JPH03209842A - Fully-automatic wafer prober - Google Patents

Abstract

PURPOSE:To make it possible to perform a test for a stable and high-quality probe by a method wherein a fully automatic wafer prober is provided with a contact pad capable of detecting the position of a probe contact part formed integrally with a stage. CONSTITUTION:A stage positioning accuracy being possessed by a prober is utilized, a probe contact pad 4 formed integrally with a stage part 5 is provided, whether the pad 4 comes into contact with a probe 3 or not is electrically detected and the position of a probe contact part at the time of the detection is detected utilizing the mechanical accuracy of the stage. Accordingly, the shift in the horizontal direction and vertical direction of the probe 3 can be recognized and in respect to one beyond a specified region in the positional deviation of the probe at this time the impossibility of use of the probe can be informed an operator by a monitor, an alarm or the like. Thereby, a stable and high-quality probe card can be always used and a test for the stable and good probe can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a fully automatic wafer blow μ used for probe measurement of wafers.

[Summary of the Invention] The present invention utilizes the stage positioning accuracy of the blow μ in a fully automatic wafer blow μ used for probe measurement of wafers, and newly installs a probe needle contact pad integrated with the stage part. (It electrically detects whether or not the needle has contacted the contact pad of the person, and detects the position at that time using the mechanical precision of the stage. This makes it possible to recognize horizontal and vertical deviations of the probe needle. At this time, if the positional deviation is outside the specified range, it is possible to notify the operator that the probe card cannot be used using a monitor, alarm, etc. This allows stable, high-quality probe cards to be used at all times, and provides stable can provide a good probe test.

[Prior art] Conventionally, in fully automatic wafer blow μ, it has been possible to recognize and manage the probe stylus after contact between the probe stylus and the wafer by image processing. This was impossible, and it was also impossible to measure the contact resistance of the stylus. Therefore, there was an additional process to measure the contact position and contact resistance of the stylus, and the probe card was managed there.

[Problem to be solved by the invention]

With such conventional methods, it is impossible to detect the position of the probe needle contact portion, and therefore it is impossible to determine whether the probe card can be used, or whether it can be used within the usable range. Therefore, a process of controlling the position of the probe card needle contact portion and the contact resistance value was required.

The present invention aims to solve these conventional problems, provide a stable and high quality probe test, and shorten the process.

[Means for Solving the Problems] The present invention achieves the following by integrating with the stage of the blower.
It is characterized by having a contact pad for detecting the position of the probe needle contact part with positioning accuracy equivalent to that of the stage.

[Example] An embodiment of the present invention is shown in FIGS. 1, 2, and 3.

Contact pad 4 and stage 5 as shown in Figures 1 and 2.
are integrated with equal precision and contact pad 4
The material used is gold, which has low resistance and wear.The vertical position of the contact pad 4 is 1 point above the stage 5.
By increasing the height by 00 μm to 5000 μm6, it is possible to prevent the stage 5 from coming into contact with the probe needle 3, which is not the object of contact, and being damaged. Furthermore, as shown in FIG. 3, the contact pad 4 is divided into square and round contact pads 4, and by making it possible to detect contact in each divided portion, the horizontal direction of the probe needle 3 is It is also possible to detect deviations between the two. In addition, this detected data is analyzed by a computer owned by Blowbuff, and it is determined whether it is usable or not based on arbitrarily set limit values.If it is not possible, the operator is notified by monitors, alarms, etc. convey. Further, information on the amount of deviation of the probe needle 3 and the needle that is out of alignment can be provided to the operator.

4 Furthermore, as shown in Fig. 4, the contact resistance can be managed by detecting the contact between the probe needle 3 and the contact pad 4 in conjunction with the tester 8 and measuring the contact resistance using the measuring circuit 9 owned by the tester 8. becomes.

In the above embodiment, the contact pad 4 was provided outside the stage 2, but an example in which a vertically movable contact pad 4 is provided inside the stage 2 is shown in FIG. This method detects the position of the probe needle 3,
When performing resistance measurement, as shown in FIG. 5(a), the contact pad 4 is moved upward from the upper surface of the stage 2.
It protrudes by 100 μm to 5000 μm, and when measuring the wafer 5, it is moved downward from the surface of the stage 2 to avoid contact with the wafer 5, as shown in FIG. 5(b).

With this method, since it is inside stage 2, it is possible to obtain the same operating range as stage 2.
The range of operation is expanded.

Next, a method in which the stage 2 itself acts as the contact pad 4 is shown in FIG. In this method, when detecting the position of the contact part of the probe needle 3 and measuring the resistance, a contact part is provided at the center 5- part of the stage 2, and that part is connected to the probe needle, as shown in FIG. contact with 3,
Further, when measuring the wafer 5, the surface of the contact pad 4 is constructed to be slightly lower than the surface of the stage 2 so that it does not come into contact with the wafer 5.

In addition, the above method makes the positional relationship between the contact part of the probe needle 3 and the stage 2 clear, so by combining it with the function of a conventional blow buff, it is possible to provide the optimal contact position, and automatic setup of the blow buff without human intervention is possible. becomes.

[Effects of the Invention] According to the present invention, it is possible to detect the position of the probe needle contact portion and measure the contact resistance, and it is possible to select the most suitable probe card for the blower. As a result, high-quality probe tests can be provided, and furthermore, damage to the wafer, which is the object to be measured, can be reduced, and a management process for the probe needle contact area can be eliminated.

[Brief Description of the Drawings] Figure 1 is a side view showing the relationship between the stage, probe card, and newly designed contact pad. FIG. 2 is an enlarged view of section A in FIG. 1. FIGS. 3(a) and 3(b) are enlarged plan views of the contact pad. FIG. 4 is a block diagram when resistance measurement is performed in conjunction with a tester. FIGS. 5(a) and 5(b) are cross-sectional views of a type with built-in contact pad stage. FIGS. 6(a) and 6(b) are cross-sectional views of the contact pad and stage common type. 1... Probe card 2... Stage (for holding and positioning the wafer) 3... Probe needle 4... Contact pad 5... Stage 6... 100 μm to 5000 μm 7... Blow bar 8...・Tester 9...Measuring circuit 7-1\] Scissor

Claims (1)

[Claims] Utilizing the mechanical precision of the fully automatic wafer prober stage part, it has a contact pad that is integrated with the stage and can detect the position of the probe needle contact part, allowing the position of the probe needle to be managed and determining whether the probe card can be used. A fully automatic wafer prober with the following features: