JPH03209612A - Thin-film magnetic head - Google Patents

Abstract

PURPOSE:To facilitate the dealing with higher densities by forming a half number of thin-film elements on a piece of magnetic substrate apart a distance of 2 times the pitch to be finally obtd. and sticking two pieces of such substrates in such a manner that the thin-film elements face each other and do not overlap on each other. CONSTITUTION:The MR element forming parts and lead junctures at the surface for forming the thin film of the 1st magnetic substrate 1 having the high specific resistance like the high resistance of Ni-Zn ferrite are ground and lapped to 150 to 120 deg. angle theta. An insulator of Al2O3 or SiO2, etc. is sputtered as a 1st gap layer 2a on the substrate at 1,000 to 2,000Angstrom thickness and Ti is formed as a conductor 3 for biasing at about 1,500Angstrom by vacuum vapor deposition and is etched to a prescribed pattern. Au is deposited by evaporation on the lead parts 5 and is patterned; thereafter, the Al2O3, SiO2, etc., are formed as a 2nd gap 2b on the MR elements 4 at 5,000 to 8,000Angstrom . The thin-film elements of the two substrates 1, 6 are adhered by an adhesive agent 7 to the 2nd substrate 6 formed in the same manner. The magnetic tape traveling surface is subjected to cylindrical working and FPC 8 and the lead parts are joined by Au-Au bond, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a thin film magnetic head for simultaneously recording and reproducing multiple channels.

2. Description of the Related Art In recent years, as recording capacity has increased, magnetic recording devices for storing data have also become higher in capacity and density. Magnetic tape devices have the disadvantage that access time slows down in proportion to the increase in storage capacity. In order to suppress this, it is necessary to increase the tape speed and simultaneously record and reproduce multiple channels.

As a device that can record and play multiple channels simultaneously,
The device currently in practical use was developed by 18M Company #
3480 magnetic tape device.

This uses a thin film magnetic head with 18 channels.
It is capable of recording and reproducing at a speed of 2 m/sec.

Currently, a thin film magnetic head with 36 channels in 1/2 width is being researched with the aim of increasing capacity.

The biggest issue in the head is not how to form 36 channels with a width of 1/2 in the thin film forming process, but how to create a cable that connects to the thin film element. Figure 4 shows a conventional single magnetic substrate 1
1, MR elements (magnetoresistive elements) 12 are formed and are arranged in order from channel 1 (CHI). For example, as shown in FIG. Using an FPC (flexible printed circuit board) 14, a part of the lead of the FPC is exposed from the polyimide covering the lead, and directly connected to the thin film element by means such as gold-full pressure bonding, gold-tin bonding, solder bonding, etc. Conventionally, connection has been made by In a conventional 18-channel magnetic head, the lead line pitch was approximately 315 μm and the lead line width was 100 μm. When this ratio is applied to a 36-channel magnetic head, the lead line pitch is 158 μm and the lead line width is 50 μm.
m, which is at the limit of FPC production and has the disadvantage that the cost is also very high.

SUMMARY OF THE INVENTION An object of the present invention is to solve these problems and provide a magnetic head that is inexpensive and has a high density of channels.

Means for Solving the Problems In order to solve the above problems, the present invention does not form all channels on a single magnetic substrate, but divides the channels into odd-numbered channels and even-numbered channels, and forms them on different magnetic substrates. After forming half of all the channels and connecting them with an FPC, they are bonded together with an adhesive or the like to form a thin film magnetic head having a large number of channels.

Effect of the present invention By forming half of the desired number of channels on one magnetic substrate with the above-described configuration, the pitch of the lead wires can be reduced to half the required pitch when joining the lead wires of a thin film element and an FPC. This makes it possible to easily create an FPC, facilitate bonding, and manufacture a magnetic head having a high density of channels.

EXAMPLES The present invention will be explained in detail below with reference to examples shown in the drawings.

FIG. 1 shows an embodiment of a reproducing head of a thin film magnetic head according to the present invention. M of the surface on which the thin film is formed of the first magnetic substrate 1 having a high resistivity such as Ni-Zn ferrite
Grinding and lapping are performed so that the R element forming part and the lead connecting part form an angle θ of 150° to 170". Next, as shown in the lower half of FIG. 1
As the gap layer (2-a), At! 203 or 5
1000~20 by sputtering an insulator such as i02
The bias conductor 3 is formed to have a thickness of about 1,500 A using a vacuum evaporation method or the like. Furthermore, an MR element 4 of about 500 A is formed and etched by chemical etching, ion etching, etc. so as to form a predetermined pattern. Next, the lead part 5 as shown in FIG.
After forming gold by vapor deposition etc. and forming a pattern, MR
On the element 4, as the second gap (2-b), A[2
03 or 5i02 by sputtering etc. 5000~8
Formed to a thickness of 000A. At this time, the MR element 4 formed
The number of patterns is half of the predetermined number of patterns, and they are arranged every other channel. The insulating layer, such as Ae203 or 5i02, is removed from the part where no element is present by chemical etching or ion etching.

On the other hand, as shown in FIG. As the second gap layer (ib) as shown in the upper half of At!
An insulator such as 203 or 5i02 is formed to a thickness of 5000 to 8000 Å by sputtering or the like. Next, M.R.
After forming the element 4 to a thickness of about 500A, as the bias conductor 3, Ti is deposited with a thickness of 1000 to 2
The film is formed to a thickness of 0.000A, and etched by chemical etching, ion etching, etc. to form a predetermined pattern. Further, gold is formed on the lead 5 portion by vapor deposition, etc., and a first gap (2-a) is formed on the Ti.
i! 203 or 5i02 by sputtering etc.
Form to a thickness of 0 to 2000A. At this time, MR formed
Like the first magnetic substrate 1, the patterns of the element 4 are half of the predetermined number of patterns, but are arranged so that the channels are different. That is, the first magnetic substrate 1 is 1.3, 5.
7 etc., the second magnetic substrate 6 is formed in 2°4.6 etc. and an even channel (CH).
).

The two magnetic substrates 1 and 6 made in this way are
As shown in the figure, the thin film elements on the first magnetic substrate 1 and the thin film elements on the second magnetic substrate 6 are arranged alternately, that is, so that they do not overlap when they are bonded with their thin film element sides facing each other. After bonding with adhesive 7 and processing the magnetic tape running surface into a cylinder, cutting grooves at the end of the tape running surface and grooves for tape floating control, connect the FPC 8 and the lead part as shown in Figure 3. It is joined by gold-full bonding, soldering, etc., and combined with a recording head as a reproducing head.

On the other hand, like the above-described reproducing head, the recording head is also divided into two magnetic substrates to form thin film elements.

Effects of the Invention In the present invention, half of the thin film elements are formed on one magnetic substrate at a distance twice the pitch that will be finally obtained, and the two magnetic substrates are bonded together to connect to the FPC. The terminal pitch interval can be doubled, making it easier to support higher density, and the width of the lead wire drawn out from the thin film element can be widened, making it possible to create an excellent thin film magnetic head that has the effect of suppressing heat generation. It is.

[Brief explanation of drawings]

FIG. 1 is a perspective view of one of the magnetic substrates on which a thin film element is arranged according to an embodiment of the present invention, FIG. 2 is a sectional view of the bonded surface of two magnetic substrates viewed from the tape running surface, and FIG. A perspective view of the main parts of a completed product of a thin film magnetic head after two magnetic substrates are bonded together, FIG. 4 is a perspective view of a conventional magnetic substrate on which thin film elements are arranged, and FIG. 5 is a main part of a conventional thin film magnetic head. FIG. 1.6... Magnetic substrate, 4... Magnetoresistive element (thin film element), 7... Adhesive.

Claims (1)

[Claims] In a thin film magnetic head having a large number of thin film elements, half of the thin film elements are formed on one magnetic substrate at a distance twice the final pitch, and two of these magnetic substrates are A thin-film magnetic head in which the element sides face each other and the opposing thin-film elements are bonded together so that they do not overlap.