JPH0320902B2 - - Google Patents
Info
- Publication number
- JPH0320902B2 JPH0320902B2 JP58018799A JP1879983A JPH0320902B2 JP H0320902 B2 JPH0320902 B2 JP H0320902B2 JP 58018799 A JP58018799 A JP 58018799A JP 1879983 A JP1879983 A JP 1879983A JP H0320902 B2 JPH0320902 B2 JP H0320902B2
- Authority
- JP
- Japan
- Prior art keywords
- press
- spring
- spring guide
- hole
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58018799A JPS59145558A (ja) | 1983-02-09 | 1983-02-09 | 半導体整流装置用積層スタツク |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58018799A JPS59145558A (ja) | 1983-02-09 | 1983-02-09 | 半導体整流装置用積層スタツク |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59145558A JPS59145558A (ja) | 1984-08-21 |
JPH0320902B2 true JPH0320902B2 (enrdf_load_stackoverflow) | 1991-03-20 |
Family
ID=11981632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58018799A Granted JPS59145558A (ja) | 1983-02-09 | 1983-02-09 | 半導体整流装置用積層スタツク |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59145558A (enrdf_load_stackoverflow) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS512931A (ja) * | 1974-06-28 | 1976-01-12 | Hitachi Ltd | Seiryusochi |
JPS56108265U (enrdf_load_stackoverflow) * | 1980-01-21 | 1981-08-22 | ||
JPS5712748U (enrdf_load_stackoverflow) * | 1980-06-27 | 1982-01-22 | ||
JPS596851U (ja) * | 1982-07-05 | 1984-01-17 | 日本電気株式会社 | 平形半導体装置 |
-
1983
- 1983-02-09 JP JP58018799A patent/JPS59145558A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59145558A (ja) | 1984-08-21 |