JP7235525B2 - Parts mounting machine - Google Patents

Description

The present invention relates to a component mounting machine.

The component mounting machine executes a mounting process for mounting components on the board. The component mounting machine captures an image of the board with a board camera and recognizes the position of the board positioned within the machine. Also, the component mounting machine captures an image of the component with the component camera and recognizes the holding state of the component by the holding member. The component mounting machine aims to improve the mounting accuracy by controlling the movement of the mounting head according to the recognized position of the board and the holding state of the component (see Patent Documents 1 and 2).

JP-A-2000-294990 JP 2009-283572 A

By the way, in the mounting process as described above, it is assumed that the substrate camera and the mounting head are in a prescribed positional relationship. Therefore, for example, if the substrate camera includes an installation error with respect to the mounting head, there is a possibility that the movement control of the mounting head is affected. It is considered that the larger the designed distance of the substrate camera with respect to the mounting head, the more likely it is to include an error.

SUMMARY OF THE INVENTION An object of the present specification is to provide a component mounting machine capable of increasing the accuracy of the mounting process while allowing a camera to be used for imaging both the substrate and the component.

The present specification includes a head main body, a plurality of holding members each arranged on a virtual circle centered on an R-axis parallel to a vertical axis and holding a component mounted on a substrate, and a plurality of holding members rotatable around the R-axis. a rotary head provided on the head main body for vertically supporting the plurality of holding members; a camera provided on the head main body for imaging an object to be imaged; and the camera being held by the holding member or the holding member. a component optical path used in component imaging processing in which the imaged component is the imaging target, and a component optical path used in the substrate imaging processing in which the camera is used in the imaging target of the substrate, a part of which passes along the inner circumference side of the virtual circle an optical device for forming an optical path for a substrate; a light source device for a component, which is provided in the head main body on the outer peripheral side of the virtual circle and irradiates the holding member or the component with light in the component imaging process; Disclosed is a component mounting machine including a board light source device that is integrally provided under a light source device and that irradiates the board with light in the board imaging process.

According to such a configuration, the component optical path and the substrate optical path are formed, and each light source device irradiates the imaging target with light. As a result, the camera can be used for board imaging processing and component imaging processing. In other words, the camera functions as a board camera and a part camera. Further, the substrate optical path is formed such that at least a portion of it passes through the inner peripheral side of the virtual circle. As a result, the camera is brought closer to or coincides with the reference position of the mounting head than in the conventional case, and errors in installing the camera with respect to the mounting head can be reduced. As a result, it is possible to improve the precision of the mounting process.

It is a schematic diagram which shows the structure of the component mounting machine in embodiment. It is a side view which shows some mounting heads typically. FIG. 3 is a view in the direction of arrow III in FIG. 2; It is a figure which shows the image data and camera visual field which were acquired by component imaging processing. FIG. 10 is a schematic diagram showing the positional relationship between the head camera unit and the component cameras in calibration processing; FIG. 4 is a diagram showing the positional relationship and calibration values of the head camera unit and component cameras; It is a side view which shows typically some mounting heads provided with the light-shielding apparatus in a modification.

1. Configuration of Component Mounting Machine 1 The component mounting machine 1 executes a mounting process for mounting a component on a substrate. In the following description, the horizontal direction of the component mounting machine 1 is defined as the X direction, the horizontal direction perpendicular to the X direction and the front and rear direction of the component mounting machine 1 is defined as the Y direction, and the X direction and the Y direction are orthogonal to each other. The vertical direction (the front-rear direction in FIG. 1) is defined as the Z direction.

The component mounting machine 1, as shown in FIG. 1, includes a substrate transfer device 11 that transfers a substrate 90 in the X direction. The substrate transfer device 11 is configured by a belt conveyor or the like. The substrate conveying device 11 sequentially conveys the substrates 90 in the conveying direction and positions the substrates 90 at predetermined positions within the apparatus. After completing the mounting process, the board transfer device 11 carries the board 90 out of the component mounting machine 1 .

The component mounting machine 1 includes a component supply device 12 that supplies components 91 (see FIG. 2) to be mounted on a board 90 . In this embodiment, the component supply device 12 has feeders 122 set in a plurality of slots 121 . The feeder 122 feeds and moves a carrier tape containing a large number of components 91 to supply the components 91 so as to be picked up.

The component mounting machine 1 includes a component transfer device 13 that transfers a component 91 supplied by a component supply device 12 onto a board 90 . The component transfer device 13 mounts by transferring the component 91 to a predetermined mounting position on the substrate 90 carried into the machine by the substrate transfer device 11 . In this embodiment, the component transfer device 13 moves the moving table 132 in the horizontal direction (X direction and Y direction) by the head drive unit 131, which is a linear motion mechanism. The mounting head 20 is exchangeably fixed to the moving table 132 by a clamp member (not shown).

The mounting head 20 movably supports one or more holding members that hold the component 91 supplied by the component supply device 12 . In this embodiment, the mounting head 20 supports eight holding members. As the holding member, for example, a suction nozzle 26 (see FIG. 2) that sucks and holds the component 91 with supplied negative pressure air, a chuck that clamps and holds the component 91, or the like can be employed. A detailed configuration of the mounting head 20 will be described later.

The component mounting machine 1 includes a component camera 41 that captures an image of the component 91 held by the holding member (suction nozzle 26) from below. The parts camera 41 is of a digital type having an imaging device such as CMOS. The component camera 41 takes an image based on a control signal input from the outside, and sends out image data obtained by the image taking. In this embodiment, a measurement mark Ms is provided at a prescribed position on the protective glass 41a that transmits incident light on the upper part of the component camera 41 (see FIGS. 1 and 5).

The component mounting machine 1 includes a head camera unit 50 that is provided in the mounting head 20 and captures an image of an object to be imaged. The head camera unit 50 performs part imaging processing for imaging the holding member (suction nozzle 26) or the part 91 held by this. In addition, the head camera unit 50 functions as a board camera, and executes board imaging processing for imaging the board 90 positioned inside the machine. The head camera unit 50 moves integrally with the mounting head 20 as the moving table 132 moves. A detailed configuration of the head camera unit 50 will be described later.

The component mounting machine 1 includes a control device 80 that executes mounting processing for mounting a component 91 on a board 90 . The control device 80 is mainly composed of a CPU, various memories, and control circuits. In the mounting process, the control device 80 controls the operation of the mounting head 20 based on information and measured values output from various sensors, results of image processing, a control program for designating mounting positions on the substrate 90, and the like. Thereby, the position and angle of the suction nozzle 26 supported by the mounting head 20 are controlled.

In this embodiment, the control device 80 has an imaging control section 81 . The imaging control section 81 controls imaging by the component camera 41 and the head camera unit 50 . In this embodiment, when the head camera unit 50 is used for board imaging processing and component imaging processing, the imaging control section 81 performs control so as to switch the effective optical path for each imaging. The details of the switching of the optical path by the imaging control unit 81 will be described later.

The control device 80 has a calibration processing section 82 . The calibration processing unit 82 calibrates the position of the mounting head 20 with respect to the reference coordinates of the component mounting machine 1 based on the image data acquired by the component camera 41 and the head camera unit 50 respectively. The calibration processing unit 82 accurately determines the position of the mounting head 20 inside the machine through the calibration processing described above. As a result, errors in assembling the mounting head 20, errors in mounting the mounting head 20 on the moving table 132, and the like are absorbed, and the mounting accuracy is improved.

2. Detailed Configuration of Mounting Head 20 The mounting head 20 includes a head main body 21 as shown in FIG. The head main body 21 is a frame member detachably provided on the moving table 132 . A center shaft 22 is provided in the head body 21 so as to be rotatable around the R-axis parallel to the vertical axis (Z-axis). The center shaft 22 is formed in a hollow cylindrical shape as an overall shape. An optical path used by the head camera unit 50 for imaging is formed on the inner peripheral side of the center shaft 22 .

The mounting head 20 has a rotary head 23 . The rotary head 23 is provided rotatably around the R-axis with respect to the head main body 21 . In this embodiment, the rotary head is provided at the lower end of the center shaft 22 and configured to be integrally rotatable with the center shaft 22 around the R axis. The rotary head 23 holds a plurality of (e.g., eight) syringes 24 at equal intervals in the circumferential direction on a circle concentric with the R axis so as to be slidable in the Z direction. The rotary head 23 rotates around the R-axis via the center shaft 22 by the rotational driving force of the rotary head rotating device 25 .

The mounting head 20 includes a plurality of holding members each arranged on a virtual circle Cm centered on the R axis. In this embodiment, the holding member is a suction nozzle 26 detachably attached to the lower end of the syringe 24 . Each of the plurality of suction nozzles 26 sucks and holds the component 91 with the supplied negative pressure air. Each of the plurality of suction nozzles 26 is urged upward by the elastic force of an elastic member provided on the outer peripheral side of the syringe 24, and is positioned at the rising end when no external force is applied.

The mounting head 20 includes an elevating device 30 that elevates the suction nozzle 26 . In this embodiment, the lifting device 30 selectively lifts or lowers one of the plurality of suction nozzles 26 in a state in which the rotary head 23 is angled at a predetermined angle around the R axis. Specifically, the lifting device 30 includes a pusher 31, a sleeve 32, a pusher driving section 33, and a pusher rotating device 34, as shown in FIG.

The pusher 31 has a shaft portion 31 a arranged on the outer peripheral side of the center shaft 22 . The shaft portion 31a is provided movably relative to the center shaft 22 in the Z-axis direction and rotatable relative to the R-axis. A claw portion 31b extending radially outward about the R axis is provided at the lower end portion of the shaft portion 31a. The sleeve 32 is arranged on the outer peripheral side of the shaft portion 31 a of the pusher 31 . The sleeve 32 is provided movably in the Z-axis direction relative to the shaft portion 31a, and is restricted from rotating relative to the R-axis.

The pusher drive unit 33 raises and lowers the pusher 31 by a direct acting mechanism such as a ball screw mechanism. The pusher rotating device 34 rotates the pusher 31 around the R-axis via the sleeve 32 . With the configuration as described above, the plurality of suction nozzles 26 are angled at a prescribed angle around the R-axis by rotating the rotary head 23 as the rotary head rotating device 25 is driven.

In parallel with the operation of the rotary head 23, the pusher rotating device 34 is driven to rotate the pusher 31 via the sleeve 32 so that the claw portion 31b is positioned above the upper end portion of any one of the plurality of syringes 24. angle is determined. After that, when the pusher 31 is lowered by driving the pusher driving portion 33, the syringe 24 pressed by the claw portion 31b descends against the elastic force of the elastic member. As a result, the suction nozzle 26 attached to the syringe 24 is lowered to a predetermined Z-direction position.

As described above, the lifting device 30 of the present embodiment is of a type capable of selectively lifting and lowering one of the plurality of suction nozzles 26 in a state in which the rotary head 23 is angled at a predetermined angle around the R axis. to adopt. The mounting head 20 configured as described above is communicably connected to the control device 80 of the component mounting machine 1 . The mounting head 20 controls the operations of the rotary head rotating device 25, the pusher driving section 33, and the pusher rotating device 34 based on commands input from the control device 80 and detection values of various sensors in the mounting head 20. .

3. Detailed Configuration of Head Camera Unit 50 As described above, the head camera unit 50 moves integrally with the mounting head 20 as the moving table 132 moves. In the present embodiment, the head camera unit 50 performs component imaging processing for imaging the suction nozzle 26 and the component 91 held by the suction nozzle 26, and imaging the substrate 90, based on an imaging command from the control device 80. board imaging processing is executed.

Further, in the present embodiment, the head camera unit 50 images the suction nozzle 26 and the component 91 from the side orthogonal to the Z-axis in the component imaging process. Image data Dm (see FIG. 4) obtained by the component imaging process is sent to the control device 80 and used for holding inspection of the component 91 in the mounting process. The head camera unit 50 includes a camera 51 as shown in FIG. The camera 51 is of a digital type having an imaging device such as CMOS.

The camera 51 is provided on the mounting head 20, and images an imaging target (the suction nozzle 26, the component 91, and the substrate 90) contained in the camera field of view Fv (see FIGS. 4 and 5). In this embodiment, the camera 51 is provided on the head body 21 via a bracket (not shown) so that the optical axis Ap is parallel to the vertical axes (Z-axis and R-axis). More specifically, the camera 51 is installed such that the optical axis Ap coincides with the R axis.

The head camera unit 50 has an optical device 53 . The optical device 53 forms a component optical path Lp used in the component imaging process and a board optical path Lc used in the board imaging process. In this embodiment, the optical device 53 is formed by a conical half mirror centered on the R axis. The optical device 53 is arranged at the lower end of the mounting head 20 at a height approximately equal to the tip of the suction nozzle 26 positioned at the rising end.

In the present embodiment, the component optical path Lp is such that when the component light source device 60, which will be described later, irradiates the imaging target (the suction nozzle 26 or the component 91) with light from the side in the component imaging process, the image of the imaging target is projected by the camera. It is formed in a bent shape so that it is incident on 51 . As shown in FIGS. 2 and 4, the optical device 53 is arranged so that the plurality of suction nozzles 26 are aligned on the same circumference around the optical axis Ap of the camera 51 in the camera visual field Fv of the camera 51. to form a component optical path Lp.

As a result, the image data Dm obtained by the component imaging process contains a map in which the plurality of suction nozzles 26 are arranged radially from the center and is enlarged compared to the actual size toward the outer edge, as shown in FIG. . The control device 80 extracts a necessary range from the image data Dm and performs image processing in consideration of the dimensional distortion of the range, for example, in holding inspection of the component 91 .

A part of the substrate optical path Lc formed by the optical device 53 passes through the inner circumference of the virtual circle Cm. Here, the virtual circle Cm is a circle in which a plurality of suction nozzles 26 (and syringes 24) are arranged around the R-axis in the rotary head 23 and passes through the centers of the plurality of suction nozzles 26. FIG. When a virtual circle Cm is drawn at the tip of the suction nozzle 26 located at the rising end, the substrate optical path Lc passes along the inner circumference of the virtual circle Cm. In this embodiment, the substrate optical path Lc is formed linearly so that the image of the substrate 90 is linearly incident on the camera 51 in the substrate imaging process, as shown in FIG.

The head camera unit 50 includes a component light source device 60 and a board light source device 70 that irradiate light onto an imaging target in the corresponding imaging process. The component light source device 60 is provided on the head main body 21 on the outer peripheral side of the virtual circle Cm. In the present embodiment, the component light source device 60 irradiates the object to be imaged with light from the side in the component imaging process. In the present embodiment, the imaging target in the component imaging process is at least one of the suction nozzle 26 and the component 91 .

Specifically, the component light source device 60 includes an annular body 61 and a plurality of first light emitters 62, as shown in FIGS. The annular body 61 is formed in a bottomed cylindrical shape having an opening through which the plurality of suction nozzles 26 and the substrate optical path Lc can pass. With such a configuration, the annular body 61 has a cylindrical inner surface 61a centered on the optical axis Ap of the camera 51 and a lower end surface 61b forming the bottom. The plurality of first light emitters 62 are arranged at predetermined intervals in the circumferential direction on the cylindrical inner surface 61a of the annular body 61 . The plurality of first light emitters 62 irradiate light on the optical axis Ap side of the camera 51 .

The substrate light source device 70 irradiates the substrate with light in the substrate imaging process. The board light source device 70 is integrally provided under the component light source device 60 . Thereby, the component light source device 60 and the board light source device 70 are configured to be attachable to the mounting head 20 in a unitized state. Further, in the present embodiment, the substrate light source device 70 includes a plurality of second light emitters 71 arranged at predetermined intervals in the circumferential direction on the lower end surface 61b of the annular body 61 . The plurality of second light emitters 71 emit light downward. As a result, for example, when the substrate 90 is an object to be imaged, the substrate light source device 70 emits light from the plurality of second light emitters 71 to irradiate the substrate 90 with light.

4. Imaging Processing by Component Mounting Machine 1 The component mounting machine 1 executes mounting processing for mounting the component 91 on the board 90 . In the mounting process, the control device 80 picks up all the components 91 from below with the component camera 41 after picking up the components 91 with the plurality of picking nozzles 26 supported by the mounting head 20 . The control device 80 checks whether the component 91 is sucked by the suction nozzle 26 and recognizes the attitude of the component 91 based on the image data acquired by the above imaging.

In the mounting process, the control device 80 performs image processing using the image data acquired by the component imaging process and the board imaging process of the head camera unit 50 in addition to the above image processing. More specifically, the control device 80 performs component imaging processing before and after the pickup nozzle 26 is moved up and down to mount the component 91 on the substrate 90 after the component camera 41 has captured the image.

By the way, according to the head camera unit 50 configured as described above, both the component optical path Lp and the substrate optical path Lc are formed. Therefore, light from both optical paths is incident on the camera visual field Fv of the camera 51 . Therefore, the image pickup control unit 81 sets the timing of irradiating light from the component light source device 60 and the board light source device 70 at different timings so that the part light path Lp and the board light path Lc are effective for image pickup by the camera 51 . Switch the optical path.

Here, the interior of the component mounting machine 1 is relatively dark, and the head camera unit 50 cannot obtain the amount of light necessary for imaging with only natural light. That is, even if both optical paths are formed, each optical path cannot be effectively used for imaging unless the light source irradiates the object to be imaged. Therefore, the imaging control unit 81 employs a configuration in which the effective optical path for imaging is switched by shifting the light emission timings of the component light source device 60 and the substrate light source device 70 as described above.

In the component imaging process, the imaging control unit 81 causes the plurality of first light emitters 62 of the component light source device 60 to emit light to irradiate light from the outer peripheral side of the plurality of suction nozzles 26 to be imaged. As a result, the component optical path Lp becomes effective for imaging, and a silhouette image of the suction nozzle 26 and the component 91 is projected onto the camera 51 along the component optical path Lp bent by the optical device 53 . As a result, the control device 80 acquires image data Dm as shown in FIG.

The control device 80 performs extraction processing on the image data Dm containing a map that is enlarged compared to the actual size toward the outer edge. Specifically, the control device 80 extracts a range including, for example, the suction nozzle 26 immediately after mounting the component 91 in the mounting process and the component 91 held by the suction nozzle 26 immediately before mounting the component 91 by the lifting operation. do. Next, the control device 80 corrects the distortion of the extraction range and performs image processing such as binarization and edge processing.

By the image processing as described above, the control device 80 determines whether or not the suction nozzle 26 that has attempted to mount the component 91 has brought back the component 91 . In addition, the control device 80 determines whether or not the component 91 held by the suction nozzle 26 for which mounting of the component 91 is attempted is in a posture recognized as normal. When the control device 80 recognizes that it is normal in the above determination, the control device 80 rotates the rotary head 23 by a predetermined amount based on the attitude of the component 91 recognized by the imaging of the component camera 41 and the head camera unit 50, and the suction nozzle is rotated. The part 91 held by 26 is angled.

Further, the control device 80 moves the mounting head 20 so that the suction nozzle 26 that tries to mount the component 91 is positioned above the mounting position on the board 90 . Furthermore, the control device 80 drives the lifting device 30 to angle the pusher 31 with respect to the syringe 24 supporting the suction nozzle 26 described above. After the suction nozzle 26 is positioned above the mounting position, the control device 80 lowers the suction nozzle 26 by the lifting device 30 to try to mount the component 91 .

By the way, in order to accurately perform the mounting process as described above, it is necessary to obtain the position of the substrate 90 positioned inside the machine by the substrate transfer device 11 . Therefore, the control device 80 performs board imaging processing to acquire the position of the board 90 after the board 90 is positioned in the machine. Specifically, the controller 80 first moves the mounting head 20 so that the camera 51 is positioned above the substrate mark Mc provided on the upper surface of the substrate 90 . As a result, the substrate mark Mc is contained within the camera field Fv of the camera 51 .

Next, in the substrate imaging process, the imaging control unit 81 causes the plurality of second light emitters 71 of the substrate light source device 70 to emit light to irradiate light from above the substrate 90 to be imaged. As a result, the substrate optical path Lc becomes effective for imaging, and the image of the substrate mark Mc included in the light reflected by the upper surface of the substrate 90 is transmitted through the optical device 53 and is sent to the camera 51 along the linear substrate optical path Lc. is incident. The control device 80 performs the above board imaging process for each of the plurality of board marks Mc attached to the upper surface of the board 90 .

The control device 80 is positioned based on the positional coordinates of the board mark Mc in a plurality of image data acquired by the board imaging process over a plurality of times and the positional coordinates of the mounting head 20 when each board imaging process is executed. Then, the position of the substrate 90 is calculated. In the subsequent mounting process, the control device 80 mounts the component 91 at the mounting position corresponding to the coordinate system based on the acquired position of the board 90 .

5. Calibration Processing by Component Mounting Machine 1 Here, a general component mounting machine uses a board camera (camera 51 in this embodiment) capable of imaging board marks as described above to capture an image, and obtains a board mark by image processing. Execute the mounting process corresponding to the position. More precisely, the component mounting machine 1 controls the movement of the reference position of the mounting head with respect to the acquired board position. At this time, the positional relationship between the board camera that captures the board mark and the reference position of the mounting head is determined, for example, by referring to the designed distance.

In other words, the conventional component mounting machine obtains the position of the board on the assumption that the board camera and the reference position of the mounting head are in a prescribed positional relationship. Therefore, if the substrate camera includes an error in installation with respect to the mounting head, the acquired position of the substrate includes an error, and as a result, the movement control of the mounting head may be affected. It is considered that the larger the designed distance of the substrate camera with respect to the mounting head, the more likely it is to include an error.

Therefore, the calibration processing unit 82 of the control device 80 of the present embodiment uses the component camera 41 and the head camera unit 50 to perform calibration processing for calibrating the position of the mounting head 20 inside the machine. Specifically, the calibration processing unit 82 first moves the mounting head 20 so that the measurement mark Ms attached to the upper surface of the component camera 41 is within the camera field Fv of the camera 51 . As a result, as shown in FIG. 5, the head camera unit 50 can take an image of the measurement mark Ms of the part camera 41, and the part camera 41 can take an image of the head mark Mh attached to the lower part of the head camera unit 50. state.

The above measurement mark Ms is attached at a prescribed position on the protective glass 41 a of the component camera 41 . As shown in FIG. 6, the head mark Mh is composed of a plurality of (four in this embodiment) circular shapes concentrically centered on the R axis and the optical axis Ap at predetermined intervals. be. The calibration processing unit 82 calculates the position coordinates of the head mark Mh in the image data acquired by imaging by the component camera 41, the position coordinates of the measurement mark Ms in the image data acquired by imaging by the head camera unit 50, and when the imaging process is executed. , the calibration value ΔB is calculated based on the position coordinates of the mounting head 20 of .

According to the configuration of this embodiment, the optical axis Ap of the camera 51 of the head camera unit 50 coincides with the R axis, and the reference position of the mounting head 20 is set on the R axis. According to such a configuration, the camera 51 used for the calibration process can be brought closest to the mounting head 20, and installation errors between the two can be reduced.

In addition, compared to the conventional configuration, the camera 51 is closer to the head mark Mh indicating the reference position of the mounting head 20 . The head mark Mh can be included in the field of view. Thereby, the movement of the mounting head 20 can be omitted between the imaging process of the head mark Mh by the component camera 41 and the imaging process of the measurement mark Ms by the camera 51 . Therefore, it is possible to prevent an error from occurring due to movement of the mounting head 20 during execution of the calibration process.

In this manner, the calibration processing unit 82 calculates the calibration value ΔB and accurately determines the reference position of the mounting head 20 inside the machine. Based on the calibration value ΔB calculated by the calibration processing unit 82, the control device 80 controls the reference position of the mounting head 20 to move to predetermined position coordinates. As a result, errors in assembling the mounting head 20, errors in mounting the mounting head 20 on the moving table 132, and the like are absorbed, and the mounting accuracy is improved.

6. Effect of Configuration of Embodiment The component mounting machine 1 of the embodiment has a component optical path Lp used for the component imaging process and a part of the virtual circle Cm used for the board imaging process in which the camera 51 is used for the board 90 as an imaging target. An optical device 53 is provided for forming each substrate optical path Lc passing through the inner peripheral side. In addition, the component mounting machine 1 is provided integrally with a component light source device 60 for irradiating light onto the suction nozzle 26 or the component 91 in the component imaging process, and below the component light source device 60 . and a substrate light source device 70 for irradiating light to the substrate.

According to such a configuration, the component optical path Lp and the board optical path Lc are formed, and the component light source device 60 and the board light source device 70 irradiate the imaging target with light. Thereby, the camera 51 can be used for board imaging processing and component imaging processing. That is, the camera 51 functions as a substrate camera and a component camera. Further, the substrate optical path Lc is formed such that at least a portion thereof passes through the inner peripheral side of the virtual circle Cm. As a result, the camera 51 is brought closer to or coincides with the reference position of the mounting head 20 than in the conventional case, and the installation error of the camera 51 with respect to the mounting head 20 can be reduced. As a result, it is possible to improve the precision of the mounting process.

7. Modification of Embodiment 7-1. Board Optical Path Lc, Component Optical Path Lp, and Imaging Object In the embodiment, the camera 51 is provided on the head body 21 so that the optical axis Ap coincides with the R axis. Furthermore, the substrate optical path Lc is formed linearly so that the image of the substrate 90 is linearly incident on the camera 51 . On the other hand, the head camera unit 50 can adopt various modes as long as at least a part of the substrate optical path Lc passes along the inner circumference side of the virtual circle Cm.

For example, as shown in FIG. 7, the head camera unit 50 includes a camera 51 provided above the mounting head 20 (for example, near the upper end of the center shaft 22) so that the optical axis Ap is parallel to the Y direction. may be configured. In such a configuration, the substrate optical path Lc is parallel to the optical axis Ap of the camera 51 by an optical member (for example, a mirror) provided above the mounting head 20 after passing through the inner circumference of the virtual circle Cm. It is bent so that it becomes With such a configuration, the camera 51 whose longitudinal direction is the direction of the optical axis Ap can be laid down, so that the dimension of the mounting head 20 in the Z direction can be reduced.

Further, in the above configuration, the component optical path Lp may be formed in a curved shape so that light enters the camera 51 through the outside of the rotary head 23, as shown in FIG. In the embodiment, the head camera unit 50 images the suction nozzle 26 and the component 91 from the side in the component imaging process. On the other hand, depending on the configuration of the optical device 53, the head camera unit 50 may be capable of imaging the suction nozzle 26 and the component 91 from below or above. Such a configuration also has the same effect as the embodiment.

Further, the head camera unit 50 captures the suction nozzle 26 , the component 91 held by the suction nozzle 26 , the board mark Mc of the board 90 , and the measurement mark Ms of the component camera 41 . On the other hand, in addition to the above, the head camera unit 50 includes, for example, components of the mounting head 20 (for example, a syringe 24, a pusher 31, a sleeve 32, etc.), and a characteristic part of the board 90 other than the board mark Mc (for example, , mounted components 91, solder, patterns, holes, etc.) may be the object to be imaged.

7-2. Component Light Source Device 60 and Board Light Source Device 70 In the embodiment, the component light source device 60 includes an annular body 61 and a plurality of first light emitters arranged along the entire circumference of the cylindrical inner surface 61 a of the annular body 61 . 62. The component light source device 60 irradiates the suction nozzle 26 or the component 91, which is an object to be imaged, with light, and the image data Dm includes all the object to be imaged (see FIG. 4).

Then, the control device 80 extracts a necessary range from the image data Dm according to each process. On the other hand, the component light source device 60 does not cause all of the first light emitters 62 to emit light in the component imaging process, but only the first light emitters 62 corresponding to the range extracted in the subsequent extraction process. It is also possible to adopt a configuration in which the light is emitted in a specific manner.

In the embodiment, the control device 80 shifts the light emission timings of the component light source device 60 and the board light source device 70 by the imaging control unit 81, thereby adjusting the light paths effective for imaging (the component optical path Lp, the board optical path Lc). ). On the other hand, the control device 80 may be configured to switch the effective optical path for imaging regardless of the light emission timing. Specifically, the head camera unit 150 includes a light blocking device 154 as shown in FIG.

The light shielding device 154 selectively shields one of the component optical path Lp and the substrate optical path Lc. The light shielding device 154 has a first light shielding plate 155 and a second light shielding plate 156 provided on the head main body 21 . The first light shielding plate 155 shields the component optical path Lp in the operating state. Further, the second light shielding plate 156 shields the substrate optical path Lc in the operating state.

The light shielding device 154 controls the operation states of the first light shielding plate 155 and the second light shielding plate 156 according to the component imaging process and the board imaging process. Thereby, for example, regardless of the light emission state of the component light source device 60 and the board light source device 70, it is possible to switch so that only one of the component optical path Lp and the board optical path Lc becomes an effective optical path for imaging. .

7-3. Mounting Head 20 and Holding Member In the embodiment, the mounting head 20 is configured to move up and down selectively one of the plurality of suction nozzles 26 in a state in which the rotary head 23 is angled at a predetermined angle around the R-axis. It was set as the structure provided with the apparatus 30. FIG. On the other hand, as shown in FIG. 7, the mounting head 20 raises and lowers the suction nozzle 26 at the elevation position by setting the rotary head 23 to one of a plurality of indexing angles, and also performs these operations. A configuration in which the suction nozzles 26 are independently rotatable around the central axis (θ-axis) may be employed.

In the embodiment, the holding member that holds the component 91 is the suction nozzle 26 that holds the component 91 by suction with negative pressure air. On the other hand, as the holding member, a chuck that sandwiches and holds the component 91 with a plurality of claws that can be opened and closed, an electromagnet that holds the component 91 by magnetic force, or the like can be adopted. Such a configuration also has the same effect as the embodiment.

1: component mounting machine, 20: mounting head, 21: head body, 23: rotary head, 26: suction nozzle (holding member, imaging target), 30: lifting device, 50, 150: head camera unit, 51: camera, 53: Optical device 154: Light shielding device 60: Light source device for component 61: Annular body 61a: Cylindrical inner surface 61b: Lower end surface 62: First light emitter 70: Light source device for substrate 71: Second Light emitter 80: Control device 81: Imaging control unit 82: Calibration processing unit 90: Substrate 91: Parts (imaging target) Dm: Image data Fv: Camera field of view Cm: Virtual circle Lp: Parts Lc: substrate optical path Mh: head mark Ms: measurement mark Mc: substrate mark Ap: (camera) optical axis

Claims (8)

a head body;
a plurality of holding members each arranged on a virtual circle centered on an R-axis parallel to the vertical axis and holding components to be mounted on the substrate;
a rotary head provided on the head body to be rotatable about the R axis and supporting the plurality of holding members so as to be able to move up and down;
a camera provided in the head body for capturing an image of an imaging target;
The camera is used for component imaging processing in which the imaging target is the holding member or the component held by the holding member, and the camera is used in substrate imaging processing for imaging the substrate as the imaging target. an optical device each forming an optical path for the substrate, a part of which passes along the inner circumference side of the virtual circle;
a component light source device provided on the head body on the outer peripheral side of the virtual circle and irradiating the holding member or the component with light in the component imaging process;
a light source device for a substrate, which is integrally provided under the light source device for a component and irradiates the substrate with light in the substrate imaging process;
component placement machine. 2. The component mounting machine according to claim 1, wherein said camera is provided on said head body so that an optical axis thereof coincides with said R-axis. The component light source device irradiates an object to be imaged in the component imaging process with light from the side,
3. The component mounting machine according to claim 1, wherein said component optical path is formed in a curved shape so that the image of said imaging target is incident on said camera in said component imaging process. 4. The component mounting machine according to any one of claims 1 to 3, wherein said board optical path is formed in a straight line so that an image of said board is linearly incident on said camera in said board imaging process. . The component mounting machine further includes an elevating device that selectively elevates one of the plurality of holding members in a state in which the rotary head is angled at a predetermined angle around the R axis,
Claim 1-4, wherein the optical device forms the optical path for components so that a plurality of the holding members are arranged side by side on the same circumference around the optical axis of the camera in the field of view of the camera. The component mounting machine according to any one of . The component light source device includes:
an annular body having a cylindrical inner surface centered on the optical axis of the camera;
a plurality of first light emitters arranged at predetermined intervals in the circumferential direction on the cylindrical inner surface of the annular body and emitting light to the optical axis side of the camera;
6. The component mounting machine according to claim 5, wherein said substrate light source device includes a plurality of second light emitters arranged at predetermined intervals in the circumferential direction on the lower end face of said annular body and emitting light downward. The component mounting machine selects an optical path effective for imaging by the camera from among the component optical path and the substrate optical path by differentiating the timing of light irradiation from the component light source device and the board light source device. The component mounting machine according to any one of claims 1 to 6, further comprising a switching imaging control section. The component mounting machine selectively shields one of the component optical path and the substrate optical path to switch between the component optical path and the substrate optical path, which are effective for imaging by the camera. The component placement machine according to any one of claims 1-6, further comprising:

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