JPH03206908A - Apparatus for inspecting lead of semiconductor device - Google Patents

Abstract

PURPOSE:To recognize the bend of a lead and missing in number of the leads highly accurately by providing a transparent supporting plate, first and second lighting devices and an image sensing device. CONSTITUTION:At first, leads 6 of a semiconductor device 1 are illuminated with a second lighting device 8 from the rear surface of the semiconductor device 1. The light is projected on a transparent supporting plate 2 through a lightguide tube 7 with a first lighting device 5 from the directly lateral side of the lightguide tube 7 of a supporting stage 4. The light inputted into the inside of the supporting plate 2 leaks through the side surface of the plate. The light is projected on the tip part of the lead 6 of the semiconductor 1. The lead is bent in a J shape. The lead 6 is illuminated with the two light beams of the two lighting devices 5 and 8, and the images of the lead are picked up with an image sensing device 9 based on the reflected light beams. In this way, the entire leads of the semiconductor devices 1 can be illuminated. The stable, clear images of the leads can be obtained with the image sensing device 9. The bends of the leads 6 and the missing in number of the leads can be recognized highly accurately based on the images.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead inspection device for inspecting lead bends in semiconductor devices.

BACKGROUND OF THE INVENTION In recent years, SOJ package type semiconductor devices in which lead tips are bent into a J shape have become mainstream.

Conventionally, when detecting lead bends in SOJ packaged semiconductor devices, an inspection device as shown in FIGS. 2 and 3 has been used.

A conventional lead inspection apparatus for semiconductor devices will be described below.

The conventional lead inspection equipment for semiconductor devices is as shown in the figure.
It is comprised of a support stand 12 for fixing the semiconductor device 11, an illumination device 13 for irradiating light onto the leads of the semiconductor device 11, and an imaging device 14 for taking a reflected image.

In the above configuration, first, the illumination device 13 illuminates the leads 15 of the semiconductor device 11 from below the back surface of the semiconductor device 11, and the imaging device 14 captures the reflected light as a lead image. Based on this captured image, bends in the leads 15 and missing leads were recognized.

Problems to be Solved by the Invention In such a conventional semiconductor device lead inspection device, the obtained lead image becomes darker as it approaches the tip of the lead, making it impossible to clearly capture the entire image of the lead. However, in some cases, there was a problem in that the evaluation could be incorrect.

The present invention has been made to solve the above-mentioned problems, and aims to provide a clear image of the entire lead so that bends in the lead or missing leads can be recognized with high precision.

Means for Solving the Problems In order to achieve the above objects, the present invention provides a transparent support plate for supporting an SOJ package type semiconductor device, a first illumination device that emits light from a side surface of the support plate, and the semiconductor device. A means for solving the problem is provided with a second illumination device that irradiates the semiconductor device, and an imaging device that captures a projected image of the semiconductor device.

Function The present invention provides means for solving the above-mentioned problems by guiding the light emitted from the first illumination device to the J-shaped lead tip, sufficiently sending reflected light from the lead to the imaging device, and producing a clear lead image. You will be able to obtain the following.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG. As shown in the figure, the bottom surface of the SOJ packaged semiconductor device 11 is supported by a transparent support plate 2 made of glass,
This support plate 2 is protected by a protection plate 13. The support plate 2 and the semiconductor device 11 are fixed to the support base 4. The first lighting device 5 is for irradiating light to the tip of the J-type REIT 6 of the semiconductor device 1.
The second illumination device 8 is arranged so as to irradiate light from the back side of the semiconductor device 1, and the second illumination device 8 is arranged to irradiate the light from the back side of the semiconductor device 1. The image is captured by an imaging device 9.

To explain the operation of the above configuration, first, the leads 6 of the semiconductor device 1 are irradiated by the second illumination device 8 from below the back surface of the semiconductor device 1 . Next, the support plate 2 is illuminated through the light pipe 7 by the first lighting device 5 from directly beside the light pipe 7 of the support base 4 . The light that has entered the support plate 2 leaks from its side surfaces and is irradiated onto the tip of the semiconductor device 1 that is bent into a J shape or the board 6 . As described above, as a result of illuminating the leads 6 of the semiconductor device 1 with the two illumination devices, the first illumination device 5 and the second illumination device 8, the imaging device 9 captures the reflected light as a lead image.

Based on this captured image, bends in the leads 6 and missing leads are recognized.

As described above, according to the semiconductor device lead inspection apparatus according to the embodiment of the present invention, the illumination by the second illumination device 8 and the light from the first illumination device 5 are passed through the transparent support plate 2 made of glass. By employing two lighting devices that irradiate the tips of the leads 6 with light leaking from the sides, the entire lead of the semiconductor device 1 can be illuminated, and a stable and clear lead image can be obtained by the imaging device 9. Based on this image, bends in the leads 6 and missing leads can be recognized with high precision.

Effects of the Invention As is clear from the above embodiments, according to the present invention, by supporting a semiconductor device with a transparent support plate and irradiating light from the side of the support plate, the light can be applied to the lead tips. As a result, a stable and clear lead image can be obtained, and an excellent semiconductor device lead inspection apparatus that can perform highly accurate image processing can be realized.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of a lead inspection device for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a perspective view of a conventional lead inspection device for a semiconductor device, and FIG. 3 is a cross section taken along the line XX in FIG. 2. It is a diagram. 1... Semiconductor device, 2... Support plate, 5
...First lighting device, 6... Lead,
8... Second illumination device, 9... Imaging device.

Claims (1)

[Claims] a transparent support plate that supports an SOJ package type semiconductor device; a first lighting device that emits light from a side surface of the support plate;
A semiconductor device lead inspection apparatus comprising: a second illumination device that illuminates the semiconductor device; and an imaging device that captures a projected image of the semiconductor device.