always constant, and the entire chip component Cp is uniformly irradiated with diffused light via the diffuser plate 15 to form an image. Therefore, regardless of the shape of the chip component Cp, image quality higher than the required level can always be ensured.
It becomes possible to perform accurate image recognition.

After image recognition of the chip component Cp suction state is completed, the suction nozzle 10 is raised and the mounting work head H is moved onto the printed circuit board B. At this time, the mounting position is corrected based on the amount of deviation in the suction state of the chip component Cp obtained by the above-described image recognition, and the mounting work head H is stopped at the corrected mounting position. Next, the suction nozzle 10 is lowered to place the chip component Cp at a target position on the printed circuit board B.

It should be noted that the present invention is not limited to the specific embodiments described above, and it goes without saying that various modifications can be made within the technical scope of the present invention.

〔Effect of the invention〕

As described above in detail, according to the electronic component mounting work device of the present invention, a light diffusing means is installed in the holding member that removably holds the electronic component, and light is transmitted to the electronic component through the light diffusing means. Since the electronic component is irradiated and the electronic component is image-recognized to determine the electronic component's holding state, it is possible to image only the electronic component and perform image processing to accurately detect the electronic component's holding state. In addition, even if the shape of the electronic component changes, the electronic component is uniformly irradiated with diffused light via the light diffusion means provided at a fixed position, ensuring image quality that is always above the required level and maintaining the electronic component's holding state. The image can be recognized accurately. Therefore, regardless of the shape of the electronic component, it is possible to always accurately image-recognize the holding state of the electronic component and mount the electronic component stably and with high precision.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are an elevational view and an enlarged partial sectional view of an electronic component mounting work head as an embodiment of the present invention, and FIG. 2 is an enlarged partial sectional view of the electronic component mounting head as an embodiment of the present invention. FIGS. 3(a) and 3(b) are enlarged elevational views showing the operation;
The figure is an elevational view showing a conventional electronic component mounting work head. 1... Head base 3.42... Mounting axis 10.43... Suction nozzle 15... Diffusion plate 18.41... Illuminator B... Printed circuit board Cp... Chip component D ...Attachment/detachment mechanism H...Mounting work head Pp...Parts suction position Bamboo mosu shotonto) Fly hook shape Figure 1 Collection 21!1 (a) (b Figure 3

Claims (1)

[Claims] After the electronic component is picked up at the component supply position and the picked up state is image recognized, a mounting device that mounts the electronic component on a predetermined position on the board uses a holding member that removably holds the electronic component and shines light on the held electronic component. An electronic component comprising an illumination means for illuminating light, and a light diffusion means for transmitting and diffusing the light projected from the illumination means, and the light diffusion means is installed movably integrally with the holding member. Onboard working equipment.